EP20K100EQC240-3

The EP20K100EQC240-3 is an Intel APEX-20KE family FPGA in a 240-BFQFP package designed for commercial embedded applications. It implements the MultiCore architecture combining look-up table (LUT) logic, product-term logic and embedded memory blocks (ESBs) to deliver a balanced mix of logic, I/O and on-chip RAM for mid-density designs.

With 4,160 logic elements, approximately 53,248 bits of embedded RAM, and 183 user I/Os, this device suits applications requiring logic density, flexible I/O interfacing and integrated clock management while operating within a 1.71 V to 1.89 V supply range and 0 °C to 85 °C commercial temperature range.

Key Features

• Core Architecture  MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for register‑ and combinatorial‑intensive functions.
• Logic Resources  4,160 logic elements (LEs) and up to 263,000 system gates to implement mid-density programmable logic designs.
• Embedded Memory  Approximately 53,248 bits of on-chip RAM provided by ESBs, suitable for FIFOs, dual-port RAM and CAM implementations.
• I/O Capability  183 user I/Os with MultiVolt I/O interface support and programmable I/O features for interfacing to a range of external devices; device can be made 5.0 V tolerant with an external resistor where supported by the family.
• Clock Management  Series architecture includes flexible clocking with up to four PLLs, a low-skew clock tree and features for clock phase/delay control and reduced skew.
• Memory and Bus Support  Family-level support for high-speed external memories (including DDR SDRAM and ZBT SRAM) and bus interfaces for system integration.
• Power and Package  Low-voltage operation at 1.71 V to 1.89 V; commercial-grade device in a surface-mount 240-BFQFP package (supplier package: 240-PQFP, 32×32).
• Compliance and Handling  RoHS compliant and specified for commercial operating temperatures (0 °C to 85 °C).

Typical Applications

• Embedded Systems  FPGA-based control and glue logic for commercial embedded devices that require medium density logic and on-chip RAM.
• Memory Interfaces  Implementing memory controllers, FIFOs and buffering for DDR or ZBT memory subsystems using the device’s ESBs and I/O capabilities.
• High-speed I/O Bridging  Protocol bridging and I/O translation where multi‑voltage interfacing and numerous user I/Os are needed.
• Prototyping and Development  Rapid hardware prototyping where 4,160 logic elements and substantial embedded RAM enable validation of mid-scale designs.

Unique Advantages

• Highly integrated MultiCore architecture: Combines LUTs, product-term logic and ESBs to implement both register‑intensive and combinatorial functions on a single device.
• Balanced resource set: 4,160 logic elements and approximately 53 Kbits of embedded RAM provide the right mix of logic and storage for mid-density applications.
• Flexible clocking: Multiple PLLs and low‑skew clock tree features simplify synchronous design and timing distribution across the device.
• Versatile I/O: 183 user I/Os and MultiVolt support enable direct interfacing to a wide range of peripheral voltages and bus standards.
• Commercial-ready packaging: Surface-mount 240-BFQFP (240-PQFP supplier package, 32×32) offers a compact footprint for space-conscious board designs.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and procurement policies.

Why Choose EP20K100EQC240-3?

The EP20K100EQC240-3 provides a practical combination of logic density, embedded memory and flexible I/O in the APEX‑20KE family form factor. It is well suited to designers targeting commercial embedded systems, memory interface logic and mid-scale FPGA designs that require integrated clock management and on-chip RAM.

Backed by the APEX‑20K series architecture and Intel manufacturing, this device offers a predictable resource profile—4,160 logic elements, approximately 53,248 bits of RAM and 183 I/Os—making it straightforward to evaluate suitability and scale designs within the same product family.

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