EP20K100ETC144-1X

IC FPGA 92 I/O 144TQFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 92 53248 4160 144-LQFP

Quantity 913 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O92Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs416Number of Logic Elements/Cells4160
Number of Gates263000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248

Overview of EP20K100ETC144-1X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 92 53248 4160 144-LQFP

The EP20K100ETC144-1X is an APEX-20KE family FPGA in a 144-LQFP surface-mount package, providing programmable logic, embedded memory, and flexible I/O in a commercial-grade device. Its MultiCore architecture integrates LUT-based logic, product-term logic and embedded system blocks (ESBs) to support both register‑intensive and memory‑centric functions.

With 4,160 logic elements, approximately 53,248 bits of on-chip RAM, 92 user I/O pins and a maximum of 263,000 system gates, this device targets designs that require mid-density programmable logic, on-chip memory for FIFOs or dual-port RAM, and configurable high-performance I/O. The device operates from a 1.71 V to 1.89 V supply and supports an ambient temperature range of 0 °C to 85 °C.

Key Features

  • Core architecture  MultiCore architecture combining LUT logic, product-term logic and embedded system blocks (ESBs) for register‑intensive and memory‑oriented functions.
  • Logic capacity  4,160 logic elements (LEs) and up to 263,000 system gates provide mid-range programmable logic resources for custom digital functions.
  • Embedded memory  Approximately 53,248 bits of on-chip RAM suitable for FIFOs, dual-port RAM and small data buffers implemented in ESBs.
  • I/O and interface support  92 user I/O pins with family-level support for MultiVolt I/O, advanced I/O standards and high-speed memory interfaces; programmable output slew-rate and individual tri-state control help manage signal integrity.
  • Clock management  Flexible clock resources including up to four PLLs, a built-in low-skew clock tree and features for phase/ delay control, enabling deterministic system timing.
  • Power and low-power options  Designed for low-power operation with an ESB programmable power-saving mode and a defined supply range of 1.71 V to 1.89 V.
  • Package and operating range  Surface-mount 144-LQFP (144-TQFP 20×20 footprint) package; commercial-grade device rated for 0 °C to 85 °C operation.

Typical Applications

  • System integration and SOPC designs  Use embedded system blocks and LUT logic to implement on-chip FIFOs, dual-port RAM and content-addressable memory for compact system-on-programmable-chip implementations.
  • High-speed memory interfaces  Deploy the device where support for external high-speed memories such as DDR SDRAM is required alongside programmable logic for control and buffering.
  • PCI and peripheral bridging  Leverage the family-level support for PCI Local Bus signaling and high-performance I/O to implement bus interfaces and protocol bridging.
  • Custom control and data-path logic  Implement register-intensive and combinatorial functions using LUT logic and product-term resources for application-specific processing and control tasks.

Unique Advantages

  • Highly integrated architecture: Combines LUT logic, product-term logic and ESBs to reduce external component count and simplify board-level design.
  • Balanced logic and memory: 4,160 logic elements paired with ~53,248 bits of embedded RAM allow simultaneous implementation of control logic and local data storage.
  • Flexible, high-performance I/O: 92 I/O pins with MultiVolt support and programmable I/O controls enable direct interfacing with a variety of external devices and memory types.
  • Deterministic clocking: Up to four PLLs and a low-skew clock distribution support reliable timing for synchronous designs and high-speed interfaces.
  • Commercial-grade, surface-mount package: 144-LQFP surface-mount package and 0 °C to 85 °C operating range suit a wide array of commercial embedded applications.

Why Choose EP20K100ETC144-1X?

The EP20K100ETC144-1X offers a practical balance of programmable logic, embedded memory and flexible I/O in a compact 144-LQFP package. Its MultiCore architecture and ESB capabilities make it well suited for designs that require both register‑intensive logic and on-chip memory resources, while clock management and I/O flexibility support reliable interfacing with high-speed peripherals and external memories.

Engineers seeking a commercial‑grade, mid-density FPGA for system integration, protocol bridging or custom data-path control will find this device provides verifiable, on-chip resources and configurable power/clock options to simplify board design and accelerate development.

Request a quote or submit a pricing inquiry today to evaluate EP20K100ETC144-1X for your next programmable-logic design.

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