EP20K400BC652-2V

The EP20K400BC652-2V is an APEX-20KC® family Field Programmable Gate Array (FPGA) from Altera, provided in a 652-ball BGA package. It delivers a balanced combination of logic density, on-chip memory and high I/O count for commercial embedded designs and board-level integration.

With 16,640 logic elements, approximately 0.213 Mbits of embedded RAM and 502 I/O pins, this device targets applications that require significant programmable logic capacity alongside dense I/O in a compact surface-mount package. Key electrical and environmental parameters include a supply range of 1.71 V to 1.89 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 16,640 logic elements providing substantial configurable logic resources for custom digital designs.
• On-Chip Memory Approximately 0.213 Mbits (212,992 bits) of embedded RAM to support buffering, state machines and intermediate storage.
• I/O Density 502 I/O pins to support wide parallel interfaces, multiple peripherals or complex board-level signaling.
• Gate Count 1,052,000 gates enabling implementation of sizable logic functions and integration of multiple subsystems.
• Power Nominal core supply range of 1.71 V to 1.89 V to match targeted power rails in commercial systems.
• Package and Mounting 652-BGA (45 × 45) supplier device package; surface-mount mounting for compact PCB integration.
• Operating Range Commercial grade operation from 0 °C to 85 °C suitable for standard consumer and commercial environments.
• Compliance RoHS compliant.

Typical Applications

• High-density I/O systems — Use the 502 I/O pins to implement wide data buses, multi-channel interfaces or board-level glue logic.
• Embedded control and signal processing — Leverage 16,640 logic elements and over one million gates for control logic, protocol handling and mid-level signal processing tasks.
• Memory buffering and data staging — Utilize approximately 0.213 Mbits of on-chip RAM for temporary data storage, FIFOs and buffering between interfaces.
• Compact, high-integration boards — The 652-BGA (45×45) package and surface-mount profile support small form-factor, densely populated PCBs.

Unique Advantages

• High logic capacity: 16,640 logic elements provide room to consolidate multiple functions into a single FPGA, reducing BOM complexity.
• Substantial gate count: 1,052,000 gates enable implementation of complex state machines and integration of multiple digital subsystems on-chip.
• Generous I/O count: 502 I/O pins simplify board-level interfacing and reduce the need for external bus expanders or multiplexers.
• Compact packaging: 652-BGA (45×45) offers a high-density package option for space-constrained designs while supporting surface-mount assembly.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial product deployments.
• Tightly specified supply range: Core operation from 1.71 V to 1.89 V supports designs with narrow-core voltage rails.

Why Choose EP20K400BC652-2V?

The EP20K400BC652-2V combines a high count of logic elements and gates with substantial on-chip RAM and a large I/O complement in a compact 652-BGA package. Its electrical and environmental specifications make it a practical choice for commercial embedded systems that demand significant programmable logic capacity and dense interfacing without expanding board footprint.

This device is well suited to engineers and product teams designing mid-to-high complexity digital systems who need a commercially rated FPGA with clear, verifiable specifications for logic capacity, memory and I/O. The package and supply requirements simplify integration into contemporary PCB assemblies while RoHS compliance supports global commercial manufacturing requirements.

Request a quote or submit a procurement inquiry to receive pricing and availability for the EP20K400BC652-2V FPGA. Our team can assist with lead times and volume options to support your project schedule.