EP20K30ETC144-2X

The EP20K30ETC144-2X is an APEX-20KE® family FPGA from Intel delivering a compact, integrated programmable-logic solution in a 144-pin LQFP package. It combines MultiCore architecture components—look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs)—to support system-on-a-programmable-chip (SOPC) integration for embedded designs and high-density glue logic.

Designed for commercial applications, this device provides 1,200 logic elements, approximately 24,576 bits of embedded RAM, and 92 I/O pins, making it suitable for mid-density control, interface bridging, and embedded memory functions within a 0 °C to 85 °C operating range.

Key Features

• Core Logic: 1,200 logic elements and up to 113,000 system gates provide mid-density programmable logic capacity for control and glue applications.
• Embedded Memory: Approximately 24,576 bits of on-chip RAM implemented via ESBs to support FIFOs, dual-port RAM, and CAM-style functions.
• I/O and Interfaces: 92 user I/O pins with MultiVolt I/O interface support noted in the APEX 20K family to interoperate with multiple I/O voltage levels; includes features for high-speed signaling and programmable output controls described for the series.
• Clock and Timing: Series-level APEX 20K devices include flexible clock management with multiple PLLs, low-skew clock tree, and programmable clock features for controlled timing (series specification).
• Power: Low-power design characteristics with an internal supply in the 1.71 V to 1.89 V range for this part number and family-level power-saving ESB modes.
• Package & Mounting: Surface-mount 144-LQFP package (supplier device package: 144-TQFP, 20 × 20) for compact board-level integration.
• Operating Conditions: Commercial-grade device rated for 0 °C to 85 °C operation and RoHS-compliant construction.

Typical Applications

• Embedded Control: Implement control logic, state machines, and custom peripherals using the device’s LUT-based logic and on-chip RAM for local buffering.
• Memory Interfaces: Use ESBs to create FIFO buffers and dual-port RAM structures for interface bridging and memory buffering tasks.
• Interface and Protocol Bridging: Leverage the device’s MultiVolt I/O support and flexible I/O features to bridge between different voltage domains and protocol interfaces.
• High-Speed Signaling: Apply the APEX 20K family I/O capabilities for high-speed channel signaling and timing-sensitive I/O functions.

Unique Advantages

• Integrated SOPC Architecture: MultiCore architecture integrates LUT logic, product-term logic, and embedded memory for compact system-level implementations.
• Balanced Density: 1,200 logic elements and approximately 24,576 bits of embedded RAM provide a mid-density footprint ideal for embedded and interface designs without excessive board area.
• Flexible I/O: Series-level MultiVolt I/O support and programmable I/O controls simplify mixed-voltage board designs and reduce external level-shifting components.
• Compact Package: 144-LQFP surface-mount package enables dense PCB integration while preserving access to 92 user I/O pins.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to meet typical consumer and commercial application requirements.

Why Choose EP20K30ETC144-2X?

The EP20K30ETC144-2X delivers a practical balance of programmable logic, embedded memory, and flexible I/O in a compact 144-LQFP package. It is suited to engineers building embedded systems, protocol bridges, and mid-density logic functions who need on-chip RAM and a MultiCore architecture for SOPC-style integration.

With commercial-grade operating range, RoHS compliance, and Intel’s APEX 20K family features such as low-power options and advanced clock management at the series level, this device offers a scalable, reliable option for designs that require mid-level integration and predictable timing features.

Request a quote or submit an inquiry to obtain pricing and availability for EP20K30ETC144-2X and discuss how this FPGA can fit your next design.