EP20K100EFC324-2

The EP20K100EFC324-2 is an Intel APEX-20KE family FPGA offered in a 324‑ball BGA package. It implements the APEX MultiCore architecture with look-up table (LUT) logic and embedded memory blocks, targeting medium-density programmable logic applications.

With 4,160 logic elements, 53,248 bits of on-chip RAM, and 246 I/O pins in a surface-mount 324‑FBGA (19×19) package, this device is suited for designs that require integrated logic, embedded memory, and flexible I/O in a commercial‑grade temperature range.

Key Features

• Core Architecture APEX MultiCore architecture combining LUT-based logic and product-term logic for register- and combinatorial‑intensive functions.
• Logic Resources 4,160 logic elements and up to 263,000 system gates capacity for medium-density programmable designs.
• Embedded Memory 53,248 total RAM bits of embedded memory suitable for FIFOs, dual-port RAM and other on-chip storage needs.
• I/O and Interfaces 246 user I/O pins with MultiVolt I/O support and programmable I/O features to interface with a variety of external standards and memory types.
• Clocking and Timing Flexible clock-management features described for the APEX 20K family, including multiple PLLs and a built-in low‑skew clock tree for predictable timing.
• Power Narrow device supply operating range specified at 1.71 V to 1.89 V for the internal core supply.
• Package and Mounting 324‑FBGA (19×19) surface-mount package optimized for dense board integration.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C and specified as commercial grade.
• Environmental Compliance RoHS‑compliant manufacturing.

Typical Applications

• Communications and Networking Medium-density packet processing, protocol bridging, and I/O aggregation where integrated logic and embedded RAM reduce external component count.
• Consumer and Industrial Electronics (Commercial Grade) Feature control, display interfacing, and local processing functions in products that operate within commercial temperature limits.
• Test & Measurement Custom signal conditioning, data buffering, and timing logic implemented using on-chip RAM and the LUT-based logic fabric.
• Prototyping and System Integration Board-level prototyping where a compact 324‑BGA package and broad I/O support enable rapid integration of system logic and peripherals.

Unique Advantages

• Balanced Medium‑Density Resource Set: 4,160 logic elements with approximately 53 kbits of embedded RAM provide a compact balance of logic and memory for many system functions.
• High I/O Count in a Compact Package: 246 user I/Os in a 324‑FBGA (19×19) package enables rich external interfacing while minimizing PCB footprint.
• Commercial‑Grade Deployment: Designed for 0 °C to 85 °C operation to match commercial product lifecycles and environments.
• Integrated Clock and Timing Features: APEX family clock-management capabilities (multiple PLLs and low‑skew clock distribution) support synchronous designs requiring predictable timing.
• RoHS Compliance: Environmentally compliant manufacturing facilitates regulatory alignment for commercial products.
• Surface‑Mount, Board‑Level Friendly: 324‑BGA surface-mount package simplifies placement on dense PCBs and modern assembly flows.

Why Choose EP20K100EFC324-2?

The EP20K100EFC324-2 delivers a practical combination of logic density, embedded memory, and I/O capability within the APEX‑20KE family architecture. It is positioned for designers who need a medium-density FPGA with built-in memory and flexible I/O in a compact 324‑FBGA footprint.

Its commercial temperature rating, RoHS compliance, and clear resource profile (4,160 logic elements, 53,248 RAM bits, 246 I/Os) make it suitable for a wide range of commercial electronic applications, prototyping, and board-level integration where integrated logic and predictable clocking are required.

Request a quote to check current pricing and availability for the EP20K100EFC324-2 or submit an inquiry for volume and lead‑time information.