EP20K30EQC208-1

IC FPGA 125 I/O 208QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 125 24576 1200 208-BFQFP

Quantity 30 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O125Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs120Number of Logic Elements/Cells1200
Number of Gates113000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EP20K30EQC208-1 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 125 24576 1200 208-BFQFP

The EP20K30EQC208-1 is an Intel APEX-20KE family FPGA offering a balanced mix of logic, embedded memory, and I/O for mid-density programmable designs. It implements the family’s MultiCore architecture combining look‑up table (LUT) logic, product-term logic, and embedded system blocks (ESBs) for memory and combinatorial functions.

With 1,200 logic elements, approximately 24,576 bits of on‑chip RAM, and 125 user I/O pins in a 208‑BFQFP surface‑mount package, this device targets embedded systems that require integrated memory structures, flexible I/O interfacing, and moderate gate density within commercial temperature and supply requirements.

Key Features

  • MultiCore architecture and LUT logic
    Family-level MultiCore design integrates LUT-based logic and product-term logic to support both register-intensive and combinatorial functions.
  • Embedded memory (ESB)
    Approximately 24,576 bits of embedded RAM available for FIFOs, dual-port RAM, and content-addressable memory implementations as supported by the APEX 20K ESB architecture.
  • Logic resources
    Provides 1,200 logic elements and up to 113,000 system gates for mid-density custom logic and glue‑logic tasks.
  • I/O capacity and flexibility
    125 user I/O pins with APEX 20K family support for MultiVolt I/O levels to interface with a range of external devices and memory technologies.
  • Clock and timing features
    Family-level support includes flexible clock management with phase-locked loops (PLLs), a built-in low-skew clock tree, and multiple global clock signals for predictable timing.
  • Low-voltage operation
    Internal voltage supply specified at 1.71 V to 1.89 V to support low-power designs.
  • Package and mounting
    208‑BFQFP (208‑PQFP, 28×28) surface-mount package suitable for compact board integration.
  • Commercial grade and environmental compliance
    Commercial temperature range of 0 °C to 85 °C and RoHS‑compliant manufacturing.

Typical Applications

  • Memory interface controllers
    Use embedded RAM and family memory-interface features to implement DDR or ZBT style memory controllers and FIFOs for buffering and data alignment.
  • Embedded system integration
    Leverage SOPC-style integration and ESBs to combine custom logic, FIFOs, and dual-port memories in compact system designs.
  • I/O-intensive control and glue logic
    125 I/O pins and flexible I/O voltage support make the device suitable for bridging and control tasks between mixed-voltage peripherals.
  • Prototyping and mid-density FPGA designs
    Appropriate for prototypes and products requiring moderate logic capacity, on-chip RAM, and configurable I/O in a small package footprint.

Unique Advantages

  • Integrated memory and logic:
    On-chip ESBs provide roughly 24,576 bits of RAM, reducing dependence on external memory for common buffering and storage needs.
  • Balanced mid-density resource mix:
    1,200 logic elements and up to 113,000 system gates deliver sufficient capacity for many embedded applications without excess cost or board area.
  • Flexible interfacing:
    125 user I/O pins and APEX 20K family MultiVolt I/O support simplify connections to mixed-voltage peripherals and memory devices.
  • Compact, surface-mount package:
    208‑BFQFP (28×28 PQFP) provides a space-efficient solution for board-level integration.
  • Commercial temperature and RoHS compliance:
    Qualified for 0 °C to 85 °C operation and RoHS‑compliant for broad commercial deployment.
  • Low-voltage internal operation:
    1.71 V to 1.89 V supply range supports lower-power system architectures.

Why Choose EP20K30EQC208-1?

The EP20K30EQC208-1 positions itself as a practical mid-density FPGA choice within the Intel APEX 20K family, delivering a combination of 1,200 logic elements, embedded RAM, and substantial I/O capacity in a compact 208‑BFQFP package. Its MultiCore architecture and ESB resources make it well suited to designs requiring integrated FIFOs, dual-port RAM, and mixed logic/memory functions while maintaining commercial-grade temperature and RoHS compliance.

This device is a fit for engineers and procurement teams seeking a commercially graded, RoHS-compliant FPGA that balances integration, I/O flexibility, and moderate gate density for embedded control, memory interface, and prototyping applications within the APEX 20K ecosystem.

If you would like pricing, availability, or to request a formal quote for EP20K30EQC208-1, please submit a quote request or contact the sales channel for more information.

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