EP20K100FC144-1X

The EP20K100FC144-1X is an Intel APEX-20K family programmable logic device delivering a balance of integration and I/O flexibility in a compact 144-LQFP surface-mount package. Built on the APEX MultiCore architecture, it combines LUT-based logic, product-term logic and embedded system blocks to address embedded control, high-speed I/O bridging and memory interface functions.

With 4,160 logic elements, 53,248 bits of on-chip RAM implemented as 26 embedded system blocks (ESBs), and up to 93 user I/Os, this commercial-grade device is suited to designs that require medium-density logic, multi-voltage interfacing and configurable clocking and I/O features.

Key Features

• Core architecture MultiCore architecture integrating look-up table (LUT) logic, product-term logic and embedded memory for flexible mapping of register-intensive and combinatorial functions.
• Logic capacity Approximately 4,160 logic elements and 263,000 maximum system gates to implement medium-density programmable logic designs.
• Embedded memory 53,248 bits of on-chip RAM provided through 26 embedded system blocks (ESBs) for FIFOs, dual-port RAM and CAM-style functions.
• I/O and interface support 93 user I/Os with MultiVolt I/O interface support (1.8 V, 2.5 V, 3.3 V and 5.0 V as supported by the family) and documented support for high-speed memory interfaces (including DDR SDRAM and ZBT SRAM) and PCI (3.3 V operation at 33/66 MHz, 32/64-bit).
• Clocking and timing Flexible clock management with up to four phase-locked loops (PLLs), up to eight global clock signals, ClockLock, ClockBoost and ClockShift features for programmable phase/delay and frequency scaling.
• Low-power design Designed for low-power operation with internal supply centered at 2.5 V and ESB programmable power-saving modes; specified supply range 2.375 V to 2.625 V.
• Package and thermal 144-LQFP surface-mount package (supplier variant 144-TQFP, 20×20) and commercial operating temperature range of 0 °C to 85 °C.
• Standards and advanced I/O Support for advanced I/O signaling including LVDS and other high-speed standards, programmable output slew-rate control, and per-pin tri-state enable and clamp control.
• Compliance RoHS compliant.

Typical Applications

• Memory interface and buffering Implement DDR SDRAM or ZBT SRAM controllers, FIFOs and buffering logic using the device’s ESBs and on-chip RAM.
• PCI-based I/O and bus bridging Use the APEX features and 3.3 V PCI support to implement bus bridges, protocol translation or custom I/O subsystems.
• Mixed-voltage system glue logic MultiVolt I/O capability and flexible I/O controls suit designs that need to interface between 1.8 V, 2.5 V, 3.3 V and 5.0 V domains.
• Embedded control and peripheral integration Combine LUT logic and ESB memory to implement control logic, peripheral interfaces and custom state machines in a single device.

Unique Advantages

• Balanced integration: Combines LUT logic, product-term logic and embedded memory blocks to reduce external component count for medium-density designs.
• Configurable I/O flexibility: 93 user I/Os with MultiVolt support and programmable I/O controls enable easy interfacing across voltage domains and standards.
• Robust clock management: Multiple PLLs and programmable clock features enable precise timing control for complex synchronous designs.
• On-chip memory resources: 53,248 bits of embedded RAM across 26 ESBs support FIFOs, dual-port RAM and CAM-like implementations without sacrificing logic resources.
• Compact, surface-mount packaging: 144-LQFP package provides a space-efficient footprint for board-level integration in commercial applications.
• Regulatory and environmental readiness: RoHS compliance for environmentally conscious designs.

Why Choose EP20K100FC144-1X?

The EP20K100FC144-1X positions itself as a medium-density, commercial-grade FPGA solution within the Intel APEX-20K family, offering a practical combination of logic elements, embedded memory and flexible I/O in a compact 144-LQFP package. Its MultiCore architecture and ESB resources make it suitable for designs that require integrated memory structures alongside LUT and product-term logic.

This part is a fit for customers building boards that need multi-voltage I/O interfacing, on-chip RAM for buffering or FIFOs, and configurable clock management, while retaining a small PCB footprint and commercial-temperature operation. The device’s documented family features and RoHS compliance provide predictable integration and lifecycle support for production designs.

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