EP20K100EQC208-2X

IC FPGA 151 I/O 208QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 151 53248 4160 208-BFQFP

Quantity 1,135 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O151Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EQC208-2X – APEX-20KE® FPGA, 208-BFQFP

The EP20K100EQC208-2X is an APEX-20KE family field programmable gate array (FPGA) in a 208-BFQFP surface-mount package. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic and embedded memory, delivering a programmable logic fabric suitable for control, interface and memory-centric functions.

Targeted at commercial applications, this device provides a balance of logic density, on-chip RAM and flexible I/O to support designs that require embedded memory, multiple clock domains and mixed-voltage interfacing.

Key Features

  • MultiCore architecture – Integrates LUT logic, product-term logic and embedded memory for mixed register- and combinatorial-intensive functions.
  • Logic density – Approximately 4,160 logic elements and up to 263,000 system gates to implement mid-range programmable designs.
  • Embedded memory – Approximately 53,248 bits of on-chip RAM to implement FIFOs, dual-port RAM and CAM-style functions.
  • Macrocells – 416 macrocells available for product-term-based logic and legacy macrocell mapping.
  • Flexible I/O – 151 user I/O pins with MultiVolt I/O interface support and programmable I/O features described in the device family data sheet.
  • Advanced I/O performance – Bidirectional I/O performance noted up to 250 MHz and LVDS support documented up to 840 Mbits per channel in the APEX 20K family data.
  • Clock management – Family-level support for up to four PLLs, a built-in low-skew clock tree and up to eight global clock signals (features described in the APEX 20K family data).
  • Low-voltage operation – Device internal supply in the range 1.71 V to 1.89 V per part specification, supporting lower-power designs.
  • Package and mounting – 208-BFQFP (208-pin PQFP, 28 × 28) surface-mount package for standard PCB assembly workflows.
  • Commercial temperature grade – Operating temperature range 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Memory interface controllers – Use the device’s embedded RAM and I/O capabilities to implement DDR and high-speed SRAM interface logic where on-chip buffering and FIFOs are required.
  • Protocol bridging and I/O aggregation – Leverage MultiVolt I/O and high-speed I/O performance for PCI, LVDS and other high-speed interface roles.
  • Data acquisition and signal preprocessing – Combine logic elements and embedded memory to implement real-time buffering, formatting and pre-processing of streamed data.
  • Custom control and timing systems – Use the device’s clock management and multiple PLLs to implement multi-domain timing and control logic for embedded systems.

Unique Advantages

  • Integrated logic and memory: On-chip LUT logic plus approximately 53,248 bits of embedded RAM reduce external memory dependency for many designs.
  • Mid-range capacity: Around 4,160 logic elements and 263,000 system gates provide a practical balance of density and cost for commercial applications.
  • Flexible clocking: Family-level PLL and global clock resources simplify multi-clock-domain designs and timing distribution.
  • Mixed-voltage I/O support: MultiVolt I/O features allow interfacing with a variety of external devices and I/O standards as described in the APEX 20K family documentation.
  • Standard package and mounting: 208-BFQFP surface-mount package eases integration into existing PCB form factors and assembly processes.
  • Regulatory and environmental: RoHS compliant construction supports environmental requirements for commercial products.

Why Choose EP20K100EQC208-2X?

The EP20K100EQC208-2X positions itself as a practical, commercially graded FPGA option for designs that require a balanced combination of logic density, embedded memory and flexible I/O. Its MultiCore architecture and family-provided clock and I/O features enable implementations ranging from memory interfaces to protocol bridging and custom control logic.

Engineers seeking a commercially rated FPGA with on-chip memory resources, mid-range gate count and standard surface-mount packaging will find this device suitable for scalable prototypes and production designs where the APEX 20K family characteristics are desired.

Request a quote or submit a purchase inquiry to get pricing and availability for the EP20K100EQC208-2X.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up