EP20K30EQC240-3

IC FPGA 240QFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 24576 1200 240-BFQFP

Quantity 659 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O160Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs120Number of Logic Elements/Cells1200
Number of Gates113000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits24576

Overview of EP20K30EQC240-3 – APEX-20KE® FPGA IC, 24,576-bit RAM, 1,200 logic elements, 240-BFQFP

The EP20K30EQC240-3 is a commercial-grade APEX-20KE® field programmable gate array from Intel (Altera), delivering programmable logic, embedded memory, and flexible I/O in a 240-BFQFP surface-mount package. It implements the APEX 20K family MultiCore architecture with LUT-based logic and embedded system blocks for memory and product-term functions.

This device targets designs requiring moderate logic capacity with integrated RAM and diverse I/O capability, offering a compact package, RoHS compliance, and operation across a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core architecture – MultiCore integration MultiCore architecture combining look-up table (LUT) logic, product-term logic, and embedded memory for register- and combinatorial-intensive functions.
  • Logic capacity 1,200 logic elements (LEs) and approximately 113,000 system gates for mid-density logic implementations.
  • Embedded memory 24,576 total RAM bits and embedded system blocks (ESBs) for FIFO, dual-port RAM, and CAM-style memory functions.
  • I/O and interface flexibility 160 user I/O pins with MultiVolt I/O support across the APEX 20K family and support for advanced I/O standards and high-speed interfaces.
  • Clock management Family-level clock features include up to four PLLs, a built-in low-skew clock tree, and programmable clock phase/shift capabilities for deterministic timing.
  • Power and supply Designed for low-power operation with an internal supply around 1.8 V and a specified voltage supply range of 1.71 V to 1.89 V for the device.
  • Package and mounting 240-BFQFP (supplier device package: 240-PQFP, 32 × 32 mm) surface-mount package for compact board-level integration.
  • Commercial grade and environmental Commercial operating range (0 °C to 85 °C) and RoHS-compliant manufacturing.

Typical Applications

  • System-on-a-programmable-chip (SOPC) designs — Integrate control logic, memory buffering, and peripheral interfacing in a single programmable device using the APEX MultiCore architecture.
  • Memory interface and buffering — Use embedded RAM and ESBs for FIFO and dual-port RAM implementations in systems that require on-chip buffering and low-latency data paths.
  • High-speed I/O and communications — Implement custom transceivers and protocol glue logic leveraging the device’s flexible I/O and family support for high-speed standards.
  • Prototyping and custom logic control — Mid-density logic capacity and versatile clocking options make the device suitable for prototyping and field-upgradable control logic.

Unique Advantages

  • Highly integrated MultiCore architecture: Combines LUT logic and embedded system blocks to reduce external components for memory-centric and control applications.
  • On-chip memory resources: 24,576 bits of RAM and ESBs support FIFOs, dual-port RAM, and CAM-like structures for efficient data handling without added board-level memory.
  • Flexible I/O support: 160 user I/Os and family-level MultiVolt I/O support simplify interfacing with a wide range of peripheral voltages and bus standards.
  • Deterministic clocking: Up to four PLLs, low-skew clock tree, and programmable clock features enable robust timing control for synchronous designs.
  • Compact, surface-mount package: 240-BFQFP / 240-PQFP (32 × 32 mm) package offers a space-efficient footprint for board-level integration.
  • Compliance and grade: RoHS-compliant, commercial-grade device suitable for mainstream embedded applications.

Why Choose EP20K30EQC240-3?

The EP20K30EQC240-3 combines the APEX 20K family’s MultiCore programmable logic architecture with on-chip RAM and flexible I/O in a compact 240-BFQFP surface-mount package. With 1,200 logic elements, approximately 24.6 Kbits of embedded memory, and family-level clock and I/O features, it is well suited to mid-density designs that require integrated memory and deterministic timing.

Choose this device for commercial embedded systems, SOPC integration, and custom logic applications where a balance of logic capacity, embedded memory, and interface flexibility is required, complemented by RoHS compliance and standard commercial temperature operation.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the EP20K30EQC240-3.

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