EP20K100ETI144-3

The EP20K100ETI144-3 is an Intel APEX-20K® FPGA in a 144-LQFP surface-mount package. It uses the APEX 20K family MultiCore architecture, combining look-up table (LUT) logic, product-term logic, and embedded memory to implement register- and memory-intensive functions.

With 4,160 logic elements, 53,248 total RAM bits, 92 user I/O pins, industrial-grade qualification and an operating range of −40 °C to 100 °C, this device is suited for mid-range embedded and industrial digital designs that require integrated logic, on-chip memory and flexible I/O.

Key Features

• Core architecture (MultiCore)  MultiCore architecture integrates LUT logic, product-term logic and embedded system blocks (ESBs) for a mix of register- and memory-oriented implementations.
• Logic capacity  4,160 logic elements and up to 263,000 system gates provide capacity for mid-range FPGA designs and custom logic functions.
• Embedded memory (ESBs)  53,248 total RAM bits of on-chip memory; ESBs can implement FIFOs, dual-port RAM and content-addressable memory for local buffering and memory-mapped functions.
• I/O and interface flexibility  92 user I/O pins with family-level MultiVolt I/O interface support and programmable I/O features for interfacing with a range of voltage domains.
• Clock and timing  Family-level flexible clock management with up to four PLLs, a low-skew clock tree and features such as ClockLock, ClockBoost and ClockShift for phase and delay control.
• Power and supply  Low-voltage internal supply specified at 1.71 V to 1.89 V and design emphasis on low-power operation.
• Package and environmental  Surface-mount 144-LQFP (supplier device package 144-TQFP 20×20), RoHS compliant, and rated for industrial operation from −40 °C to 100 °C.

Typical Applications

• Industrial control  Use for motor control, sensor interfacing and real-time control logic where industrial temperature range and robust I/O are required.
• Embedded systems & SOPC integration  Implement custom peripherals, memory-mapped logic and on-chip FIFOs using the APEX 20K MultiCore architecture and ESBs.
• Communications and data buffering  Build protocol bridges, buffering and interface logic that benefit from on-chip RAM and flexible I/O signaling.
• Prototyping and custom glue logic  Mid-range logic capacity and a compact 144-LQFP package make it suitable for board-level prototyping and production glue logic.

Unique Advantages

• Highly integrated mid-range logic: 4,160 logic elements and up to 263,000 gates give designers substantial on-chip resources for complex glue logic and custom functions.
• On-chip memory for local buffering: 53,248 RAM bits and ESB structures enable efficient FIFO and dual-port RAM implementations without external memory for many use cases.
• Flexible I/O capability: 92 user I/Os and family-level MultiVolt interface support simplify interfacing across different voltage domains and peripheral devices.
• Industrial-ready thermal performance: Rated for −40 °C to 100 °C and supplied in an industry-standard 144-LQFP surface-mount package for robust deployment.
• Low-voltage core operation: Internal supply specified at 1.71 V–1.89 V supports low-power designs while enabling integration with mixed-voltage I/O domains.
• Regulatory and assembly readiness: RoHS-compliant and packaged for surface-mount assembly.

Why Choose EP20K100ETI144-3?

EP20K100ETI144-3 delivers a balanced combination of logic density, embedded memory and flexible I/O in an industrial-grade FPGA package. It is tailored for mid-range embedded and industrial applications where on-chip RAM, predictable clock management and a compact 144-LQFP footprint reduce system complexity and bill of materials.

This device is well suited to engineers and OEMs building control systems, custom peripherals, communications interfaces or board-level prototypes that require a reliable, RoHS-compliant programmable logic solution with an extended operating temperature range.

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