EP20K100EFI144-3

IC FPGA 93 I/O 144TQFP
Part Description

APEX-20K® Field Programmable Gate Array (FPGA) IC 93 53248 4160 144-LQFP

Quantity 1,072 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O93Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EFI144-3 – APEX-20K® Field Programmable Gate Array (FPGA) IC, 144-LQFP

The EP20K100EFI144-3 is an Altera APEX-20K series FPGA provided in a 144-LQFP surface-mount package. It integrates a MultiCore architecture combining lookup-table (LUT) logic, product-term logic and embedded memory to support system-level integration and on-chip buffering.

With 4,160 logic elements, approximately 53 kbits of embedded RAM, flexible clocking and rich I/O, this industrial-grade device targets designs that require mid-range logic density, embedded memory and multi-voltage I/O compatibility within a compact 144-pin footprint.

Key Features

  • Core Architecture  MultiCore architecture combining LUT logic and product-term logic for register- and combinatorial-intensive functions; series-level SOPC integration capabilities.
  • Logic Density  4,160 logic elements (LEs) delivering approximately 263,000 system gates to implement medium-complexity custom logic.
  • Embedded Memory  Approximately 53,248 bits of on-chip RAM organized as embedded system blocks suitable for FIFOs, dual-port RAM and CAM-style functions.
  • I/O and Interface  93 user I/O pins with series-level support for MultiVolt I/O standards and advanced I/O protocols; designed for high-speed external memory and bus interfacing.
  • Clocking and Timing  Flexible clock management with up to four PLLs, built-in low-skew clock tree and programmable clock phase/delay features to support synchronous system designs.
  • Power and Supply  Internal and I/O supply requirements per device: specified voltage supply range of 1.71 V to 1.89 V for this part number, and series-level low-power design options.
  • Package and Temperature  Surface-mount 144-LQFP package (144-TQFP 20×20 supplier package) rated for industrial temperature operation from −40 °C to 100 °C.
  • Design-for-Test  Series documentation notes JTAG boundary-scan support for system-level testability and debug.

Typical Applications

  • Embedded system integration  On-chip memory and LUT resources make the device suitable for combining control logic and buffer/FIFO functions in compact system designs.
  • High-speed I/O and memory interfaces  Use in applications that interface to external memories and high-speed buses where flexible I/O and clocking support are required.
  • Industrial control and automation  Industrial-grade temperature range and surface-mount packaging fit control, monitoring and sensor aggregation tasks in industrial equipment.
  • Custom logic and protocol bridging  Mid-range logic density and numerous I/O pins allow implementation of protocol converters, bus bridges and glue-logic functions.

Unique Advantages

  • Balanced logic and memory mix: 4,160 logic elements combined with approximately 53 kbits of embedded RAM support both logic-intensive and buffer-centric functions on a single device.
  • Flexible clocking: Multiple PLLs and a low-skew clock tree provide the timing control needed for multi-domain designs and high-speed interfaces.
  • Compact industrial package: 144-LQFP surface-mount package and −40 °C to 100 °C rating enable deployment in space-constrained, industrial environments.
  • Rich I/O capability: 93 user I/O pins and family-level MultiVolt support facilitate interfacing to a wide range of external devices and memory technologies.
  • On-board system integration: Embedded system blocks (ESBs) support FIFO, dual-port RAM and CAM implementations to reduce external component count.

Why Choose EP20K100EFI144-3?

The EP20K100EFI144-3 positions itself as a mid-density FPGA option for designers who need a compact, industrial-grade programmable device with a practical balance of logic elements and embedded memory. Its combination of 4,160 logic elements, approximately 53 kbits of embedded RAM, flexible clocking and 93 I/O pins supports integration of custom logic, buffering and interface functions in a single 144-LQFP package.

This part is suited to engineering teams building embedded platforms, I/O-intensive controllers and industrial systems that require on-chip memory and predictable clock management, while maintaining a small footprint and industrial temperature capabilities.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for EP20K100EFI144-3. Provide your required quantities and delivery needs to get a prompt response.

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