EP20K100EQC240-1N

IC FPGA 183 I/O 240QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 183 53248 4160 240-BFQFP

Quantity 802 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O183Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EQC240-1N – APEX-20KE FPGA, 4,160 logic elements, 53,248-bit embedded memory, 183 I/O (240‑BFQFP)

The EP20K100EQC240-1N is an APEX-20KE family field programmable gate array (FPGA) designed for system-level integration and mid-density logic implementations. It leverages the APEX 20K family architecture, including MultiCore integration and embedded system blocks (ESBs), to combine lookup-table logic, product-term logic, and on-chip RAM for memory and FIFO functions.

With 4,160 logic elements, approximately 53,248 bits of embedded RAM, and 183 user I/O pins in a 240‑pin BFQFP package, this commercial-grade device targets designs requiring moderate logic capacity, flexible I/O support, and on-chip memory for buffering and local storage.

Key Features

  • Core & Architecture  APEX 20K MultiCore architecture integrating LUT logic, product-term logic, and embedded system blocks (ESBs) for mixed register- and memory-oriented functions.
  • Logic Capacity  4,160 logic elements (LEs) with a device gate count of 263,000, delivering mid-range programmable logic resources for control, glue logic, and moderate compute tasks.
  • Embedded Memory  Approximately 53,248 bits of on-chip RAM provided by ESBs that can implement FIFOs, dual-port RAM, and content-addressable memory (CAM) structures.
  • I/O & Interfaces  183 user I/O pins with family-level support for MultiVolt I/O standards and advanced interfaces; suitable for high-speed external memories and differential signaling applications.
  • Clocking & Timing  Family clock management features include up to four PLLs, a built-in low-skew clock tree, and support for multiple global clocks and programmable clock phase/delay controls.
  • Power & Voltage  Device supply specified at 1.71 V to 1.89 V. Family features include low-power design elements and ESB programmable power-saving modes.
  • Package & Mounting  240-BFQFP (240‑PQFP, 32×32) surface-mount package for PCB assembly where a compact PQFP footprint is required.
  • Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental requirements.

Typical Applications

  • System integration and SOPC designs  Use the MultiCore architecture and ESBs to implement embedded system functions, on-chip peripherals, and custom logic in system-on-programmable-chip applications.
  • Memory interface controllers  On-chip RAM and ESB capabilities support FIFO buffers and controllers for DDR SDRAM and other external memory interfaces.
  • High-speed I/O bridging  Broad I/O pin count and family support for high-speed standards enable PCI/PCI-X-like bus bridging, LVDS links, and protocol conversion tasks.
  • Prototyping and mid-density designs  Moderate logic and embedded memory make this device suitable for prototyping feature sets and deploying production designs that require up to a few thousand LEs and dedicated on-chip RAM.

Unique Advantages

  • Integrated MultiCore architecture  Combines LUT, product-term logic, and ESBs to simplify mapping of register-intensive and memory-intensive functions within one device.
  • On-chip RAM for buffering and CAM  Approximately 53,248 bits of embedded memory enable local data storage, FIFOs, and CAM implementations without external memory.
  • Flexible clock management  Multiple PLLs and programmable clock features support complex timing domains and reduce clock skew across the design.
  • High I/O count in a compact package  183 user I/O pins in a 240‑BFQFP package provide extensive interfacing capability while maintaining a small board footprint.
  • Commercial temperature and RoHS compliance  Operational range of 0 °C to 85 °C and RoHS compliance support standard commercial product requirements and environmental regulations.

Why Choose EP20K100EQC240-1N?

The EP20K100EQC240-1N offers a balanced mix of programmable logic, embedded memory, and flexible I/O suitable for mid-density FPGA applications. It is well matched to designs that need roughly 4,160 logic elements, on-chip RAM for buffering and local storage, and a high pin count in a 240‑pin PQFP footprint.

For engineers and procurement teams building system-level integrations, protocol bridges, or memory interface controllers in commercial-temperature environments, this APEX-20KE device delivers a consistent, verifiable feature set with the packaging and supply characteristics needed for production deployment.

If you would like pricing, availability, or a formal quote for EP20K100EQC240-1N, submit a quote request or contact procurement to receive a prompt response.

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