EP20K30EFI144-2X
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 93 24576 1200 144-BGA |
|---|---|
| Quantity | 1,042 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-BGA | Number of I/O | 93 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 120 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | 113000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EP20K30EFI144-2X – APEX-20KE® Field Programmable Gate Array (FPGA) IC 93 I/Os 24,576 bits 1,200 logic elements 144-BGA
The EP20K30EFI144-2X is an Intel APEX-20KE family FPGA in a 144-BGA surface-mount package, offering a compact, industrial-grade programmable logic solution. It combines MultiCore architecture with embedded system blocks (ESBs) to deliver integrated LUT-based logic, product-term logic, and on-chip embedded memory for control, buffering and system integration tasks.
Designed for industrial applications, this device provides 1,200 logic elements, approximately 24,576 bits of embedded RAM, and 93 user I/Os, enabling mid-density logic integration with flexible I/O and clock-management capabilities.
Key Features
- Core architecture MultiCore architecture integrating look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs) for mixed register-intensive and combinatorial functions.
- Logic resources 1,200 logic elements and 113,000 gates provide mid-range programmable logic capacity for control and glue-logic applications.
- Embedded memory Approximately 24,576 bits of on-chip RAM implemented in ESBs for FIFOs, dual-port RAM and content-addressable memory (CAM) uses.
- I/O and interface flexibility 93 user I/Os with MultiVolt I/O interface support to interoperate with multiple I/O voltage domains; programmable clamp and slew-rate control are supported by the family architecture.
- Clock management Flexible clock management including up to four PLLs, a built-in low-skew clock tree and up to eight global clock signals to support complex timing domains.
- Package and mounting 144-BGA (supplier package 144-FBGA, 13×13) surface-mount package for compact board layouts.
- Power Internal/primary voltage supply range of 1.71 V to 1.89 V and family-level design targeted for low-power operation.
- Temperature and grade Industrial-grade device rated for operation from −40°C to 100°C.
- Standards and high-speed I/O support Family-level support for high-speed external memory interfaces and advanced I/O standards, enabling direct connection to fast peripherals (as described in family documentation).
- RoHS compliant Device meets RoHS environmental compliance.
Typical Applications
- Industrial control and automation Implement motor control logic, sensor interfacing and deterministic I/O handling using on-chip LUTs and embedded memory for buffering and state machines.
- Embedded system integration Integrate glue logic, custom peripherals and SOPC-style building blocks that leverage ESBs for FIFOs and dual-port RAM.
- Communications and interface bridging Use flexible I/O and clock-management features to bridge protocols, handle bus arbitration and support high-speed memory interfaces.
- Data buffering and temporary storage Use embedded RAM to implement FIFOs and small buffering functions for real-time data flows and peripheral handoff.
Unique Advantages
- Integrated MultiCore architecture: Reduces external component count by combining LUT logic, product-term logic and embedded memory in a single device.
- Balanced mid-range capacity: 1,200 logic elements and 113,000 gates provide a practical balance between density and cost for control-centric designs.
- On-chip ESBs for memory functions: Approximately 24,576 bits of embedded RAM allow implementation of FIFOs, dual-port RAM and CAM without external memory for many use cases.
- Flexible clocking: Multiple PLLs and global clock resources simplify multi-domain timing and reduce clock distribution complexity.
- Industrial temperature rating: Specified for −40°C to 100°C operation to meet demanding environmental requirements in industrial deployments.
- Compact package: 144-BGA (13×13 FBGA) enables dense PCB integration suitable for space-constrained designs.
Why Choose EP20K30EFI144-2X?
The EP20K30EFI144-2X positions as a practical, industrial-grade FPGA choice for mid-density designs that require on-chip memory, flexible I/O and robust clock management. Its combination of 1,200 logic elements, embedded RAM and 93 I/Os supports a wide range of control, buffering and interface tasks while keeping board-level complexity low.
This device suits engineers and designers targeting industrial automation, embedded system integration and communications interface functions who need a proven family architecture with integrated memory blocks and configurable clock resources for dependable, compact implementations.
Request a quote or submit a quotation request today to evaluate EP20K30EFI144-2X for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018