EP20K30EFI144-2X

IC FPGA 93 I/O 144FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 93 24576 1200 144-BGA

Quantity 1,042 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-FBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-BGANumber of I/O93Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs120Number of Logic Elements/Cells1200
Number of Gates113000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EP20K30EFI144-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 93 I/Os 24,576 bits 1,200 logic elements 144-BGA

The EP20K30EFI144-2X is an Intel APEX-20KE family FPGA in a 144-BGA surface-mount package, offering a compact, industrial-grade programmable logic solution. It combines MultiCore architecture with embedded system blocks (ESBs) to deliver integrated LUT-based logic, product-term logic, and on-chip embedded memory for control, buffering and system integration tasks.

Designed for industrial applications, this device provides 1,200 logic elements, approximately 24,576 bits of embedded RAM, and 93 user I/Os, enabling mid-density logic integration with flexible I/O and clock-management capabilities.

Key Features

  • Core architecture  MultiCore architecture integrating look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs) for mixed register-intensive and combinatorial functions.
  • Logic resources  1,200 logic elements and 113,000 gates provide mid-range programmable logic capacity for control and glue-logic applications.
  • Embedded memory  Approximately 24,576 bits of on-chip RAM implemented in ESBs for FIFOs, dual-port RAM and content-addressable memory (CAM) uses.
  • I/O and interface flexibility  93 user I/Os with MultiVolt I/O interface support to interoperate with multiple I/O voltage domains; programmable clamp and slew-rate control are supported by the family architecture.
  • Clock management  Flexible clock management including up to four PLLs, a built-in low-skew clock tree and up to eight global clock signals to support complex timing domains.
  • Package and mounting  144-BGA (supplier package 144-FBGA, 13×13) surface-mount package for compact board layouts.
  • Power  Internal/primary voltage supply range of 1.71 V to 1.89 V and family-level design targeted for low-power operation.
  • Temperature and grade  Industrial-grade device rated for operation from −40°C to 100°C.
  • Standards and high-speed I/O support  Family-level support for high-speed external memory interfaces and advanced I/O standards, enabling direct connection to fast peripherals (as described in family documentation).
  • RoHS compliant  Device meets RoHS environmental compliance.

Typical Applications

  • Industrial control and automation  Implement motor control logic, sensor interfacing and deterministic I/O handling using on-chip LUTs and embedded memory for buffering and state machines.
  • Embedded system integration  Integrate glue logic, custom peripherals and SOPC-style building blocks that leverage ESBs for FIFOs and dual-port RAM.
  • Communications and interface bridging  Use flexible I/O and clock-management features to bridge protocols, handle bus arbitration and support high-speed memory interfaces.
  • Data buffering and temporary storage  Use embedded RAM to implement FIFOs and small buffering functions for real-time data flows and peripheral handoff.

Unique Advantages

  • Integrated MultiCore architecture: Reduces external component count by combining LUT logic, product-term logic and embedded memory in a single device.
  • Balanced mid-range capacity: 1,200 logic elements and 113,000 gates provide a practical balance between density and cost for control-centric designs.
  • On-chip ESBs for memory functions: Approximately 24,576 bits of embedded RAM allow implementation of FIFOs, dual-port RAM and CAM without external memory for many use cases.
  • Flexible clocking: Multiple PLLs and global clock resources simplify multi-domain timing and reduce clock distribution complexity.
  • Industrial temperature rating: Specified for −40°C to 100°C operation to meet demanding environmental requirements in industrial deployments.
  • Compact package: 144-BGA (13×13 FBGA) enables dense PCB integration suitable for space-constrained designs.

Why Choose EP20K30EFI144-2X?

The EP20K30EFI144-2X positions as a practical, industrial-grade FPGA choice for mid-density designs that require on-chip memory, flexible I/O and robust clock management. Its combination of 1,200 logic elements, embedded RAM and 93 I/Os supports a wide range of control, buffering and interface tasks while keeping board-level complexity low.

This device suits engineers and designers targeting industrial automation, embedded system integration and communications interface functions who need a proven family architecture with integrated memory blocks and configurable clock resources for dependable, compact implementations.

Request a quote or submit a quotation request today to evaluate EP20K30EFI144-2X for your next design.

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