EP20K100EFC324-1

IC FPGA 246 I/O 324FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 324-BGA

Quantity 589 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O246Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EFC324-1 – APEX-20KE® FPGA, 324‑BGA

The EP20K100EFC324-1 is an APEX-20KE family field programmable gate array (FPGA) from Intel, offered in a 324‑ball BGA (324‑FBGA, 19×19) surface-mount package. It combines a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) to address logic-intensive and memory-intensive on‑chip functions.

With 4,160 logic elements, approximately 53,248 bits of embedded memory, and 246 user I/O pins, this device suits commercial designs requiring on‑chip FIFOs, dual-port RAM, CAM-style memory, flexible I/O and programmable clock management.

Key Features

  • Core architecture  MultiCore architecture integrating LUT logic, product-term logic and embedded system blocks (ESBs) for register‑ and combinatorial‑intensive functions.
  • Logic capacity  4,160 logic elements and approximately 263,000 system gates, supporting complex combinational and sequential logic implementations.
  • Embedded memory  Approximately 53,248 bits of on‑chip RAM implemented via ESBs, usable for FIFOs, dual‑port RAM and CAM functions.
  • I/O and interface flexibility  246 user I/O pins with MultiVolt I/O interface support and programmable I/O features for integration with a range of external devices and signaling levels.
  • Clock management  Built‑in clock resources including multiple PLLs, low‑skew clock tree and features for phase/shift and clock multiplication/division to support synchronized designs.
  • Package and mounting  324‑BGA (324‑FBGA, 19×19) surface mount package suitable for compact board layouts.
  • Power and supply  Internal supply specified across 1.71 V to 1.89 V, enabling designs centered on the device’s 1.8 V core domain.
  • Commercial operating range and compliance  Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

  • High‑performance embedded systems  Use on‑chip ESBs and LUT logic to implement memory buffers, control logic and custom accelerators within commercial embedded platforms.
  • Memory interface and buffering  Implement DDR SDRAM or ZBT SRAM interface logic and FIFO buffering using the device’s embedded memory and I/O bandwidth.
  • Peripheral and bus bridging  Implement PCI/legacy bus bridging and custom peripheral controllers leveraging flexible I/O and programmable clocking.
  • Data acquisition and interface logic  Deploy LVDS or other high‑speed I/O signaling with programmable output control and dedicated clock resources for deterministic timing.

Unique Advantages

  • Highly integrated architecture: MultiCore design with LUTs and ESBs reduces the need for external memory and discrete glue logic.
  • Balanced logic and memory: 4,160 logic elements paired with approximately 53,248 bits of embedded RAM support mixed logic/memory functions on a single device.
  • Flexible I/O strategy: 246 user I/Os and MultiVolt support enable interfaces across common system voltage domains without excessive external translation.
  • Robust clocking features: On‑chip PLLs and low‑skew clock distribution simplify multi‑clock designs and timing closure.
  • Compact packaging: 324‑FBGA (19×19) footprint allows high channel density in space‑constrained commercial boards.
  • Regulatory and environmental readiness: RoHS compliance provides assurance for lead‑free manufacturing processes.

Why Choose EP20K100EFC324-1?

The EP20K100EFC324-1 positions itself as a commercially graded, mid‑density FPGA that combines a MultiCore logic architecture, dedicated embedded memory blocks and a comprehensive I/O feature set in a compact 324‑BGA package. Its combination of 4,160 logic elements, approximately 53 kb of embedded RAM and 246 I/Os makes it suitable for commercial applications that require on‑chip buffering, moderate logic density and flexible interfacing.

Designers seeking a platform with programmable clock management, adaptable I/O voltage support and on‑chip memory for FIFOs or dual‑port RAM will find this device appropriate for cost‑sensitive, performance‑oriented commercial systems where space and integration reduce BOM and board complexity.

Request a quote or submit an inquiry for pricing and availability to begin integrating the EP20K100EFC324-1 into your next commercial FPGA design.

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