EP20K400BI652-2
| Part Description |
APEX-20KC® Field Programmable Gate Array (FPGA) IC 502 212992 16640 652-BGA |
|---|---|
| Quantity | 483 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 652-BGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 652-BGA | Number of I/O | 502 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1664 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | 1052000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 212992 |
Overview of EP20K400BI652-2 – APEX-20KC® Field Programmable Gate Array (FPGA) IC 502 212992 16640 652-BGA
The EP20K400BI652-2 is an APEX-20KC® Field Programmable Gate Array (FPGA) IC designed for applications that require substantial programmable logic and a high I/O count. With 16,640 logic elements and 502 I/O pins, it delivers a balance of logic density and connectivity for industrial-grade designs.
Engineered for use in environments that demand extended temperature operation and surface-mount packaging, this device offers integrated memory and gate resources to support complex digital systems while operating from a 1.71 V to 1.89 V supply range.
Key Features
- Logic Density Approximately 16,640 logic elements provide the programmable fabric required for medium- to large-scale logic integration.
- Embedded Memory Approximately 0.213 Mbits of on-chip RAM (212,992 total RAM bits) to support buffering, state storage, and local data processing.
- I/O Capacity 502 general-purpose I/O pins enable extensive interfacing with peripherals, sensors, and external logic.
- Gate Count About 1,052,000 gates for implementing complex combinational and sequential logic functions.
- Power Operates from a 1.71 V to 1.89 V supply range to match target system power domains.
- Package & Mounting 652-ball BGA package (45 × 45 mm) in a surface-mount form factor for compact board-level integration.
- Temperature & Grade Industrial-grade device specified for operation from −40 °C to 100 °C, suitable for extended-temperature applications.
- Environmental Compliance RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Industrial Automation Programmable logic and extensive I/O support motor control, PLC interfaces, and real-time process control in industrial systems.
- Communications Equipment Logic density and on-chip memory enable packet handling, protocol bridging, and custom interface implementations.
- Embedded Systems Provides the programmable resources and I/O required for advanced embedded control, sensor aggregation, and data preprocessing.
Unique Advantages
- High Logic Integration: 16,640 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
- Large I/O Surface: 502 I/O pins simplify connectivity to peripherals and external devices without extensive external multiplexing.
- On-Chip Memory: Approximately 0.213 Mbits of embedded RAM support local buffering and state storage, reducing dependence on external memory.
- Industrial Temperature Range: Rated for −40 °C to 100 °C operation to support designs deployed in demanding thermal environments.
- Compact BGA Packaging: 652-ball BGA (45 × 45 mm) provides high pin density in a package suitable for compact system designs.
Why Choose EP20K400BI652-2?
The EP20K400BI652-2 positions itself as a versatile, industrial-grade FPGA option for designs that need substantial programmable logic, extensive I/O, and embedded memory within a compact BGA package. Its combination of 16,640 logic elements, roughly 0.213 Mbits of on-chip RAM, and 502 I/O pins makes it well suited to consolidated system designs that require scalability and robust operation across an extended temperature range.
For engineers and buyers targeting industrial and communications applications, this device offers a clear balance of integration, connectivity, and environmental compliance to support long-term deployment and simplified BOM considerations.
Request a quote or submit an inquiry to receive pricing, availability, and assistance with integrating the EP20K400BI652-2 into your design workflow.

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