EP20K100FC324-1

The EP20K100FC324-1 is a commercial-grade APEX-20K® field programmable gate array (FPGA) manufactured by Intel. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory to support programmable system integration.

With 4,160 logic elements, approximately 53,248 bits of on-chip RAM, and up to 252 I/O pins in a 324-ball FBGA (19×19) package, this device targets commercial embedded and system designs that require moderate logic density, flexible I/O, and integrated memory resources.

Key Features

• Logic Capacity — 4,160 logic elements (LEs) and approximately 263,000 system gates provide mid-range programmable logic resources for combinatorial and register-intensive functions.
• Embedded Memory — Approximately 53,248 total RAM bits (embedded system blocks) for FIFOs, dual-port RAM or CAM implementations.
• I/O Count & Flexibility — 252 I/O pins with MultiVolt I/O interface support to work with 1.8 V, 2.5 V, 3.3 V and 5.0 V signal levels as supported by the APEX 20K family.
• Clocking & Timing — Family-level clock-management features include multiple PLLs, a built-in low-skew clock tree, and up to eight global clocks for deterministic timing control.
• Package & Mounting — 324-FBGA (19×19) surface-mount package, suitable for compact board layouts where a BGA is required.
• Power & Supply — Internal supply based on the APEX 20K specification (VCCINT 2.5 V for EP20K100); device supply range 2.375 V to 2.625 V as specified for this part number.
• Operating Range & Compliance — Commercial operating temperature range 0 °C to 85 °C and RoHS-compliant status.

Typical Applications

• Memory Interface Controllers — Implement DDR SDRAM or other external memory interfaces using the device’s embedded RAM and dedicated I/O support for high-speed memories.
• Peripheral & Bus Bridging — PCI/PCI-like bus interfacing and custom peripheral glue logic leveraging flexible I/O standards supported by the APEX 20K family.
• Embedded System Integration — Consolidate custom logic, FIFOs and dual-port RAM functions for compact embedded systems using on-chip ESBs and LUT logic.
• High-Speed I/O and Data Paths — Implement LVDS or other high-performance I/O topologies and low-skew clock distribution for data-path and communication modules.

Unique Advantages

• Balanced Logic and Memory: 4,160 logic elements paired with approximately 53,248 bits of embedded RAM delivers a balanced resource mix for mid-density designs.
• High I/O Count: 252 I/O pins provide ample connectivity for designs requiring many device interfaces without external buffering.
• Flexible Clocking: Multiple PLLs and a low-skew clock tree enable precise timing control across complex synchronous logic.
• Compact BGA Package: 324-FBGA (19×19) minimizes PCB footprint while supporting high-pin-count routing.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial deployment requirements.
• Vendor Backing: Manufactured by Intel and documented within the APEX-20K family specification for access to family-level design information and tooling.

Why Choose EP20K100FC324-1?

The EP20K100FC324-1 offers a mid-density APEX-20K FPGA solution for commercial embedded and system designs that need a mix of logic, embedded RAM, and extensive I/O in a compact BGA package. Its MultiCore architecture and family-level clock and I/O capabilities make it suitable for memory interfaces, bus bridging, and custom embedded logic blocks.

This device is well suited to engineering teams building commercial products who require a programmable, integrated logic solution with clear specifications for supply voltage, operating temperature, I/O count, and package type. The APEX-20K family documentation provides further architecture- and feature-level detail to support design and integration.

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