EP20K100EQC208-2XN
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 151 53248 4160 208-BFQFP |
|---|---|
| Quantity | 1,895 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 416 | Number of Logic Elements/Cells | 4160 | ||
| Number of Gates | 263000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248 |
Overview of EP20K100EQC208-2XN – APEX-20KE Field Programmable Gate Array (FPGA)
The EP20K100EQC208-2XN is an APEX-20KE family FPGA IC from Intel designed for mid-density, I/O-rich programmable logic applications. It integrates 4,160 logic elements with approximately 53,248 bits of embedded RAM and 151 user I/O pins in a 208‑BFQFP surface-mount package.
Built for commercial-grade embedded designs, this device targets applications that require a balance of logic capacity, on-chip memory, and flexible I/O while operating within a 1.71 V to 1.89 V supply range and a 0 °C to 85 °C temperature window.
Key Features
- Core Logic — 4,160 logic elements (LEs) delivering up to 263,000 system gates suitable for register‑intensive and combinatorial logic functions.
- On‑Chip Memory — Approximately 53,248 bits of embedded RAM to implement FIFOs, dual‑port RAM, or small buffers without external memory.
- I/O Density & Performance — 151 user I/O pins enabling dense peripheral connectivity and high pin availability for mixed-signal front-ends.
- Clocking & Timing — APEX 20K family clock-management capabilities such as multiple PLLs, low-skew clock tree, and programmable phase/shift features (family-level).
- Package & Mounting — 208‑BFQFP (28 × 28 mm) surface-mount package for reliable board-level assembly in compact form factors.
- Power & Temperature — Operates from a 1.71 V to 1.89 V supply and specified for commercial temperature range (0 °C to 85 °C).
- RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- Embedded Control — Implement control logic, state machines, and glue logic where on‑chip RAM and moderate logic density simplify designs.
- High‑I/O Interfaces — Drive multi‑signal front‑ends and protocol adapters that need numerous general-purpose I/Os and flexible timing control.
- Memory Buffering — Use embedded RAM for small FIFOs, buffering, or dual‑port RAM functions to reduce external memory requirements.
- Prototyping & Evaluation — Rapid hardware proof‑of‑concepts and algorithm validation leveraging reprogrammability and integrated resources.
Unique Advantages
- Balanced Logic and Memory: The combination of 4,160 logic elements and ~53,248 bits of embedded RAM provides a compact, integrated solution for mixed logic/memory designs, reducing BOM complexity.
- High I/O Count: 151 user I/O pins give designers flexibility to connect a wide range of peripherals and interfaces without external multiplexing.
- Commercial‑Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliant, suitable for mainstream electronic products and systems.
- Surface‑Mount Packaging: The 208‑BFQFP package supports standard PCB assembly processes and enables space-efficient layout.
- Family Architecture Benefits: As a member of the APEX 20K family, it benefits from family-level features such as MultiCore architecture and advanced clock management (series-level).
Why Choose EP20K100EQC208-2XN?
The EP20K100EQC208-2XN offers a pragmatic mid-density FPGA option for designers who need a compact, reprogrammable device with a solid mix of logic, embedded RAM, and I/O. Its specification set—including 4,160 logic elements, approximately 53,248 bits of on‑chip RAM, and 151 I/Os—fits applications that require moderate combinatorial and register resources while minimizing external components.
As a commercial-grade, RoHS‑compliant APEX‑20KE device in a 208‑BFQFP package, it provides a dependable platform for commercial embedded systems, interface bridging, and prototyping projects where proven family-level FPGA features and a focused resource footprint are valued.
Request a quote or submit an inquiry to receive pricing and availability for the EP20K100EQC208-2XN.

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