EP20K100EQC240-3
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 183 53248 4160 240-BFQFP |
|---|---|
| Quantity | 829 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 183 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 416 | Number of Logic Elements/Cells | 4160 | ||
| Number of Gates | 263000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248 |
Overview of EP20K100EQC240-3 – APEX-20KE Field Programmable Gate Array, 240-BFQFP
The EP20K100EQC240-3 is an Intel APEX-20KE family FPGA in a 240-BFQFP package designed for commercial embedded applications. It implements the MultiCore architecture combining look-up table (LUT) logic, product-term logic and embedded memory blocks (ESBs) to deliver a balanced mix of logic, I/O and on-chip RAM for mid-density designs.
With 4,160 logic elements, approximately 53,248 bits of embedded RAM, and 183 user I/Os, this device suits applications requiring logic density, flexible I/O interfacing and integrated clock management while operating within a 1.71 V to 1.89 V supply range and 0 °C to 85 °C commercial temperature range.
Key Features
- Core Architecture MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for register‑ and combinatorial‑intensive functions.
- Logic Resources 4,160 logic elements (LEs) and up to 263,000 system gates to implement mid-density programmable logic designs.
- Embedded Memory Approximately 53,248 bits of on-chip RAM provided by ESBs, suitable for FIFOs, dual-port RAM and CAM implementations.
- I/O Capability 183 user I/Os with MultiVolt I/O interface support and programmable I/O features for interfacing to a range of external devices; device can be made 5.0 V tolerant with an external resistor where supported by the family.
- Clock Management Series architecture includes flexible clocking with up to four PLLs, a low-skew clock tree and features for clock phase/delay control and reduced skew.
- Memory and Bus Support Family-level support for high-speed external memories (including DDR SDRAM and ZBT SRAM) and bus interfaces for system integration.
- Power and Package Low-voltage operation at 1.71 V to 1.89 V; commercial-grade device in a surface-mount 240-BFQFP package (supplier package: 240-PQFP, 32×32).
- Compliance and Handling RoHS compliant and specified for commercial operating temperatures (0 °C to 85 °C).
Typical Applications
- Embedded Systems FPGA-based control and glue logic for commercial embedded devices that require medium density logic and on-chip RAM.
- Memory Interfaces Implementing memory controllers, FIFOs and buffering for DDR or ZBT memory subsystems using the device’s ESBs and I/O capabilities.
- High-speed I/O Bridging Protocol bridging and I/O translation where multi‑voltage interfacing and numerous user I/Os are needed.
- Prototyping and Development Rapid hardware prototyping where 4,160 logic elements and substantial embedded RAM enable validation of mid-scale designs.
Unique Advantages
- Highly integrated MultiCore architecture: Combines LUTs, product-term logic and ESBs to implement both register‑intensive and combinatorial functions on a single device.
- Balanced resource set: 4,160 logic elements and approximately 53 Kbits of embedded RAM provide the right mix of logic and storage for mid-density applications.
- Flexible clocking: Multiple PLLs and low‑skew clock tree features simplify synchronous design and timing distribution across the device.
- Versatile I/O: 183 user I/Os and MultiVolt support enable direct interfacing to a wide range of peripheral voltages and bus standards.
- Commercial-ready packaging: Surface-mount 240-BFQFP (240-PQFP supplier package, 32×32) offers a compact footprint for space-conscious board designs.
- Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and procurement policies.
Why Choose EP20K100EQC240-3?
The EP20K100EQC240-3 provides a practical combination of logic density, embedded memory and flexible I/O in the APEX‑20KE family form factor. It is well suited to designers targeting commercial embedded systems, memory interface logic and mid-scale FPGA designs that require integrated clock management and on-chip RAM.
Backed by the APEX‑20K series architecture and Intel manufacturing, this device offers a predictable resource profile—4,160 logic elements, approximately 53,248 bits of RAM and 183 I/Os—making it straightforward to evaluate suitability and scale designs within the same product family.
Request a quote or submit a sales inquiry to receive pricing, availability and technical support information for the EP20K100EQC240-3.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018