EP20K100EQC208-1X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 151 53248 4160 208-BFQFP |
|---|---|
| Quantity | 1,695 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 416 | Number of Logic Elements/Cells | 4160 | ||
| Number of Gates | 263000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248 |
Overview of EP20K100EQC208-1X – APEX-20KE® Field Programmable Gate Array (FPGA), 4,160 logic elements, 53,248-bit RAM, 151 I/Os
The EP20K100EQC208-1X is a commercial-grade APEX-20KE family FPGA from Intel offering mid-range programmable logic density and embedded memory for system integration tasks. Built on the APEX 20K architecture, the device combines look-up table (LUT) logic with embedded system blocks (ESBs) to support register-intensive and memory-oriented functions.
Targeted at commercial embedded and interface applications, this surface-mount FPGA delivers 4,160 logic elements, approximately 53,248 bits of on-chip RAM, and 151 user I/Os in a 208-BFQFP package, providing a balance of integration, I/O capability, and design flexibility.
Key Features
- Core architecture (APEX 20K family) MultiCore architecture integrating LUT logic, product-term logic, and embedded memory for a mix of register-intensive and combinatorial functions.
- Logic density 4,160 logic elements (LEs) and up to 263,000 system gates enable mid-range programmable logic integration for complex control and glue-logic tasks.
- Embedded memory Approximately 53,248 bits of on-chip RAM (ESBs) suitable for FIFOs, dual-port RAM, and other memory functions.
- I/O and interface capability 151 user I/O pins support broad peripheral interfacing; the APEX 20K family provides flexible I/O features for common bus and memory interfaces.
- Clock management Family-level clock resources include flexible clock-management features (PLLs and global clocks) to support synchronous designs.
- Package and mounting 208-BFQFP (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for compact board integration.
- Power and supply Specified supply range: 1.71 V to 1.89 V, enabling integration into low-voltage systems.
- Commercial temperature grade Operating temperature 0 °C to 85 °C for commercial applications.
- Environmental compliance RoHS compliant.
Typical Applications
- Embedded control and logic consolidation Replace multiple discrete logic devices or glue logic by implementing control, state machines, and peripheral interfaces inside the FPGA.
- Interface bridging and protocol adaptation Use the device’s plentiful I/Os and programmable logic to implement bus bridges, level translation front-ends, and custom protocol adapters.
- Memory buffering and small FIFO engines Leverage the ESB embedded memory to implement FIFOs and small dual-port RAM blocks for buffering and handoff between subsystems.
- Prototyping and system validation Mid-density logic and flexible clocking make this part suitable for hardware prototyping and validating system-level logic before scaling.
Unique Advantages
- Programmable system integration: MultiCore APEX architecture combines LUT logic and embedded memory to consolidate functions and reduce external components.
- Balanced capacity: 4,160 logic elements with ~53,248 bits of RAM provide a practical trade-off of logic and memory for many mid-range designs.
- Flexible I/O count: 151 user I/Os accommodate multiple peripherals and interfaces without immediate need for external I/O expanders.
- Compact, surface-mount package: 208-BFQFP (28×28 PQFP footprint) simplifies PCB integration in space-constrained commercial products.
- Commercial operating range: Rated 0 °C to 85 °C to meet typical commercial equipment environment requirements.
- Regulatory readiness: RoHS compliance supports lead-free manufacturing processes.
Why Choose EP20K100EQC208-1X?
The EP20K100EQC208-1X positions itself as a mid-density FPGA option for designers needing a versatile balance of logic, embedded memory, and I/O in a compact, surface-mount package. It is well suited for commercial embedded systems, interface bridging, memory buffering, and prototyping projects where integration and flexibility matter.
Backed by the APEX-20K family architecture, this device provides a programmable platform that scales with design complexity while offering on-chip memory and flexible clocking resources to accelerate system-level implementation and reduce bill-of-materials.
Request a quote or submit your requirements to get pricing and availability for EP20K100EQC208-1X. Our team will provide the information you need to move your design forward.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018