EP20K100EFC324-2X

IC FPGA 246 I/O 324FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 324-BGA

Quantity 370 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O246Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100EFC324-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 246 53248 4160 324-BGA

The EP20K100EFC324-2X is an APEX-20KE family FPGA offering a MultiCore architecture that integrates LUT-based logic, product-term logic and embedded memory blocks. With 4,160 logic elements, 246 user I/O pins and 53,248 bits of on-chip RAM, this commercial-grade, surface-mount device targets system-on-a-programmable-chip (SOPC) designs requiring flexible I/O, embedded memory and on-chip clock management.

Designed for applications operating within a 0 °C to 85 °C range and a core supply of 1.71 V to 1.89 V, the device provides a balance of integration and configurable resources for embedded systems, interface bridging and logic-intensive control functions.

Key Features

  • MultiCore architecture Integrates lookup-table (LUT) logic, product-term logic and embedded system blocks (ESBs) to support register-intensive and memory functions such as FIFOs and dual-port RAM.
  • Logic and capacity 4,160 logic elements and up to 263,000 system gates provide programmable logic density for mid-range designs.
  • Embedded memory 53,248 total RAM bits of on-chip memory for data buffering, small on-chip storage and FIFO structures.
  • I/O and interface support 246 user I/O pins with MultiVolt I/O interface support to connect with 1.8 V, 2.5 V, 3.3 V and 5.0 V devices; supports a wide range of high-speed standards described in the APEX 20K family documentation.
  • Clock management On-chip clock resources including multiple PLLs, a built-in low-skew clock tree and features for clock phase/shift and multiplication/division.
  • Power and packaging Designed for low-power operation at an internal supply of 1.71 V–1.89 V, supplied in a 324-ball fine-pitch BGA (324-FBGA, 19×19) surface-mount package.
  • Commercial temperature grade Rated for 0 °C to 85 °C operating temperature and RoHS compliant for environmental compliance in commercial applications.

Typical Applications

  • Embedded system controllers Integrates logic, memory and clocking to implement SOPC-style embedded controllers and system glue logic.
  • High-speed interface bridging MultiVolt I/O and support for common high-speed I/O standards enable protocol bridging and board-level interface conversion.
  • Memory buffering and FIFOs On-chip ESBs and RAM bits provide buffering, FIFO and small dual-port memory structures for data flow smoothing and transient storage.
  • Custom logic and control Suitable for state machines, control logic and register-intensive functions that leverage LUT logic and dedicated interconnect.

Unique Advantages

  • Integrated SOPC-capable architecture: MultiCore integration of LUTs, product-term logic and ESBs reduces external component count for embedded designs.
  • Balanced mid-range capacity: 4,160 logic elements and 263,000 gates offer a practical density for mid-complexity programmable logic tasks without excessive overhead.
  • Flexible I/O support: 246 I/O pins with MultiVolt compatibility enable straightforward interfacing to multiple voltage domains on mixed-signal boards.
  • On-chip clock resources: Multiple PLLs and a low-skew clock tree support complex clocking schemes and phase/clock adjustments on-chip.
  • Compact surface-mount package: 324-FBGA (19×19) packaging delivers a high-pin-count footprint in a compact form factor for dense board designs.
  • RoHS compliant: Meets RoHS environmental requirements for commercial deployments.

Why Choose EP20K100EFC324-2X?

The EP20K100EFC324-2X combines APEX-20KE family architectural features—integrated LUT and ESB resources, on-chip clock management and extensive I/O—with a commercial-grade operating range to support mid-range FPGA designs. Its mix of logic elements, embedded RAM and flexible I/O makes it well suited to embedded controllers, interface bridging and memory-buffering tasks where SOPC-style integration and configurable clocking are valuable.

For teams developing compact, board-level programmable solutions, the EP20K100EFC324-2X provides a robust set of verifiable hardware resources and packaging choices that simplify BOM and system integration while remaining within commercial temperature and supply constraints.

Request a quote or submit an inquiry to receive pricing, availability and board-level integration support for the EP20K100EFC324-2X.

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