EP20K100EFC324-1X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 324-BGA |
|---|---|
| Quantity | 381 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 246 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 416 | Number of Logic Elements/Cells | 4160 | ||
| Number of Gates | 263000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248 |
Overview of EP20K100EFC324-1X – APEX-20KE® Field Programmable Gate Array, 324-BGA, 4,160 logic elements
The EP20K100EFC324-1X is an FPGA from Intel's APEX-20KE family that combines LUT-based logic, product-term logic and embedded memory for system-on-a-programmable-chip (SOPC) integration. With 4,160 logic elements, approximately 53,248 bits of embedded RAM, and extensive I/O, it targets commercial designs that require on-chip memory, flexible interfacing and moderate gate density in a compact BGA package.
Key Features
- Core architecture MultiCore architecture integrating look-up table (LUT) logic, product-term logic, and embedded memory to support register‑intensive and combinatorial functions.
- Logic capacity Approximately 263,000 system gates and 4,160 logic elements to implement mid-density digital designs.
- Embedded memory Approximately 0.053 Mbits (53,248 bits) of on-chip RAM suitable for FIFOs, dual-port RAM and other local storage needs.
- I/O and interface flexibility 246 user I/O pins with MultiVolt I/O interface support and family-level I/O features for high-speed external-memory and bus connectivity.
- Clock management Family features include flexible clock circuitry with support for up to four phase-locked loops (PLLs), multiple global clock signals, and programmable clock shift/phase control.
- Power and supply Designed for low-power operation with a voltage supply range of 1.71 V to 1.89 V for this device variant.
- Package and mounting 324-ball FBGA (19 × 19) package in surface-mount format, enabling compact board layouts.
- Operating range and compliance Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant.
Typical Applications
- Embedded system integration Use the device for on-chip SOPC-style integration where compact logic, embedded RAM and programmable I/O simplify system architecture.
- Memory interface and buffering Implement DDR/SDRAM interface logic and FIFO buffers using the embedded RAM and dedicated memory features described for the APEX-20K family.
- Custom protocol bridging Create protocol translators and I/O logic that leverage the part’s MultiVolt I/O capability and plentiful user I/O pins.
- Mid-density digital processing Deploy as the programmable logic hub in commercial digital designs that require ~4,160 logic elements and ~263k system gates.
Unique Advantages
- Highly integrated FPGA core: MultiCore architecture combines LUTs, product-term logic and embedded memory to reduce external component count and simplify design.
- Balanced logic and memory: 4,160 logic elements with approximately 53,248 bits of embedded RAM provide a balance of combinational logic and local storage for common application needs.
- Flexible clocking: Family-level PLL and clock-shift features enable precise clock management for synchronous designs and timing optimization.
- Broad I/O capability: 246 user I/Os and MultiVolt support allow interfacing with a wide range of external devices and memory subsystems.
- Compact package: 324-FBGA (19 × 19) surface-mount package enables high-density PCB implementations while maintaining robust connectivity.
- Commercial-grade and RoHS compliant: Rated for 0 °C to 85 °C and RoHS compliant to meet commercial product requirements and environmental regulations.
Why Choose EP20K100EFC324-1X?
The EP20K100EFC324-1X delivers a practical combination of logic density, embedded memory and flexible I/O in a compact 324-FBGA package. It is well suited for commercial designs that require SOPC-style integration, mid-density logic resources and reliable clocking and memory interfacing capabilities drawn from the APEX-20K family feature set.
Manufactured by Intel and RoHS compliant, this device is appropriate for engineers seeking a commercially graded FPGA solution with clear on-chip resources and predictable operating requirements (1.71–1.89 V supply, 0 °C to 85 °C).
Request a quote or submit an inquiry to obtain pricing, availability and ordering information for EP20K100EFC324-1X.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018