EP20K100EFC324-2N

The EP20K100EFC324-2N is an APEX-20KE series Field Programmable Gate Array (FPGA) in a 324-ball BGA package, delivering 4,160 logic elements and approximately 53,248 bits of embedded RAM. It integrates MultiCore architecture components—look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs)—for compact system implementation and flexible on-chip memory usage.

Designed for commercial applications, this device targets designs that require moderate logic density, abundant I/O (246 pins), multi-voltage I/O interfacing and flexible clock management while operating from a 1.71 V to 1.89 V core supply within a 0 °C to 85 °C temperature range.

Key Features

• MultiCore architecture Integrates LUT logic, product-term logic and embedded system blocks (ESBs) to implement register‑intensive and memory functions on-chip.
• Logic resources 4,160 logic elements providing implementation capacity equivalent to the device’s listed 263,000 gates for mid-range programmable logic designs.
• Embedded memory Approximately 53,248 bits of on‑chip RAM available for FIFOs, dual-port RAM and content-addressable memory (CAM) implementations via ESBs.
• Rich I/O 246 user I/O pins with MultiVolt I/O support for 1.8 V, 2.5 V, 3.3 V and 5.0 V interfaces and programmable output slew-rate and clamp options.
• Clock management Flexible clocking with up to four phase-locked loops (PLLs), built-in low-skew clock tree and features such as ClockBoost, ClockShift and ClockLock for phase/delay control.
• High-speed interfaces Support for high-speed external memories (including DDR SDRAM and ZBT SRAM) and LVDS performance up to 840 Mbits per channel; PCI 3.3 V compliance for 33/66 MHz operation is supported by the device family.
• Power and supply Core operating range specified at 1.71 V to 1.89 V and power-saving modes available via ESB configuration.
• Package & mounting 324‑ball FBGA (19 × 19 mm) surface-mount package suited for compact board-level integration.
• Commercial temperature grade Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• System-on-programmable-chip (SOPC) integration — Implement embedded controllers, custom peripherals and system glue logic using the device’s MultiCore architecture and ESBs.
• Memory interface controllers — Implement DDR SDRAM and ZBT SRAM interfaces using on-chip memory and high-speed I/O capability.
• PCI-based expansion and bridging — Support for PCI 3.3 V operation enables use in bus-interface and expansion card designs.
• High-speed serial and differential signaling — LVDS-capable channels (up to 840 Mbits/channel) suit high-throughput links and protocol conversion tasks.

Unique Advantages

• Highly integrated MultiCore design: Combines LUTs, product-term logic and ESBs to reduce external components and consolidate system functions on-chip.
• Balanced logic and memory resources: 4,160 logic elements paired with ~53 Kbits of embedded RAM enable mixed compute-and-buffer architectures without large external memory dependency.
• Flexible I/O and voltage compatibility: MultiVolt I/O and programmable clamps simplify interfacing to a wide range of legacy and modern peripherals.
• Robust clocking features: Up to four PLLs plus ClockBoost/ClockShift/ClockLock options allow designers to manage skew, multiply/divide clocks and fine-tune timing on complex designs.
• Compact BGA footprint: 324-FBGA (19 × 19 mm) package provides high I/O density in a space-efficient form factor for board-level integration.
• Standards-oriented I/O support: Family-level support for PCI, LVDS and common memory interfaces helps shorten design cycles for interface-intensive applications.

Why Choose EP20K100EFC324-2N?

The EP20K100EFC324-2N positions itself as a mid-density, feature-rich FPGA option within the APEX-20KE family, offering a practical balance of logic elements, embedded RAM and high I/O count in a compact 324‑BGA package. Its MultiCore architecture and ESB-based memory enable integration of both logic and buffering functions on-chip, reducing external BOM and simplifying system architecture.

This device is well suited for commercial designs that require multi-voltage I/O compatibility, flexible clock management and support for high-speed memory and serial interfaces. The combination of available resources, package density and family-level features makes it a fit for embedded systems, interface controllers and I/O-heavy FPGA implementations where board space and integration matter.

Request a quote or submit an inquiry for pricing and availability to evaluate the EP20K100EFC324-2N for your next design.