EP20K100EQC208-2

The EP20K100EQC208-2 is an APEX-20KE family FPGA delivering 4,160 logic elements and approximately 53,248 bits of embedded memory in a 208-BFQFP surface-mount package. Based on the APEX 20K MultiCore architecture, this device integrates LUT-based logic, product-term logic and embedded system blocks (ESBs) for compact SOPC-style integration in commercial applications.

With support for MultiVolt I/O, flexible clock management and a 1.71 V to 1.89 V supply range, this FPGA targets embedded control, high-speed I/O interfacing and system integration tasks where on-chip memory, configurable logic and predictable clocking are required.

Key Features

• Logic Capacity — 4,160 logic elements providing the programmable logic resources needed for moderate-complexity designs; nominally represented as approximately 263,000 system gates.
• Embedded Memory — Approximately 53,248 bits of on-chip RAM implemented in ESBs for FIFOs, dual-port RAM or CAM-style functions.
• I/O Resources — 151 user I/O pins with MultiVolt interface support and programmable pin features for flexible system interfacing.
• Clock Management — Flexible clock circuitry from the APEX 20K family including support for multiple PLLs and low-skew clock tree features to simplify timing distribution.
• Low-Voltage Core — Internal supply operating between 1.71 V and 1.89 V, designed to support low-power operation consistent with APEX 20K family design goals.
• Package & Mounting — 208-BFQFP package (supplier package: 208-PQFP, 28×28) for surface-mount assembly in space-constrained boards.
• Commercial Grade & RoHS Compliant — Commercial temperature grade (0 °C to 85 °C) and RoHS-compliant for typical commercial electronics deployments.

Typical Applications

• Embedded Control — Use the FPGA for control logic, protocol handling and real-time glue logic in embedded systems that benefit from on-chip memory and reprogrammable logic.
• High-Speed I/O Bridging — Implement interface bridging and timing-critical I/O conditioning leveraging the device’s MultiVolt I/O support and dedicated clock-management features.
• Data Buffering & Packet Handling — Deploy ESBs to implement FIFOs and dual-port RAM for buffering and packet staging in communications or data-acquisition modules.
• Prototyping & System Integration — Ideal for system-on-a-programmable-chip prototyping where integrated LUT logic, product-term logic and embedded memory accelerate development cycles.

Unique Advantages

• Balanced Logic and Memory — 4,160 logic elements combined with ~53,248 bits of embedded RAM enable compact implementations of control logic with local buffering without external memory.
• Configurable I/O Flexibility — 151 user I/O pins with MultiVolt support let you interface directly with multiple voltage domains, reducing external level-shifting components.
• Predictable Clocking — Family-level clock features including multiple PLLs and a low-skew clock tree help simplify timing closure for multi-domain designs.
• Compact Surface-Mount Package — 208-BFQFP (28×28) offers a space-efficient footprint for board-level integration in compact commercial products.
• Commercial Temperatures and RoHS Compliance — Suitable for mainstream commercial applications with standard temperature range and environmental compliance.

Why Choose EP20K100EQC208-2?

The EP20K100EQC208-2 combines the APEX-20KE architecture’s MultiCore approach—LUT logic, product-term logic and ESBs—with a practical balance of logic, on-chip RAM and I/O count for commercial embedded designs. Its supply range and clock-management capabilities support lower-voltage, power-aware systems while delivering the flexibility needed for protocol bridging, buffering and SOPC-style integration.

This part is well suited to design teams seeking a RoHS-compliant, commercially graded FPGA in a compact 208-pin BFQFP package that provides integrated memory and predictable clocking for mid-density logic designs and system prototypes.

Request a quote or submit an RFQ to receive pricing and lead-time information for the EP20K100EQC208-2 and to discuss volume availability and delivery options.