EP20K100EFC324-1X

IC FPGA 246 I/O 324FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 324-BGA

Quantity 381 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O246Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EFC324-1X – APEX-20KE® Field Programmable Gate Array, 324-BGA, 4,160 logic elements

The EP20K100EFC324-1X is an FPGA from Intel's APEX-20KE family that combines LUT-based logic, product-term logic and embedded memory for system-on-a-programmable-chip (SOPC) integration. With 4,160 logic elements, approximately 53,248 bits of embedded RAM, and extensive I/O, it targets commercial designs that require on-chip memory, flexible interfacing and moderate gate density in a compact BGA package.

Key Features

  • Core architecture  MultiCore architecture integrating look-up table (LUT) logic, product-term logic, and embedded memory to support register‑intensive and combinatorial functions.
  • Logic capacity  Approximately 263,000 system gates and 4,160 logic elements to implement mid-density digital designs.
  • Embedded memory  Approximately 0.053 Mbits (53,248 bits) of on-chip RAM suitable for FIFOs, dual-port RAM and other local storage needs.
  • I/O and interface flexibility  246 user I/O pins with MultiVolt I/O interface support and family-level I/O features for high-speed external-memory and bus connectivity.
  • Clock management  Family features include flexible clock circuitry with support for up to four phase-locked loops (PLLs), multiple global clock signals, and programmable clock shift/phase control.
  • Power and supply  Designed for low-power operation with a voltage supply range of 1.71 V to 1.89 V for this device variant.
  • Package and mounting  324-ball FBGA (19 × 19) package in surface-mount format, enabling compact board layouts.
  • Operating range and compliance  Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Embedded system integration  Use the device for on-chip SOPC-style integration where compact logic, embedded RAM and programmable I/O simplify system architecture.
  • Memory interface and buffering  Implement DDR/SDRAM interface logic and FIFO buffers using the embedded RAM and dedicated memory features described for the APEX-20K family.
  • Custom protocol bridging  Create protocol translators and I/O logic that leverage the part’s MultiVolt I/O capability and plentiful user I/O pins.
  • Mid-density digital processing  Deploy as the programmable logic hub in commercial digital designs that require ~4,160 logic elements and ~263k system gates.

Unique Advantages

  • Highly integrated FPGA core: MultiCore architecture combines LUTs, product-term logic and embedded memory to reduce external component count and simplify design.
  • Balanced logic and memory: 4,160 logic elements with approximately 53,248 bits of embedded RAM provide a balance of combinational logic and local storage for common application needs.
  • Flexible clocking: Family-level PLL and clock-shift features enable precise clock management for synchronous designs and timing optimization.
  • Broad I/O capability: 246 user I/Os and MultiVolt support allow interfacing with a wide range of external devices and memory subsystems.
  • Compact package: 324-FBGA (19 × 19) surface-mount package enables high-density PCB implementations while maintaining robust connectivity.
  • Commercial-grade and RoHS compliant: Rated for 0 °C to 85 °C and RoHS compliant to meet commercial product requirements and environmental regulations.

Why Choose EP20K100EFC324-1X?

The EP20K100EFC324-1X delivers a practical combination of logic density, embedded memory and flexible I/O in a compact 324-FBGA package. It is well suited for commercial designs that require SOPC-style integration, mid-density logic resources and reliable clocking and memory interfacing capabilities drawn from the APEX-20K family feature set.

Manufactured by Intel and RoHS compliant, this device is appropriate for engineers seeking a commercially graded FPGA solution with clear on-chip resources and predictable operating requirements (1.71–1.89 V supply, 0 °C to 85 °C).

Request a quote or submit an inquiry to obtain pricing, availability and ordering information for EP20K100EFC324-1X.

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