EP20K100QC240-1
| Part Description |
APEX-20K® Field Programmable Gate Array (FPGA) IC 189 53248 4160 240-BFQFP |
|---|---|
| Quantity | 830 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 189 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 416 | Number of Logic Elements/Cells | 4160 | ||
| Number of Gates | 263000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248 |
Overview of EP20K100QC240-1 – APEX-20K® Field Programmable Gate Array (FPGA) IC 189 53248 4160 240-BFQFP
The EP20K100QC240-1 is a commercial-grade FPGA from Intel's APEX-20K family implementing the family’s MultiCore architecture and system-on-a-programmable-chip (SOPC) integration concepts. It combines lookup-table (LUT) logic, product-term logic and embedded memory to address embedded logic, memory-interface and I/O-rich design requirements.
With 4,160 logic elements, approximately 0.053 Mbits of embedded memory, and 189 I/O pins in a 240-BFQFP surface-mount package, this device fits applications that require balanced logic density, embedded memory and flexible board-level interfacing at commercial temperature ranges.
Key Features
- Core architecture: MultiCore architecture with LUT logic and product-term logic enabling register-intensive and combinatorial functions as described in the APEX-20K family.
- Logic capacity: 4,160 logic elements supporting up to 263,000 system gates for mid-range programmable logic implementations.
- Embedded memory: Approximately 0.053 Mbits (53,248 bits) of on-chip RAM for FIFOs, dual-port RAM and other embedded memory functions.
- I/O resources: 189 user I/O pins provided in the 240-BFQFP package to support I/O-heavy designs and board-level interfacing.
- Clock management: Family-level support for flexible clocking, including multiple PLLs, low-skew clock tree and programmable clock-phase/delay features (APEX-20K family capabilities).
- Power and voltage: Specified supply range of 2.375 V to 2.625 V for the device internal supply; APEX-20K family devices are designed for low-power operation with programmable power-saving options.
- Package and mounting: 240-BFQFP (supplier package 240-PQFP, 32×32) in a surface-mount form factor for standard PCB assembly processes.
- Commercial temperature range: Rated for 0 °C to 85 °C operation to suit commercial applications.
- Regulatory compliance: RoHS compliant.
Typical Applications
- Embedded systems and SOPC integration: Combine logic, embedded RAM and system-level functions where on-chip memory and programmable logic simplify design partitioning.
- Memory-interface logic: Implement controllers, buffers and interface glue logic that benefit from the device’s embedded RAM resources and configurable logic elements.
- I/O-heavy designs: Use the 189 I/O pins in applications requiring multiple peripheral interfaces or dense board-level connectivity.
- Prototyping and system integration: Mid-range gate and logic-element counts make this device suitable for development platforms and proof-of-concept systems within commercial temperature limits.
Unique Advantages
- Balanced logic and memory density: 4,160 logic elements paired with approximately 0.053 Mbits of embedded RAM provide a balance between combinational/registered logic and on-chip storage.
- System-level integration (SOPC): MultiCore architecture supports integration of lookup-table logic and embedded system blocks to reduce external component count for common embedded functions.
- Flexible interfacing: 189 I/O pins in a 240-BFQFP package enable varied board-level connectivity while maintaining a compact surface-mount footprint.
- Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS compliance to meet standard commercial product requirements.
- Proven family capabilities: As a member of the APEX-20K family, the device benefits from documented clock management and I/O feature sets inherent to the family architecture.
Why Choose EP20K100QC240-1?
The EP20K100QC240-1 positions itself as a commercial-grade, mid-density FPGA option for designers who need a mix of logic elements, on-chip RAM and substantial I/O in a standard 240-BFQFP surface-mount package. Its MultiCore APEX-20K architecture and SOPC-oriented features make it suitable for embedded systems, memory-interface logic and I/O-centric designs.
Choose this device when your design requires a well-documented APEX-20K family FPGA backed by Intel’s product lineage, with a focus on integration, moderate logic density and commercial-temperature operation for reliable production use.
Request a quote or submit a procurement inquiry to receive pricing and availability for the EP20K100QC240-1.

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