EP20K100FC324-3V

The EP20K100FC324-3V is an APEX-20K® field programmable gate array (FPGA) from Altera, provided in a 324-ball BGA package. It delivers reprogrammable digital logic with a combination of 4,160 logic elements, approximately 53,248 bits of embedded memory, and 252 user I/O pins targeted for commercial-grade electronic designs.

With a compact 324-FBGA (19×19) package, surface-mount mounting, and a core supply range of 1.71 V to 1.89 V, this device is suitable for applications that require moderate gate density (approximately 263,000 gates) and on-chip memory within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 4,160 logic elements provide the programmable fabric for custom digital functions and control logic.
• Embedded Memory Approximately 53,248 bits of on-chip RAM for buffering, lookup tables, and small data storage needs.
• I/O Capacity 252 user I/O pins support a wide range of external interfaces and signal connections in a single device.
• Gate Density Approximately 263,000 gates enable integration of multiple small-to-moderate logic functions into a single FPGA.
• Package & Mounting 324-BGA (324-FBGA, 19×19) surface-mount package provides a compact footprint for board-level integration.
• Power Core supply voltage range from 1.71 V to 1.89 V for designs targeting this nominal supply domain.
• Operating Temperature Commercial-grade operation from 0 °C to 85 °C.
• Compliance RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and peripheral interfacing using the device's 4,160 logic elements and 252 I/O pins.
• Interface Bridging and Glue Logic — Combine multiple protocol conversions and I/O expansion in a single 324-BGA package to reduce board complexity.
• Prototyping and Evaluation — Use the reprogrammable fabric and on-chip RAM to iterate digital designs and validate system-level functions in commercial designs.

Unique Advantages

• High I/O Density: 252 user I/O pins enable extensive external connectivity without additional interface chips.
• Integrated Memory: Approximately 53,248 bits of embedded RAM reduce the need for external memory for small buffering and lookup tasks.
• Compact BGA Package: 324-FBGA (19×19) provides a space-efficient footprint for board designs constrained by area.
• Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial electronics deployment.
• Defined Power Domain: Narrow core supply range (1.71 V to 1.89 V) simplifies power-supply planning for the FPGA core.
• RoHS Compliant: Supports lead-free manufacturing requirements.

Why Choose EP20K100FC324-3V?

The EP20K100FC324-3V combines a moderate logic element count, substantial on-chip RAM, and a large number of I/O in a compact 324-BGA surface-mount package, making it a practical choice for commercial-grade designs that require flexible, reconfigurable logic and dense interfacing. Its specifications are well suited to designers needing integrated logic and memory resources within a defined power and temperature envelope.

As a member of the APEX-20K® family from Altera, this device provides a clear option for engineers and procurement teams looking to consolidate functions, reduce board-level component count, and maintain a predictable footprint and thermal envelope for commercial electronic products.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the EP20K100FC324-3V.