EP20K100EQC240-1X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 183 53248 4160 240-BFQFP |
|---|---|
| Quantity | 223 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 183 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 416 | Number of Logic Elements/Cells | 4160 | ||
| Number of Gates | 263000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248 |
Overview of EP20K100EQC240-1X – APEX-20KE FPGA, 240-BFQFP
The EP20K100EQC240-1X is an APEX-20KE field programmable gate array (FPGA) IC from Intel, built on the APEX 20K programmable logic device family. It combines lookup-table (LUT) logic, product-term logic and embedded system blocks (ESBs) to enable system-on-a-programmable-chip (SOPC) style integration for commercial electronic designs.
With a balance of logic capacity, embedded memory, and a generous I/O count, this device targets commercial applications that require mid-range programmable logic density, flexible I/O, and low-voltage operation.
Key Features
- Core architecture MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks (ESB) for mixed register- and memory-centric functions.
- Logic capacity Approximately 4,160 logic elements (LEs) supporting a maximum of 263,000 system gates for moderate-density programmable designs.
- Embedded memory Approximately 53,248 bits (~53 Kbits) of on-chip RAM for FIFOs, dual-port RAM and other memory functions implemented in ESBs.
- I/O resources 183 user I/O pins to support a wide range of peripheral and interface connectivity requirements.
- Clock management Flexible clocking with low-skew clock tree and support for multiple PLLs and up to eight global clocks for controlled timing distribution.
- Power Designed for low-power operation with a core supply voltage range of 1.71 V to 1.89 V.
- Package and mounting Surface-mount 240-BFQFP package (supplier device package: 240-PQFP, 32×32) for compact PCB integration.
- Commercial temperature grade Rated for operation from 0 °C to 85 °C for mainstream commercial environments.
- Family-level system features Series capabilities include support for multi-volt I/O interfaces, advanced interconnect (FastTrack) and programmable ESB-based product-term logic.
Typical Applications
- Communications & networking Use for protocol bridging, packet processing or peripheral interfacing where moderate FPGA logic and flexible I/O are required.
- Memory interface and buffering On-chip ESB RAM and product-term logic make the device suitable for FIFO buffering and interfacing to external SDRAM or SRAM in commercial systems.
- Embedded systems & SOPC integration Deploy as a configurable system component to implement custom control logic, state machines and peripheral aggregation.
- Prototyping & custom logic Well-suited for designers evaluating mid-density programmable solutions for feature validation and production designs in commercial products.
Unique Advantages
- Balanced logic and memory Combines roughly 4,160 logic elements with about 53 Kbits of embedded RAM to implement mixed logic-and-memory functions without external components.
- Generous I/O 183 I/O pins provide flexibility for interfacing multiple peripherals or parallel busses without extensive routing compromises.
- Low-voltage core operation 1.71–1.89 V supply minimizes power draw and aligns with low-voltage system designs.
- Commercial-ready thermal range 0 °C to 85 °C rating targets mainstream electronics and consumer applications.
- Compact surface-mount package 240-BFQFP surface-mount footprint simplifies board placement and assembly for space-constrained designs.
- Family-level system features APEX 20K family capabilities—such as MultiCore architecture, ESBs and advanced clocking—support integration of complex functions on-chip.
Why Choose EP20K100EQC240-1X?
The EP20K100EQC240-1X positions itself as a mid-density APEX-20KE FPGA option for commercial product designs that need a pragmatic combination of logic, embedded memory, and flexible I/O in a compact package. Its MultiCore architecture and ESB resources enable designers to implement register-heavy and memory-centric functions within a single programmable device.
This device is appropriate for engineers and OEMs developing commercial electronic systems who require a dependable, mid-range FPGA with low-voltage core operation, solid I/O capacity and on-chip RAM to reduce external component count and simplify system design.
Request a quote or submit a pricing inquiry for EP20K100EQC240-1X to get availability and commercial pricing information.

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