EP20K100EQC240-2X

IC FPGA 183 I/O 240QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 183 53248 4160 240-BFQFP

Quantity 929 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O183Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EQC240-2X – APEX-20KE® FPGA, 4,160 logic elements, 53,248-bit RAM, 183 I/O

The EP20K100EQC240-2X is an APEX-20KE family field-programmable gate array (FPGA) IC designed for commercial embedded logic applications. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory, enabling system-on-a-programmable-chip (SOPC) integration.

This device targets applications that require medium-density programmable logic combined with embedded system blocks, plentiful I/O and flexible clock management—delivering a balance of integration, configurability and power-aware operation for embedded and communications designs.

Key Features

  • MultiCore architecture and SOPC integration Integrates LUT logic, product-term logic and embedded memory to support register‑intensive and memory‑intensive functions within a single programmable device.
  • Logic density Approximately 263,000 gates with 4,160 logic elements, suitable for medium-density logic implementations and complex glue logic.
  • Embedded memory Approximately 53,248 bits of on-chip RAM implemented in embedded system blocks (ESBs) for FIFOs, dual-port RAM and CAM-style functions.
  • I/O capability 183 user I/O pins with MultiVolt I/O interface support to interface with multiple voltage domains and a programmable slew and clamp options for signal integrity control.
  • Clock and timing Flexible clock management with up to four PLLs, built-in low-skew clock tree and multiple global clock signals to manage complex timing domains.
  • Power and voltage Low-voltage internal operation with supply range specified at 1.71 V to 1.89 V and design considerations for low-power modes.
  • Package and mounting 240-BFQFP (240-PQFP 32×32) surface-mount package for streamlined PCB assembly and compact board-level integration.
  • Commercial temperature grade Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Typical Applications

  • Embedded systems and SOPC solutions — Use on-chip LUTs and ESBs to consolidate control logic, FIFOs and custom peripherals in compact embedded designs.
  • Interface bridging and protocol conversion — Leverage abundant I/O and MultiVolt support to interface between different voltage domains and legacy or modern peripherals.
  • Memory buffering and data streaming — Implement FIFOs and dual-port RAM using the device’s embedded memory for buffering in data acquisition, buffering or communications paths.
  • Prototyping and development — Medium-density logic and flexible clock resources make this FPGA suitable for breadboarding and early-stage hardware development of custom logic.

Unique Advantages

  • Integrated SOPC-capable architecture: MultiCore integration of LUTs, product-term logic and ESBs reduces external component count and simplifies system design.
  • Balanced logic and memory resources: 4,160 logic elements with approximately 53,248 bits of on-chip RAM provide a practical balance for designs that mix control logic and buffering.
  • Flexible I/O for mixed-voltage systems: 183 user I/O pins and MultiVolt interface support simplify interconnection to peripherals across multiple voltage domains.
  • Robust clock management: Multiple PLLs and a low-skew clock tree enable reliable multi‑domain timing without extensive external logic.
  • Compact, surface-mount package: 240-BFQFP package supports dense board layouts while remaining compatible with standard PCB assembly processes.
  • Commercial-grade, RoHS-compliant: Rated 0 °C to 85 °C and RoHS compliant for mainstream electronic products and systems.

Why Choose EP20K100EQC240-2X?

The EP20K100EQC240-2X positions itself as a flexible, medium-density FPGA offering a practical mix of logic, embedded memory and I/O resources in a compact surface-mount package. Its MultiCore SOPC-oriented architecture and on-chip ESBs make it well suited for designers who need to consolidate control logic, buffering and interface glue into a single programmable device.

This device is ideal for development teams and OEMs building commercial embedded systems, communications interfaces or prototype platforms that require predictable timing, mixed-voltage I/O support and a balance of logic and memory resources backed by the APEX-20KE device family feature set.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for the EP20K100EQC240-2X.

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