EP20K100EFC324-3N

The EP20K100EFC324-3N is a commercial-grade APEX-20KE® field programmable gate array (FPGA) in a 324-BGA package optimized for system integration and high-speed I/O designs. It implements the APEX 20K MultiCore architecture, combining LUT-based logic, product-term logic and embedded memory to deliver a flexible programmable fabric for control, interface and memory-intensive functions.

This device targets applications requiring a balance of logic capacity, embedded RAM and dense I/O in a surface-mount BGA footprint, backed by low-power design options and RoHS compliance.

Key Features

• Core Logic  4,160 logic elements (LEs) and approximately 263,000 maximum system gates provide mid-range programmable logic capacity for control, glue-logic and algorithm implementation.
• Embedded Memory  Approximately 53 Kbits of on-chip RAM for FIFOs, small buffers and local storage to support data-path and control applications.
• I/O Density  246 user I/O pins support dense external interfacing in a compact 324-BGA (19×19) package for board-level integration.
• Package & Mounting  324-ball FBGA (surface-mount) package (324-BGA) suitable for compact PCB designs requiring high pin-count routing.
• Supply & Temperature  Specified supply range 1.71 V to 1.89 V and commercial operating temperature range 0 °C to 85 °C for typical electronic product environments.
• Low-Power Design  APEX 20K family architecture includes features designed for reduced power operation; device-level power-saving modes are supported by the embedded system block.
• Clock Management (Series Feature)  APEX 20K devices offer flexible clocking including multiple PLLs, a built-in low-skew clock tree and programmable clock phase/delay capabilities to simplify synchronous design (series-level capability).
• High-Speed I/O Support (Series Feature)  The APEX 20K family supports advanced I/O standards and high-speed memory interfaces, enabling designs that require DDR SDRAM, high-speed serial channels and differential signaling (series-level capability).
• Standards & Compliance  RoHS-compliant construction for environmental conformity in commercial electronic products.

Typical Applications

• Interface Bridging  Use the device to implement protocol converters and bus bridges where dense I/O and embedded memory simplify board-level logic and buffering.
• High-Speed Memory Controllers  Implement small DDR/ZBT interface logic and FIFO buffering using integrated RAM and dedicated clocking features (leveraging the APEX 20K series memory and clock capabilities).
• Communication & Networking  Suitable for packet processing, line-side interface logic and LVDS-enabled channels where moderate logic density and many I/O are required.
• Embedded System Integration  Implement glue logic, peripheral control and custom accelerators that benefit from on-chip RAM and LUT-based logic in a compact BGA package.

Unique Advantages

• Balanced Logic and Memory:  4,160 logic elements paired with ~53 Kbits of embedded RAM let you implement control logic and local buffers without external memory in many designs.
• High I/O Count in Compact Package:  246 user I/O pins in a 324-BGA (19×19) footprint reduce board area while preserving routing flexibility for complex interfaces.
• Commercial-Grade Reliability:  Specified for 0 °C to 85 °C operation and RoHS-compliant construction, suitable for mainstream electronic product deployments.
• Series-Level System Features:  APEX 20K family clocking and I/O capabilities (multi-PLL, low-skew clock tree, support for high-speed memory and advanced I/O standards) provide design scalability and integration options.
• Surface-Mount BGA Integration:  324-ball FBGA eases high-density PCB integration and supports automated assembly processes for production volumes.

Why Choose EP20K100EFC324-3N?

The EP20K100EFC324-3N positions itself as a mid-range programmable logic solution that combines a practical logic element count, meaningful on-chip RAM and a high I/O count in a compact 324-BGA package. Its APEX-20KE family architecture provides designers with flexible clock management and advanced I/O capabilities at the series level, making it a good fit for systems requiring memory interfaces, protocol bridging and dense peripheral connectivity.

This commercial-grade FPGA is suited for engineering teams building embedded products and communication interfaces that need a balance of integration, board-level density and proven programmable logic features with RoHS compliance.

If you would like pricing, availability or a formal quote for EP20K100EFC324-3N, submit a request for a quote or product availability inquiry today.