EP20K30ETC144-3N

IC FPGA 92 I/O 144TQFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 92 24576 1200 144-LQFP

Quantity 138 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O92Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs120Number of Logic Elements/Cells1200
Number of Gates113000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EP20K30ETC144-3N – APEX-20KE® FPGA, 1,200 Logic Elements, 24,576 bits RAM, 144-LQFP

The EP20K30ETC144-3N is an APEX-20KE® field programmable gate array (FPGA) in a 144-LQFP package designed for commercial applications. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory to enable system-on-a-programmable-chip integration for control, interface, and memory-centric designs.

With 1,200 logic elements, 24,576 bits of on-chip RAM, up to 92 I/O pins and a compact 144-pin surface-mount package, this device targets I/O-rich embedded systems, memory-interface blocks, and custom logic functions where moderate density and flexible I/O are required.

Key Features

  • Core Architecture MultiCore architecture integrating LUT logic and product-term logic for register- and combinatorial-intensive functions; family-level support for embedded system blocks (ESBs).
  • Logic Density Approximately 1,200 logic elements and up to 113,000 system gates as specified for the device family.
  • Embedded Memory 24,576 bits of on-chip RAM with ESB support for FIFO, dual-port RAM, and CAM implementations (family-level ESB capability).
  • I/O and Interface Flexibility 92 user I/O pins and MultiVolt I/O interface support to interoperate with 1.8 V, 2.5 V, 3.3 V and 5.0 V signaling (family-level MultiVolt support).
  • Clock Management Family-level clock resources include up to four PLLs, a built-in low-skew clock tree, up to eight global clock signals, and programmable clock features such as ClockLock, ClockBoost and ClockShift.
  • High-speed I/O Options Family-level support for high-speed peripherals including LVDS channels (family LVDS performance up to 840 Mbits per channel) and support for external memory interfaces such as DDR SDRAM and ZBT SRAM.
  • Power and Supply Internal supply around 1.8 V (device supply range 1.71 V to 1.89 V) with family-level options for low-power operation and programmable ESB power-saving modes.
  • Package & Mounting 144-LQFP surface-mount package (supplier device package: 144-TQFP, 20 × 20 mm) suitable for compact board layouts.
  • Commercial Temperature Range Rated for commercial operation from 0 °C to 85 °C.
  • Standards & Testability Family-level JTAG boundary-scan support is provided (boundary-scan circuitry contributes additional gates for testability).
  • Regulatory RoHS compliant.

Typical Applications

  • Embedded System Integration – Implement custom control logic, protocol bridging, or glue logic where integrated LUTs and ESBs simplify system design.
  • Memory Interface Controllers – Use the device’s embedded memory and family-level support for DDR SDRAM and ZBT SRAM to build memory controllers and FIFO buffers.
  • High-speed I/O and Interface Bridging – Leverage MultiVolt I/O and family-level LVDS capability for high-speed data channels and interface conversion.
  • PCI and Bus Interfaces – Family-level compliance with PCI Local Bus Specification (3.3 V operation) enables use in PCI bus bridging and expansion applications.

Unique Advantages

  • MultiCore Integration: Combines LUT logic, product-term logic, and embedded memory to reduce system component count and simplify implementation of mixed logic and memory functions.
  • Balanced Logic and Memory Resources: 1,200 logic elements paired with 24,576 bits of on-chip RAM provide a compact platform for designs that require both logic and local buffering.
  • Flexible I/O Support: MultiVolt I/O and a 92-pin I/O count let the device interface with a wide range of voltage domains and external devices without extensive level-shifting hardware.
  • Programmable Clocking: On-chip PLLs and clock features (ClockLock, ClockBoost, ClockShift) provide designers with programmable clock multiplication, division and phase control for timing-critical designs.
  • Compact Surface-Mount Package: The 144-LQFP (20 × 20 mm) package supports dense PCB layouts while offering ample I/O for moderate-complexity systems.
  • Commercial-grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.

Why Choose EP20K30ETC144-3N?

The EP20K30ETC144-3N provides a balanced FPGA option for commercial embedded designs that require moderate logic density, on-chip RAM, flexible I/O, and integrated clock management in a compact 144-pin package. Its MultiCore architecture and family-level embedded system blocks enable efficient implementation of combined logic and memory functions, reducing BOM and simplifying board-level design.

This device is well suited to customers building control logic, memory interfaces, and I/O-rich modules who need a commercially rated FPGA with programmable clocking and MultiVolt I/O support. Its combination of logic elements, embedded RAM, and I/O flexibility offers a scalable building block within the APEX 20K family.

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