EP20K100EQC240-1

IC FPGA 183 I/O 240QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 183 53248 4160 240-BFQFP

Quantity 1,328 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O183Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EQC240-1 – APEX-20KE® Field Programmable Gate Array (FPGA)

The EP20K100EQC240-1 is a commercial-grade APEX-20KE® family FPGA packaged in a 240‑BFQFP (240‑PQFP 32×32) surface-mount package. It delivers a balanced combination of logic capacity, embedded memory, and I/O density for system-on-chip integration and mid-range programmable logic designs.

Built on the APEX 20K architecture, the device integrates MultiCore™ elements — lookup-table (LUT) logic, product-term logic and embedded system blocks (ESBs) — to support register-intensive logic, memory functions and combinatorial functions in a single programmable device.

Key Features

  • Core Logic — Approximately 4,160 logic elements providing up to 263,000 system gates for implementing complex custom logic functions.
  • Embedded Memory — Approximately 53,248 bits of on-chip RAM available in ESBs for implementing FIFOs, dual-port RAM, and CAM functions without reducing logic availability.
  • I/O Density — 183 user I/O pins to support broad peripheral and memory interfacing needs in a single package.
  • MultiCore Architecture — Integrates LUT logic, product-term logic and embedded memory (ESB) to optimize register‑intensive and combinatorial implementations.
  • Clocking — Family-level clock features include up to four PLLs, a low-skew clock tree and multiple global clocks for flexible clock management and reduced skew.
  • High-speed Interfaces (Series Capability) — APEX 20K family supports high-speed external memories and advanced I/O standards (as a series feature), enabling designs that require DDR SDRAM or LVDS-style interfaces.
  • Power — Designed for low-power operation; device-level supply range is specified at 1.71 V to 1.89 V for this part number, and ESBs include programmable power-saving modes at the family level.
  • Package & Mounting — 240‑BFQFP surface-mount package (240‑PQFP, 32×32) suitable for compact board layouts.
  • Operating Conditions — Commercial temperature range: 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Memory Interface Controllers — Use embedded RAM and ESB features to implement DDR SDRAM or dual-port buffer logic and FIFO management for memory-heavy designs.
  • High‑Speed I/O Subsystems — 183 I/Os and APEX family I/O support enable implementation of LVDS-style channels, PCI interface logic and other high-throughput interfaces.
  • System Integration & SOC Functions — MultiCore architecture and on-chip ESBs simplify integration of register‑intensive functions, custom peripheral glue logic, and embedded memories.
  • Custom Logic and Control — Ideal for mid-range programmable logic tasks such as protocol bridging, bus interfacing, and control-plane logic with clear power and thermal boundaries.

Unique Advantages

  • Balanced Logic and Memory Capacity: 4,160 logic elements paired with approximately 53 kbits of embedded RAM enable a wide range of mid‑scale designs without external memory overhead.
  • Flexible Clocking: Multiple PLLs and a low‑skew clock network provide deterministic clock management for synchronous systems.
  • High I/O Count in Compact Package: 183 user I/Os in a 240‑BFQFP package reduce PCB routing complexity for dense peripheral and memory interfaces.
  • Surface-Mount Packaging: 240‑PQFP (32×32) surface-mount form factor supports compact board designs and standard assembly processes.
  • Commercial Temperature and RoHS Compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance simplify integration into mainstream electronic products.

Why Choose EP20K100EQC240-1?

The EP20K100EQC240-1 places APEX‑20KE family capabilities into a commercial-grade, surface‑mount FPGA optimized for mid-range logic and embedded memory requirements. Its MultiCore architecture and ESB-based memory functions let you consolidate FIFOs, dual-port RAM and combinatorial logic into a single device, simplifying board design and reducing BOM complexity.

This part is well suited to designers needing a reliable, mid-density FPGA with substantial I/O, a compact 240‑BFQFP package, and explicit supply and temperature specifications for commercial applications. The combination of logic elements, embedded RAM and flexible clocking makes it a practical choice for memory interface controllers, I/O-intensive subsystems, and system integration tasks.

Request a quote or submit a quote today to check pricing and availability for the EP20K100EQC240-1 FPGA and to discuss how it fits into your next design.

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