EP1S80F1508C6N

The EP1S80F1508C6N is a Stratix® Field Programmable Gate Array (FPGA) in a 1508‑ball FCBGA package. It integrates 79,040 logic elements, approximately 7.43 Mbits of on‑chip RAM, and up to 1,203 I/Os to support highly parallel digital designs and dense I/O requirements.

Engineered for commercial applications, the device operates from a 1.425 V to 1.575 V core supply, mounts as a surface‑mount component, and is specified for an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity — 79,040 logic elements (cells) provide a large programmable fabric for complex combinational and sequential logic implementation.
• Embedded Memory — Approximately 7.43 Mbits of on‑chip RAM supports buffering, frame storage, and local data processing without external memory.
• High‑Density I/O — Up to 1,203 I/O pins enable dense external connectivity for interfaces, buses, and parallel peripherals.
• Package & Mounting — 1508‑BBGA / 1508‑FBGA, FC (40×40) package in a surface‑mount form factor for compact board integration.
• Power Supply — Core voltage range of 1.425 V to 1.575 V to match board power delivery and system requirements.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation suitable for standard commercial deployments.
• Compliance — RoHS compliant, supporting lead‑free assembly and regulatory needs for commercial products.
• Documented Stratix Architecture — The Stratix device handbook documents architecture elements such as logic array blocks, embedded memory modes, DSP block interface, PLLs and clock networks, advanced I/O structure, JTAG boundary‑scan, SignalTap II embedded logic analyzer, and configuration/testing features.

Typical Applications

• High‑Performance DSP & Signal Processing — Large logic capacity and on‑chip RAM enable implementation of parallel filters, FFTs, and DSP pipelines.
• Networking & Communications — Dense I/O and advanced I/O structures support high‑pin‑count interface routing and protocol handling.
• Video & Imaging Systems — Significant embedded memory and logic resources for frame buffering, pixel processing, and custom image pipelines.
• Prototyping & System Integration — Flexible Stratix architecture and documented configuration/testing features facilitate hardware prototyping and verification workflows.

Unique Advantages

• High integration: 79,040 logic elements and ~7.43 Mbits of embedded memory reduce reliance on external logic and RAM, simplifying board design.
• Extensive I/O capacity: 1,203 I/Os provide headroom for multi‑lane interfaces, wide parallel buses, and mixed signal domain connectivity.
• Compact packaging: 1508‑ball FCBGA package (40×40) delivers high gate density in a space‑efficient surface‑mount footprint.
• Design and debug support documented: Stratix family documentation covers PLLs, clock networks, JTAG, SignalTap II, and partial reconfiguration workflows for system bring‑up and in‑system debug.
• Commercial readiness: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance align with standard commercial manufacturing and deployment requirements.

Why Choose EP1S80F1508C6N?

The EP1S80F1508C6N positions itself as a highly integrated Stratix FPGA option for commercial designs that require significant logic density, substantial on‑chip memory, and extensive I/O. Its documented Stratix architecture and feature set support demanding digital processing, interface handling, and prototyping tasks.

This part is well suited to engineering teams building feature‑rich, board‑level systems that benefit from a large programmable fabric, rich on‑chip resources, and commercial‑grade operational parameters. The device’s package, power range, and documented architectural features provide a stable platform for scalable designs and system verification.

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