EP20K100ETC144-1N

The EP20K100ETC144-1N is an APEX-20KE family FPGA from Intel designed around a MultiCore architecture combining LUT-based logic, product-term logic and embedded memory blocks. It delivers a balanced mix of logic capacity, on-chip RAM and flexible I/O for embedded processing, memory-interface and I/O-intensive designs.

With 4,160 logic elements, approximately 53.2 kbits of embedded RAM, 92 user I/O pins and a 144-LQFP surface-mount package, this commercial-grade device targets applications that require moderate gate density with flexible clocking and interface capabilities.

Key Features

• Core architecture  MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for a mix of register‑intensive and memory‑oriented functions.
• Logic capacity  4,160 logic elements and up to 263,000 system gates provide capacity for mid-range programmable logic tasks and glue‑logic implementations.
• Embedded memory  Approximately 53,248 bits of on‑chip RAM (ESBs) suitable for FIFOs, dual‑port RAM and CAM-style functions.
• I/O and interfaces  92 user I/O pins with MultiVolt I/O support and programmable I/O features suitable for interfacing with a range of external peripherals and memory devices.
• Clocking and timing  Family-level support for flexible clock management including multiple PLLs, a low‑skew clock tree and multiple global clock signals to support synchronous designs.
• Power and supply  Internal and I/O supply support aligned with APEX‑20K family conventions; this device lists an operating voltage supply range of 1.71 V to 1.89 V.
• Package and mounting  144‑lead LQFP (surface mount); supplier device package listed as 144‑TQFP (20×20) for PCB footprint and assembly planning.
• Operating range and compliance  Commercial temperature grade with an operating range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Memory interface and buffering  Use the device’s embedded RAM and ESB-based FIFOs for DDR/SDRAM buffering and ZBT-like memory controller logic.
• Peripheral and bus bridging  Implement PCI/legacy bus bridging and peripheral glue logic leveraging flexible I/O levels and programmable I/O features.
• High‑speed serial and differential links  Support LVDS and other differential signaling standards for channelized data paths and high‑throughput links.
• Embedded control and glue logic  4,160 logic elements and product‑term resources suit microcontroller offload, protocol handling and board‑level control functions.

Unique Advantages

• Balanced logic and memory mix:  Combines 4,160 logic elements with about 53.2 kbits of embedded RAM to implement register‑heavy logic alongside on‑chip buffering and small memory structures.
• Flexible I/O capability:  92 user I/O pins with MultiVolt support enable direct interfacing to a range of external devices and memory types.
• Clock management features:  Family-level PLLs and low‑skew clock tree features simplify implementation of multi‑clock designs and timing-critical logic.
• Commercial temperature qualification:  Rated for 0 °C to 85 °C operation to meet standard commercial product requirements.
• Surface-mount packaging:  144‑lead LQFP package (144‑TQFP footprint reference) for compact PCB integration and automated assembly.
• RoHS compliant:  Meets RoHS environmental requirements for reduced hazardous substances.

Why Choose EP20K100ETC144-1N?

The EP20K100ETC144-1N positions itself as a mid‑range APEX‑20KE FPGA option that balances logic density, embedded RAM and flexible I/O in a compact 144‑lead LQFP package. It is appropriate for designers who require a programmable logic device with solid on‑chip memory, multiple I/O voltage options and mature family features such as MultiCore architecture and advanced clock management.

Backed by the APEX‑20K family documentation and Intel’s manufacturing pedigree, this part offers a documented path for embedded logic, memory interface and bus‑bridge applications where commercial temperature operation and RoHS compliance are required.

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