EP20K100EFI324-2X

The EP20K100EFI324-2X is an APEX-20KE family FPGA offering a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory. Built for industrial applications, the device provides a compact 324-BGA package with 246 user I/O and on-chip memory to support complex system integration and I/O-intensive designs.

With 4,160 logic elements, up to 263,000 system gates and approximately 0.053 Mbits (53,248 bits) of embedded RAM, this FPGA targets applications requiring a balance of logic density, embedded memory and flexible I/O at an industrial temperature range.

Key Features

• Core Architecture MultiCore architecture integrating LUT logic, product-term logic and embedded memory to support register-intensive and combinatorial functions.
• Logic Capacity 4,160 logic elements and a maximum system gate count of 263,000 for medium-density programmable logic designs.
• Embedded Memory Approximately 0.053 Mbits of on-chip RAM (53,248 bits) suitable for FIFOs, dual-port RAM and content-addressable memory implementations.
• I/O and Interface Support 246 user I/O pins with MultiVolt I/O interface support and programmable clamp and slew-rate control to interface with a range of external devices.
• Clock Management Flexible clock resources including multiple PLLs and a built-in low-skew clock tree for reliable timing and clock distribution.
• Power and Supply Internal voltage support specified for operation with supply in the 1.71 V to 1.89 V range to match system power requirements.
• Package and Mounting 324-ball BGA (324-FBGA, 19×19) surface-mount package for compact board-level integration.
• Industrial Temperature Rated for operation from –40°C to 100°C, suitable for industrial environments.
• Compliance RoHS-compliant construction for regulatory alignment in lead-free assemblies.

Typical Applications

• Memory Interface Controllers Implement DDR and other high-speed external memory interfaces using the device’s embedded RAM and robust I/O support.
• High-Speed I/O Middleware Use the 246 I/O pins and MultiVolt I/O capability to bridge between differing logic levels and peripheral standards.
• Embedded System Integration Leverage LUTs and embedded system blocks to build compact SOPC-style subsystems such as FIFOs, dual-port memories and CAMs.

Unique Advantages

• Integrated MultiCore Design: Combines LUT logic, product-term logic and embedded memory to reduce external component count and simplify system architecture.
• Balanced Logic and Memory: 4,160 logic elements paired with 53,248 bits of embedded RAM provide a good mix of resources for mid-range FPGA designs.
• Flexible I/O Connectivity: 246 user I/O with programmable clamp and slew-rate control enables reliable interfacing with a variety of voltage domains and external devices.
• Industrial-Grade Operation: Specified operation from –40°C to 100°C supports deployment in industrial temperature environments.
• Compact Board Footprint: 324-FBGA (19×19) package enables high-density PCB placement while maintaining a large I/O count.
• RoHS Compliant: Lead-free design supports modern environmental and manufacturing requirements.

Why Choose EP20K100EFI324-2X?

The EP20K100EFI324-2X positions itself as a mid-density, industrial-grade FPGA that pairs a MultiCore programmable logic architecture with embedded system blocks and flexible I/O. Its combination of 4,160 logic elements, approximately 53,248 bits of on-chip RAM and 246 user I/O make it suitable for designs that require embedded memory functions, I/O bridging and deterministic clocking in a compact BGA package.

This device is a fit for engineers and procurement teams seeking a RoHS-compliant FPGA with industrial temperature capability and a proven architectural feature set for integrated memory and logic tasks. It offers a balance of integration and I/O density for scalable system designs.

Request a quote or submit an inquiry to receive pricing and availability for EP20K100EFI324-2X for your next design.