EP20K30EQC208-1
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 125 24576 1200 208-BFQFP |
|---|---|
| Quantity | 30 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 125 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 120 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | 113000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EP20K30EQC208-1 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 125 24576 1200 208-BFQFP
The EP20K30EQC208-1 is an Intel APEX-20KE family FPGA offering a balanced mix of logic, embedded memory, and I/O for mid-density programmable designs. It implements the family’s MultiCore architecture combining look‑up table (LUT) logic, product-term logic, and embedded system blocks (ESBs) for memory and combinatorial functions.
With 1,200 logic elements, approximately 24,576 bits of on‑chip RAM, and 125 user I/O pins in a 208‑BFQFP surface‑mount package, this device targets embedded systems that require integrated memory structures, flexible I/O interfacing, and moderate gate density within commercial temperature and supply requirements.
Key Features
- MultiCore architecture and LUT logic
Family-level MultiCore design integrates LUT-based logic and product-term logic to support both register-intensive and combinatorial functions. - Embedded memory (ESB)
Approximately 24,576 bits of embedded RAM available for FIFOs, dual-port RAM, and content-addressable memory implementations as supported by the APEX 20K ESB architecture. - Logic resources
Provides 1,200 logic elements and up to 113,000 system gates for mid-density custom logic and glue‑logic tasks. - I/O capacity and flexibility
125 user I/O pins with APEX 20K family support for MultiVolt I/O levels to interface with a range of external devices and memory technologies. - Clock and timing features
Family-level support includes flexible clock management with phase-locked loops (PLLs), a built-in low-skew clock tree, and multiple global clock signals for predictable timing. - Low-voltage operation
Internal voltage supply specified at 1.71 V to 1.89 V to support low-power designs. - Package and mounting
208‑BFQFP (208‑PQFP, 28×28) surface-mount package suitable for compact board integration. - Commercial grade and environmental compliance
Commercial temperature range of 0 °C to 85 °C and RoHS‑compliant manufacturing.
Typical Applications
- Memory interface controllers
Use embedded RAM and family memory-interface features to implement DDR or ZBT style memory controllers and FIFOs for buffering and data alignment. - Embedded system integration
Leverage SOPC-style integration and ESBs to combine custom logic, FIFOs, and dual-port memories in compact system designs. - I/O-intensive control and glue logic
125 I/O pins and flexible I/O voltage support make the device suitable for bridging and control tasks between mixed-voltage peripherals. - Prototyping and mid-density FPGA designs
Appropriate for prototypes and products requiring moderate logic capacity, on-chip RAM, and configurable I/O in a small package footprint.
Unique Advantages
- Integrated memory and logic:
On-chip ESBs provide roughly 24,576 bits of RAM, reducing dependence on external memory for common buffering and storage needs. - Balanced mid-density resource mix:
1,200 logic elements and up to 113,000 system gates deliver sufficient capacity for many embedded applications without excess cost or board area. - Flexible interfacing:
125 user I/O pins and APEX 20K family MultiVolt I/O support simplify connections to mixed-voltage peripherals and memory devices. - Compact, surface-mount package:
208‑BFQFP (28×28 PQFP) provides a space-efficient solution for board-level integration. - Commercial temperature and RoHS compliance:
Qualified for 0 °C to 85 °C operation and RoHS‑compliant for broad commercial deployment. - Low-voltage internal operation:
1.71 V to 1.89 V supply range supports lower-power system architectures.
Why Choose EP20K30EQC208-1?
The EP20K30EQC208-1 positions itself as a practical mid-density FPGA choice within the Intel APEX 20K family, delivering a combination of 1,200 logic elements, embedded RAM, and substantial I/O capacity in a compact 208‑BFQFP package. Its MultiCore architecture and ESB resources make it well suited to designs requiring integrated FIFOs, dual-port RAM, and mixed logic/memory functions while maintaining commercial-grade temperature and RoHS compliance.
This device is a fit for engineers and procurement teams seeking a commercially graded, RoHS-compliant FPGA that balances integration, I/O flexibility, and moderate gate density for embedded control, memory interface, and prototyping applications within the APEX 20K ecosystem.
If you would like pricing, availability, or to request a formal quote for EP20K30EQC208-1, please submit a quote request or contact the sales channel for more information.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018