EP1S80F1508I7

The EP1S80F1508I7 is an industrial-grade Stratix FPGA in a 1508-BBGA (FCBGA) package designed for high-density, configurable logic and memory integration. Built on the Stratix device architecture, the device combines a large logic fabric, substantial embedded RAM, extensive I/O, and on-chip clocking resources to support complex digital processing and interfacing tasks.

Key hardware characteristics include 79,040 logic elements, approximately 7.4 Mbits of embedded memory, 1,203 I/O pins, a recommended core supply of 1.425 V to 1.575 V, and an operating temperature range of −40 °C to 100 °C. The device ships as a surface-mount 1508-BBGA and is RoHS compliant.

Key Features

• Core Logic  79,040 logic elements and 7,904 LABs provide a high-density programmable fabric for complex digital designs.
• Embedded Memory  Approximately 7.4 Mbits of on-chip RAM, including TriMatrix memory organization as described in the Stratix device handbook, for buffering, FIFOs, and state storage.
• I/O Capacity & Flexibility  1,203 I/O pins and multi-volt I/O support from the Stratix family enable broad interfacing options and multi-standard signaling.
• Clocking & Timing  Integrated PLLs and hierarchical clock networks provided by the Stratix architecture support multiple clock domains and timing configurations.
• DSP & Arithmetic Blocks  Dedicated multiplier and adder/output resources in the Stratix architecture accelerate arithmetic and DSP workloads.
• Package & Mounting  Surface-mount 1508-BBGA (supplier package: 1508-FBGA, FC 40×40) for compact, high-pin-count PCB implementations.
• Power & Thermal  Core voltage supply range of 1.425 V to 1.575 V and an industrial operating temperature range of −40 °C to 100 °C enable operation in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density signal processing  Use the large logic count and on-chip memory to implement complex packet processing, protocol engines, and real-time data planes.
• Multi‑interface bridging  Leverage 1,203 I/Os and Stratix I/O capabilities for protocol conversion, interface aggregation, and board-level glue logic.
• Memory‑intensive buffering  Approximately 7.4 Mbits of embedded RAM supports frame buffers, FIFOs, and temporary storage for streaming or bursty data flows.

Unique Advantages

• Highly integrated programmable fabric: High logic element count and embedded memory reduce external components and simplify system architecture.
• Extensive I/O resources: 1,203 I/Os provide the pin count necessary for dense board-level integration and multiple interface standards.
• Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in industrial environments.
• Flexible clocking and DSP support: On-chip PLLs and dedicated arithmetic blocks help implement timing-critical and compute-intensive functions without extensive external logic.
• Compact, manufacturable package: 1508-BBGA surface-mount package enables high-density PCB layouts while maintaining manufacturability.
• Regulatory readiness: RoHS compliance supports assembly and shipment in markets requiring lead-free components.

Why Choose EP1S80F1508I7?

The EP1S80F1508I7 targets designs that require large programmable logic capacity, substantial on-chip memory, and a high I/O count within an industrial temperature envelope. Its Stratix architecture elements—logic array blocks, TriMatrix memory, PLL-based clocking, and dedicated multiplier resources—make it suitable for system-level integration where configurable hardware acceleration and flexible interfacing are priorities.

For engineering teams building complex, high-density digital systems, the EP1S80F1508I7 offers a balance of logic capacity, embedded memory, and I/O scalability, together with the package and thermal characteristics needed for rugged applications.

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