EP20K100EQC208-3

IC FPGA 151 I/O 208QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 151 53248 4160 208-BFQFP

Quantity 1,690 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O151Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EQC208-3 – APEX-20KE Field Programmable Gate Array, 208-BFQFP

The EP20K100EQC208-3 is an APEX-20KE family Field Programmable Gate Array (FPGA) in a 208-BFQFP (208-PQFP, 28×28) surface-mount package. It integrates lookup-table (LUT) logic and embedded memory resources using the MultiCore architecture to deliver flexible programmable logic with significant embedded RAM.

Targeted for commercial designs requiring moderate logic capacity and rich I/O, this device combines 4,160 logic elements, approximately 53 Kbits of embedded memory, and 151 I/O pins to support control, interfacing and buffering tasks within consumer, communications and general embedded systems.

Key Features

  • Logic Capacity — 4,160 logic elements (LEs) providing 263,000 gates of logic density for medium-complexity FPGA designs.
  • On-chip Embedded Memory — Approximately 53 Kbits of embedded RAM (53,248 bits) for FIFOs, buffers and small data storage without using external memory.
  • I/O and Package — 151 programmable I/O pins in a 208-BFQFP surface-mount package (208-PQFP, 28×28) to support a broad range of interfaces and board layouts.
  • Power and Supply — Internal supply operation compatible with 1.71 V to 1.89 V VCCINT range, designed for low-power operation within commercial power envelopes.
  • Operating Range and Compliance — Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.
  • MultiCore Architecture & ESBs — Family-level MultiCore architecture integrates LUT logic and embedded system blocks (ESBs) for implementing RAM, FIFOs and CAMs as described in APEX-20K documentation.
  • Clock Management — Series-level features include flexible clock management with up to four PLLs, built-in low-skew clock tree, and up to eight global clock signals (as described for the APEX 20K family).
  • Advanced I/O Support — Family-level I/O capabilities include MultiVolt interface support, programmable clamp to VCCIO, per-pin tri-state control and programmable output slew-rate control (APEX 20K family features).
  • High-Speed Interface Support — Series documentation indicates support for high-speed external memories and high-performance I/O standards suitable for DDR SDRAM and other memory interfaces (APEX 20K family features).

Typical Applications

  • Embedded Control and Signal Processing — Use the device’s 4,160 logic elements and embedded RAM for control logic, protocol handling and modest signal-processing tasks.
  • Memory Buffers and FIFO Management — Embedded system blocks and on-chip RAM are well suited for implementing FIFOs and small buffering functions to support external memory and peripheral interfaces.
  • Interface Bridging and Protocol Conversion — 151 I/O pins and MultiVolt I/O support enable interfacing between different voltage domains and implementing protocol translation logic on a single IC.
  • Prototyping and Low- to Mid-density FPGA Designs — Combines moderate logic capacity with flexible I/O and clock management for proof-of-concept, evaluation, or production designs in commercial environments.

Unique Advantages

  • Balanced Logic and Memory — 4,160 logic elements paired with approximately 53 Kbits of embedded RAM lets designers implement both control logic and local data storage on-chip, reducing external memory dependence.
  • Flexible I/O in a Compact Package — 151 I/Os in a 208-BFQFP footprint support dense connectivity while maintaining a standard surface-mount form factor for compact boards.
  • Programmable Clocking — Series-level PLLs and a low-skew clock tree enable deterministic clock distribution and phase adjustments for synchronous designs.
  • Commercial Temperature and RoHS Compliance — Rated for 0 °C to 85 °C operation and RoHS compliant to meet typical commercial product requirements and environmental regulations.
  • Surface-Mount Assembly — Surface-mount package simplifies automated PCB assembly for volume manufacturing.

Why Choose EP20K100EQC208-3?

The EP20K100EQC208-3 offers a pragmatic combination of logic density, embedded memory and flexible I/O in a compact 208-BFQFP package for commercial FPGA applications. Its MultiCore architecture and embedded system blocks (as described for the APEX-20K family) provide designers with versatile building blocks for FIFOs, buffers and register-intensive logic while keeping board-level BOM simple.

This device is well suited to teams developing mid-density programmable logic solutions that require moderate gate counts, substantial on-chip RAM, and robust I/O options, backed by the APEX-20K family design features and documentation.

If you would like pricing, availability or to submit a quote request for EP20K100EQC208-3, please request a quote or contact our sales team to begin the procurement process.

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