EP20K400CF672C9
| Part Description |
APEX-20KC® Field Programmable Gate Array (FPGA) IC 488 672-BBGA, FCBGA |
|---|---|
| Quantity | 1,758 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 488 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1664 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | 1052000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 212992 |
Overview of EP20K400CF672C9 – APEX-20KC® Field Programmable Gate Array (FPGA)
The EP20K400CF672C9 is an APEX-20KC® Field Programmable Gate Array (FPGA) from Altera, supplied in a 672-ball FCBGA package. It provides a mid-range programmable logic solution with substantial I/O capacity and on-chip RAM for embedded logic and interfacing tasks.
Designed for commercial-temperature applications, this surface-mount FPGA targets designs that require a combination of logic resources, high I/O count, and compact BGA packaging while operating within a 1.71 V–1.89 V core supply range.
Key Features
- Core Capacity 16,640 logic elements and approximately 1.05 million gates provide the programmable fabric to implement custom digital functions.
- Embedded Memory Approximately 0.213 Mbits of on-chip RAM (212,992 total RAM bits) for buffering, state storage, and small lookup tables.
- I/O Density 488 user I/O pins to support multiple interfaces and peripheral connections from a single device.
- Package and Mounting 672-BBGA (FCBGA) package in a 672-FBGA (27×27) footprint, surface-mount for compact board designs.
- Power Core voltage supply range of 1.71 V to 1.89 V to match platform power requirements.
- Operating Range and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for regulations on hazardous substances.
Typical Applications
- I/O-Intensive Systems Use where a high pin count (488 I/O) is needed to interface multiple peripherals, sensors or I/O buses on a single FPGA.
- Custom Digital Processing Deploy the device for mid-range programmable logic tasks that require ~16.6k logic elements and embedded RAM for temporary data storage and control logic.
- Compact Board Designs Apply the 672-ball FCBGA package and surface-mount mounting for space-constrained PCBs that need significant logic and I/O in a single package.
Unique Advantages
- Balanced Logic and Memory: 16,640 logic elements paired with approximately 0.213 Mbits of on-chip RAM enable a mix of combinational logic, state machines, and small buffering without external memory.
- High I/O Capacity: 488 user I/O pins simplify board-level routing and reduce the need for additional interface components.
- Compact BGA Packaging: 672-BBGA (672-FBGA, 27×27) footprint delivers high integration density for compact system designs.
- Controlled Power Envelope: Narrow core voltage range (1.71 V–1.89 V) helps designers plan stable power delivery for the FPGA core.
- RoHS Compliant: Meets environmental compliance requirements for restricted substances.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation for mainstream electronic applications.
Why Choose EP20K400CF672C9?
The EP20K400CF672C9 positions itself as a mid-range APEX-20KC FPGA that combines a substantial logic element count, meaningful embedded memory, and a high I/O complement in a compact 672-ball FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream electronic products that require programmable logic, flexible interfacing, and compact board integration.
This device is well suited for customers and designs that require scalable programmable capacity with a high number of I/O pins and on-chip RAM, and where a surface-mount BGA footprint is preferred for density and board layout efficiency.
Request a quote or contact sales to discuss availability, lead times, and pricing for the EP20K400CF672C9.

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