EP20K100EFI144-2X

The EP20K100EFI144-2X is an APEX-20KE® family Field Programmable Gate Array (FPGA) from Intel, provided in a 144-ball BGA surface-mount package. It integrates MultiCore™ architecture combining look-up table (LUT) logic, product-term logic, and embedded system blocks for on-chip memory and combinatorial functions.

Designed for industrial applications, the device offers a balance of logic density, embedded memory, and flexible I/O, making it suitable for custom logic, memory interface implementations, and systems that require extended temperature operation and compact packaging.

Key Features

• Core architecture: MultiCore™ integration of LUT logic, product-term logic, and embedded system blocks (ESBs) for system-on-a-programmable-chip (SOPC) integration.
• Logic capacity: Approximately 4,160 logic elements and up to 263,000 system gates, enabling moderate-density custom logic implementations.
• Embedded memory: Approximately 53,248 bits of on-chip RAM with ESB support for FIFO buffers, dual-port RAM, and content-addressable memory (CAM) implementations.
• I/O and interface flexibility: 93 user I/O pins and MultiVolt I/O interface support for 1.8 V, 2.5 V, 3.3 V, and 5.0 V signaling; family-level support for advanced standards including LVDS, DDR SDRAM, ZBT SRAM, and PCI (3.3-V operation).
• Clock management: Flexible clocking with up to four PLLs, a built-in low-skew clock tree, up to eight global clocks, and features such as ClockLock, ClockBoost, and ClockShift for phase and delay control.
• Power and supply: Internal supply specified at 1.71 V to 1.89 V and device-level features for low-power operation, including programmable ESB power-saving modes.
• Package and thermal: 144-FBGA (13 × 13) surface-mount package, industrial grade with an operating temperature range of −40°C to 100°C, and RoHS compliant.

Typical Applications

• Industrial automation: Industrial-grade temperature range and robust packaging suit control-system implementations that require reliable operation across extended temperatures.
• Communications & networking: High-speed I/O capabilities and support for LVDS and PCI (3.3-V) enable use in data transport and interface subsystems.
• Memory interface controllers: Family-level support for DDR SDRAM and ZBT SRAM makes the device suitable for custom memory controller and buffering designs.
• Custom logic and prototyping: The combination of ~4,160 logic elements and on-chip memory supports implementation and validation of custom logic, state machines, and embedded controllers.

Unique Advantages

• Highly configurable logic: 4,160 logic elements and up to 263,000 gates provide the capacity to implement complex user logic without external ASIC development.
• Integrated on-chip memory: Approximately 53,248 bits of embedded RAM and ESB features reduce external memory requirements for many designs.
• Flexible multi-voltage I/O: Support for multiple I/O voltage levels and 93 user I/O pins simplifies interfacing to a wide range of peripherals and legacy devices.
• Advanced clocking: Multiple PLLs and programmable clock features provide low-skew, high-flexibility timing for synchronous systems.
• Industrial-ready packaging and range: 144-FBGA surface-mount package and −40°C to 100°C operating range support deployment in demanding environments.

Why Choose EP20K100EFI144-2X?

As a member of the APEX 20K family from Intel, the EP20K100EFI144-2X delivers a balance of configurable logic, embedded memory, and flexible I/O in a compact 144-BGA package suited for industrial applications. Its MultiCore architecture and ESB-based memory capabilities enable integration of register-intensive functions and memory-centric blocks on-chip.

This device is well suited for engineers designing industrial control systems, communications interfaces, memory controllers, or custom embedded logic where a proven FPGA architecture, moderate logic density, and extended-temperature operation are required.

Request a quote or submit a pricing inquiry to purchase EP20K100EFI144-2X. Our team will respond with availability and lead-time information.