EP20K100FC324-3

The EP20K100FC324-3 is an APEX-20K family FPGA device delivering a balanced mix of logic capacity, on-chip memory and flexible I/O in a 324-ball BGA package. Built on the APEX MultiCore architecture, it integrates look-up table (LUT) logic, product-term logic and embedded system blocks (ESBs) to implement register‑intensive and memory functions. The device is suited for commercial designs requiring mid-range programmable logic, high-speed I/O and on-chip RAM for functions such as FIFOs, dual-port RAM and CAMs.

Key Features

• APEX MultiCore architecture Integrates LUT logic, product-term logic and embedded system blocks (ESBs) for flexible implementation of both register-intensive and memory-intensive functions.
• Logic capacity 4,160 logic elements (LEs) and a maximum of 263,000 gates provide mid-range programmable logic resources for custom digital designs.
• Embedded memory 53,248 bits of on-chip RAM (approximately 0.05 Mbits) and ESB capability to implement FIFOs, dual-port RAM and CAMs.
• I/O and interface flexibility Up to 252 user I/O pins with MultiVolt I/O support, enabling interfaces with 2.5 V, 3.3 V and 5.0 V domains as documented for the APEX-20K family.
• Clock management Flexible clocking with support for multiple phase-locked loops (PLLs), a built-in low-skew clock tree and programmable clock features for reduced delay and skew.
• Package and mounting Surface-mount 324-BGA (324-FBGA, 19×19) package that balances board-area efficiency and I/O density.
• Power and supply Specified supply range 2.375 V to 2.625 V; internal VCCINT for EP20K100 devices is 2.5 V according to the APEX-20K data.
• Commercial operating range Rated for 0 °C to 85 °C operation for commercial-grade deployments.
• Standards and high-speed support APEX-20K family-level features include support for high-speed memory interfaces and advanced I/O standards such as LVDS and PCI (as documented for the family).

Typical Applications

• High-speed memory controllers Implement DDR SDRAM or ZBT SRAM interfaces and on-chip FIFOs using the device's ESBs and embedded RAM.
• PCI and bus bridging Use the device in PCI-based systems and protocol-bridging applications leveraging its flexible I/O and timing capabilities.
• Custom digital logic and glue functions Replace fixed-function glue logic with deterministic programmable logic using the 4,160 LEs and comprehensive I/O options.
• Signal conditioning and interface conversion Implement LVDS or other high-speed I/O endpoints and local protocol translation within a compact BGA footprint.

Unique Advantages

• Balanced mid-range logic density: 4,160 logic elements and 263,000 gates provide suitable capacity for complex glue logic and mid-size IP cores without overprovisioning.
• Integrated on-chip memory: 53,248 bits of RAM and ESB support enable efficient implementation of FIFOs, dual-port RAM and CAMs, reducing external memory requirements.
• Flexible I/O voltage support: MultiVolt I/O capability and up to 252 user I/O pins simplify interfacing to multiple voltage domains and external peripherals.
• Advanced clocking: Multiple PLLs and a low-skew clock tree support precise timing and clock domain management for synchronous designs.
• Compact BGA package: 324-BGA (19×19) provides high pin count in a compact surface-mount form factor for space-constrained boards.
• Commercial-grade operating range: Specified operation from 0 °C to 85 °C for standard commercial deployments.

Why Choose EP20K100FC324-3?

The EP20K100FC324-3 positions itself as a capable mid-range FPGA offering a practical balance of logic elements, embedded RAM and flexible I/O in a compact 324‑BGA package. Its APEX MultiCore architecture and ESB-based memory features make it well suited for commercial designs that require on-chip FIFOs, memory controllers and interface bridging while keeping board-level BOM and complexity under control.

This device is appropriate for engineering teams developing communications interfaces, memory subsystems, protocol bridges and custom digital logic where predictable clocking, multi-voltage I/O and a commercial temperature range are primary requirements.

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