EP20K400CF672C7

The EP20K400CF672C7 is an APEX-20KC family programmable logic device from Intel, built on a MultiCore architecture that integrates look-up table (LUT) logic and embedded memory. It provides a balance of high logic density, on-chip RAM, and flexible I/O for commercial embedded and system designs.

Targeted at applications requiring substantial programmable logic and I/O, this device offers up to 16,640 logic elements, approximately 0.213 Mbits of embedded memory, and 488 user I/O pins—delivering performance and integration suitable for communication, compute, and system-integration tasks within the commercial temperature range.

Key Features

• Logic Capacity — 16,640 logic elements and approximately 1,052,000 system gates provide high-density programmable logic for complex functions and state machines.
• Embedded Memory — Approximately 0.213 Mbits (212,992 bits) of on-chip RAM and architecture support for embedded system blocks (ESBs) enable FIFOs, dual-port RAM and other memory functions.
• I/O and Interfaces — 488 user I/O pins with MultiVolt support enable 1.8 V, 2.5 V and 3.3 V interfaces and flexible connectivity for a range of external devices and memory interfaces.
• Clock and Timing — Device family supports flexible clock management including multiple PLLs and a low-skew clock tree to simplify timing distribution for synchronous designs.
• Power — Low-voltage internal operation with a supply range of 1.71 V to 1.89 V and copper interconnect technology help reduce power consumption.
• Package & Mounting — Surface-mount 672-BBGA package (672-FBGA, 27×27) for compact board integration and high pin-count connectivity.
• Commercial Grade Temperature — Specified operating temperature range of 0 °C to 85 °C for commercial applications.
• Standards & Signal Support — Series-level support for advanced I/O standards and high-speed memory interfaces is provided by the APEX-20KC architecture.

Typical Applications

• High-density logic and control — Implement complex control, packet-processing, or protocol-bridging logic using the device’s 16,640 logic elements and dedicated arithmetic/cascade resources.
• Memory interfacing — On-chip RAM and ESB support simplify buffering and FIFO implementations for external DDR/SDRAM or SRAM interfaces.
• High-pin-count system integration — 488 I/Os in a compact 672-BBGA package enable dense board-level integration for communication and embedded systems.
• Prototyping and OEM designs — Commercial-grade temperature rating and surface-mount package make the device suitable for evaluation, prototyping, and production designs in commercial products.

Unique Advantages

• High logic density: 16,640 logic elements and roughly one million gates let you consolidate multiple functions into a single device, reducing component count.
• Embedded memory and ESBs: On-chip RAM (approximately 0.213 Mbits) and embedded system blocks support efficient implementation of FIFOs and dual-port RAM without sacrificing logic resources.
• Flexible I/O voltage support: MultiVolt I/O support (1.8 V, 2.5 V, 3.3 V) simplifies interfacing to a wide range of peripherals and memory standards.
• Compact, high-pin package: 672-BBGA (27×27) package delivers a high I/O count in a compact surface-mount form factor for dense board designs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet common commercial product requirements.
• Low-voltage internal operation: 1.71 V–1.89 V internal supply and copper interconnect technology support lower power operation in system designs.

Why Choose EP20K400CF672C7?

The EP20K400CF672C7 combines substantial programmable logic capacity, embedded memory, and a broad I/O complement in a compact 672-BBGA package—making it a practical choice for commercial designs that require integration of complex logic, memory buffering, and high pin-count interfaces. Its MultiCore architecture and on-chip resources simplify implementation of register-intensive functions and memory-centric blocks while helping reduce external BOM complexity.

This device is well suited to engineering teams building communication equipment, embedded controllers, and system prototypes that need scalable logic, flexible I/O voltage support, and commercial temperature operation backed by the APEX-20KC family architecture.

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