EP20K100EFC324-2X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 324-BGA |
|---|---|
| Quantity | 370 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 246 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 416 | Number of Logic Elements/Cells | 4160 | ||
| Number of Gates | 263000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248 |
Overview of EP20K100EFC324-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 324-BGA
The EP20K100EFC324-2X is an APEX-20KE family FPGA offering a MultiCore architecture that integrates LUT-based logic, product-term logic and embedded memory blocks. With 4,160 logic elements, 246 user I/O pins and 53,248 bits of on-chip RAM, this commercial-grade, surface-mount device targets system-on-a-programmable-chip (SOPC) designs requiring flexible I/O, embedded memory and on-chip clock management.
Designed for applications operating within a 0 °C to 85 °C range and a core supply of 1.71 V to 1.89 V, the device provides a balance of integration and configurable resources for embedded systems, interface bridging and logic-intensive control functions.
Key Features
- MultiCore architecture Integrates lookup-table (LUT) logic, product-term logic and embedded system blocks (ESBs) to support register-intensive and memory functions such as FIFOs and dual-port RAM.
- Logic and capacity 4,160 logic elements and up to 263,000 system gates provide programmable logic density for mid-range designs.
- Embedded memory 53,248 total RAM bits of on-chip memory for data buffering, small on-chip storage and FIFO structures.
- I/O and interface support 246 user I/O pins with MultiVolt I/O interface support to connect with 1.8 V, 2.5 V, 3.3 V and 5.0 V devices; supports a wide range of high-speed standards described in the APEX 20K family documentation.
- Clock management On-chip clock resources including multiple PLLs, a built-in low-skew clock tree and features for clock phase/shift and multiplication/division.
- Power and packaging Designed for low-power operation at an internal supply of 1.71 V–1.89 V, supplied in a 324-ball fine-pitch BGA (324-FBGA, 19×19) surface-mount package.
- Commercial temperature grade Rated for 0 °C to 85 °C operating temperature and RoHS compliant for environmental compliance in commercial applications.
Typical Applications
- Embedded system controllers Integrates logic, memory and clocking to implement SOPC-style embedded controllers and system glue logic.
- High-speed interface bridging MultiVolt I/O and support for common high-speed I/O standards enable protocol bridging and board-level interface conversion.
- Memory buffering and FIFOs On-chip ESBs and RAM bits provide buffering, FIFO and small dual-port memory structures for data flow smoothing and transient storage.
- Custom logic and control Suitable for state machines, control logic and register-intensive functions that leverage LUT logic and dedicated interconnect.
Unique Advantages
- Integrated SOPC-capable architecture: MultiCore integration of LUTs, product-term logic and ESBs reduces external component count for embedded designs.
- Balanced mid-range capacity: 4,160 logic elements and 263,000 gates offer a practical density for mid-complexity programmable logic tasks without excessive overhead.
- Flexible I/O support: 246 I/O pins with MultiVolt compatibility enable straightforward interfacing to multiple voltage domains on mixed-signal boards.
- On-chip clock resources: Multiple PLLs and a low-skew clock tree support complex clocking schemes and phase/clock adjustments on-chip.
- Compact surface-mount package: 324-FBGA (19×19) packaging delivers a high-pin-count footprint in a compact form factor for dense board designs.
- RoHS compliant: Meets RoHS environmental requirements for commercial deployments.
Why Choose EP20K100EFC324-2X?
The EP20K100EFC324-2X combines APEX-20KE family architectural features—integrated LUT and ESB resources, on-chip clock management and extensive I/O—with a commercial-grade operating range to support mid-range FPGA designs. Its mix of logic elements, embedded RAM and flexible I/O makes it well suited to embedded controllers, interface bridging and memory-buffering tasks where SOPC-style integration and configurable clocking are valuable.
For teams developing compact, board-level programmable solutions, the EP20K100EFC324-2X provides a robust set of verifiable hardware resources and packaging choices that simplify BOM and system integration while remaining within commercial temperature and supply constraints.
Request a quote or submit an inquiry to receive pricing, availability and board-level integration support for the EP20K100EFC324-2X.

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