EP20K100EFC324-3

The EP20K100EFC324-3 is an APEX-20KE family FPGA supplied in a 324-FBGA (19×19) surface-mount package. It integrates a MultiCore architecture combining lookup-table (LUT) logic, product-term logic and embedded memory blocks to support register‑intensive and memory‑intensive functions. Typical uses include embedded systems, high‑speed I/O and memory interface implementations where a compact commercial‑grade programmable logic device is required.

Key Features

• Logic Capacity — 4,160 logic elements and approximately 263,000 gates supporting medium-density programmable logic designs.
• Embedded Memory — Approximately 53 kbits (53,248 bits) of on-chip RAM for FIFOs, dual‑port RAM and CAM-style functions via embedded system blocks (ESBs).
• I/O Count and Package — 246 user I/Os in a 324-FBGA (19×19) surface-mount package, suitable for space‑constrained board layouts.
• Power and Supply — Internal supply operating in the 1.71 V to 1.89 V range with MultiVolt I/O support for interfacing with multiple I/O voltage domains.
• Clocking and PLLs — Flexible clock management with up to four PLLs, built‑in low‑skew clock tree and up to eight global clock signals for synchronized, low‑skew designs.
• High‑speed I/O Support — Series-level features include support for LVDS, high‑speed external memories (including DDR SDRAM and ZBT SRAM) and PCI 3.3‑V operation as described in the APEX 20K family datasheet.
• Low‑Power Design — APEX 20KE family devices include low‑power operation modes and ESB programmable power-saving features.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for standard commercial deployments.
• RoHS Compliant — Conforms to RoHS requirements for lead‑free assembly and environmental compliance.

Typical Applications

• Embedded Controllers — Implement custom control logic and glue logic where compact FPGA capacity and embedded RAM accelerate development.
• Memory Interface and buffering — Use embedded system blocks and support for DDR/ZBT memories to implement FIFOs, data buffering, and memory controllers.
• High‑speed I/O Aggregation — Aggregate and translate multiple I/O standards using MultiVolt I/O and high‑speed signaling support.
• PCI and Legacy Bus Bridging — Suitable for designs requiring PCI 3.3‑V operation for bus interfacing and protocol bridging.

Unique Advantages

• MultiCore architecture: Integrates LUT logic, product‑term logic and embedded memory blocks to address both register‑intensive and memory‑intensive functions in a single device.
• Balanced capacity and package: 4,160 logic elements and 246 I/Os in a 324‑FBGA (19×19) package deliver a compact footprint for medium‑density applications.
• Flexible clocking: Up to four PLLs, a low‑skew clock tree and multiple global clocks simplify timing architecture for complex synchronous designs.
• Memory and I/O versatility: Embedded RAM and series‑level support for DDR/ZBT memories plus MultiVolt I/O enable diverse interface and buffering implementations.
• Designed for low power: Family features include low‑voltage operation and programmable ESB power‑saving modes to help reduce system power consumption.
• Compliance and assembly: Surface‑mount 324‑FBGA package and RoHS compliance simplify modern manufacturing and environmental requirements.

Why Choose EP20K100EFC324-3?

The EP20K100EFC324-3 positions itself as a commercially graded, medium-density FPGA option within the APEX‑20KE family, combining a MultiCore programmable logic architecture with embedded memory and flexible clocking. It is appropriate for engineers building compact embedded systems, memory interfaces and high‑speed I/O solutions that require integrated RAM, multiple PLLs and MultiVolt I/O capabilities.

Choosing this device offers a balance of logic element capacity, on‑chip memory and 246 I/Os in a 324‑FBGA footprint, backed by the APEX‑20K family architecture and power‑management features—helpful for designs that need deterministic clocking and versatile interface support.

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