EP20K100EQC240-2

The EP20K100EQC240-2 is an Intel APEX-20KE family FPGA offered in a 240-BFQFP package. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) to deliver a programmable-logic foundation for mid-density designs.

Designed for commercial applications, this device targets use cases requiring a balance of logic capacity, on-chip embedded memory and flexible I/O — such as system integration, memory-interface controllers and I/O-intensive logic functions. It is specified for a VCC range of 1.71 V to 1.89 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core and Logic — Approximately 4,160 logic elements (LEs) and up to 263,000 system gates provide mid-range programmable logic capacity for control, glue logic and algorithm implementation.
• Embedded Memory — Approximately 53,248 bits of on-chip RAM implemented via embedded system blocks (ESBs) that can be used for FIFOs, dual-port RAM and CAM-style functions.
• I/O Count and Package — 183 user I/O pins in a 240-BFQFP (240-PQFP, 32×32) surface-mount package for dense board-level connectivity.
• MultiVolt I/O and Standards Support — Series-level MultiVolt I/O interface support and a broad set of advanced I/O standards (including LVDS and high-speed terminated logic) to interface with a range of external devices and memory types.
• Memory and Bus Support — Series-level support for high-speed external memories such as DDR SDRAM and ZBT SRAM and compliance references for PCI 2.2 3.3-V operation.
• Clock Management — Up to four PLLs, up to eight global clock signals and programmable clock features (ClockLock, ClockBoost, ClockShift) to simplify clock distribution and phase control.
• Power and Thermal — Low-power design with internal supply operating in the 1.71 V–1.89 V range; commercial-grade operating temperature from 0 °C to 85 °C. RoHS compliant.
• Packaging and Mounting — Surface-mount 240-BFQFP package for compact PCB implementation and standard SMT assembly.

Typical Applications

• System Integration and SOPC — Implement embedded system functions using the MultiCore architecture and ESBs for on-chip memory and logic integration.
• Memory Interface Controllers — Build controllers and buffers for DDR SDRAM and ZBT SRAM using the device’s embedded RAM and dedicated I/O features.
• PCI-based Expansion — Use in 3.3-V PCI systems where series-level compliance with PCI Local Bus Specification Revision 2.2 is relevant.
• High-speed I/O and Serial Links — Support LVDS channels and other advanced I/O standards for high-throughput signaling and data transport.
• Mid-density Logic and Control — Ideal for glue logic, finite-state machines, and moderate-complexity digital controllers in commercial products.

Unique Advantages

• Integrated ESB Memory: On-chip ESBs provide approximately 53 kbits of embedded RAM usable for FIFOs and dual-port memory, reducing external memory requirements and BOM complexity.
• Moderate Logic Capacity: Roughly 4,160 logic elements and 263,000 gates offer a balanced resource set for mid-range FPGA designs without overspecifying device size.
• Rich Clocking Resources: Multiple PLLs and global clock signals, plus programmable clock features, streamline timing architectures for synchronous designs.
• Flexible I/O Support: 183 user I/Os and series-level MultiVolt interface support enable direct interfacing with diverse voltage domains and high-speed peripherals.
• Commercial Temperature and RoHS Compliance: Specified for 0 °C to 85 °C operation and RoHS compliant for commercial-product lifecycle requirements.
• Compact SMT Package: 240-BFQFP surface-mount package allows dense board placement while providing a substantial I/O count.

Why Choose EP20K100EQC240-2?

The EP20K100EQC240-2 delivers a practical combination of logic capacity, embedded memory and flexible I/O in a compact 240-BFQFP package from Intel’s APEX-20KE family. Its MultiCore architecture and ESBs are suited to designs that need integrated memory functions, robust clock management and standard-compliant high-speed I/O while operating on a low-voltage internal supply.

This device is a fit for engineering teams seeking a commercially graded, RoHS-compliant FPGA for mid-density applications — from memory interface controllers and PCI-based subsystems to I/O-heavy control and signal-processing tasks — where on-chip RAM, clocking flexibility and a wide set of I/O options simplify board-level design.

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