EP1S80F1508I7N

The EP1S80F1508I7N is a Stratix® Field Programmable Gate Array (FPGA) IC in a 1508-BBGA FCBGA package, designed for applications that require substantial programmable logic, embedded memory, and high I/O capacity. It provides 79,040 logic elements and approximately 7.43 Mbits of embedded memory, delivering the building blocks for complex digital designs.

Targeted for industrial environments, this device supports an operating temperature range of -40 °C to 100 °C and operates from a core supply of 1.425 V to 1.575 V, making it suitable for systems that demand robust thermal performance and extensive I/O connectivity (1,203 I/O pins) in a surface-mount package.

Key Features

• Core Logic: 79,040 logic elements provide significant programmable logic capacity for large-scale combinational and sequential designs.
• Embedded Memory: Approximately 7.43 Mbits of on-chip RAM to support data buffering, state storage, and algorithm implementation without relying exclusively on external memory.
• High I/O Count: 1,203 I/O pins enable dense external device interfacing and parallel connectivity for complex systems.
• Package and Mounting: 1508-BBGA (FCBGA) / 1508-FBGA (30×30) supplier package in a surface-mount form factor for board-level integration.
• Power Supply: Core voltage range of 1.425 V to 1.575 V for defined power design and supply sequencing.
• Industrial Temperature Grade: Specified to operate from -40 °C to 100 °C to meet industrial temperature requirements.
• Regulatory Compliance: RoHS compliant for lead-free manufacturing and environmental compliance.

Typical Applications

• Industrial Control Systems: Implement real-time control logic, motor control interfaces, and custom automation functions taking advantage of industrial temperature capability and high logic density.
• High-Density I/O Aggregation: Aggregate and route large numbers of signals for data acquisition, I/O expansion, or protocol bridging using 1,203 available I/O pins.
• Embedded Signal Processing: Use the combination of abundant logic elements and embedded RAM for custom DSP pipelines, buffering, and state machines in embedded systems.

Unique Advantages

• High Logic Capacity: 79,040 logic elements enable implementation of complex finite-state machines, custom accelerators, and extensive glue logic within a single device.
• Substantial On-Chip Memory: Approximately 7.43 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level BOM and routing.
• Extensive I/O Resources: 1,203 I/O pins support wide parallel interfaces, multi-channel data capture, and dense peripheral connections.
• Industrial Temperature Range: Rated for -40 °C to 100 °C to support deployment in harsh or industrial environments.
• Surface-Mount BBGA Package: 1508-BBGA (FCBGA) packaging provides a compact, manufacturable footprint for high-pin-count requirements.
• RoHS Compliant: Meets lead-free manufacturing requirements for environmentally conscious production.

Why Choose EP1S80F1508I7N?

The EP1S80F1508I7N combines a high count of logic elements, sizeable embedded memory, and an exceptional I/O complement in a compact surface-mount BBGA package, positioning it for demanding industrial and high-density programmable logic applications. Its defined core voltage range and wide operating temperature range make it suitable for designs that need predictable power behavior and robust thermal tolerance.

This device is a fit for engineering teams developing complex digital systems that require on-chip resources to minimize external components, simplify board layout, and provide scalable programmable functionality. Its combination of capacity, I/O, and industrial-grade specification supports long-term deployment and system-level integration.

Request a quote or submit an inquiry to evaluate EP1S80F1508I7N for your next design and to obtain availability and pricing information.