EP20K600CB652C8
| Part Description |
APEX-20KC® Field Programmable Gate Array (FPGA) IC 488 311296 24320 652-BGA |
|---|---|
| Quantity | 122 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 652-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 652-BGA | Number of I/O | 488 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2432 | Number of Logic Elements/Cells | 24320 | ||
| Number of Gates | 1537000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 311296 |
Overview of EP20K600CB652C8 – APEX-20KC® Field Programmable Gate Array (FPGA) IC 488 311296 24320 652-BGA
The EP20K600CB652C8 is an APEX-20KC family field programmable gate array (FPGA) offering a high-density, MultiCore architecture that integrates look-up table (LUT) logic and embedded memory. With 24,320 logic elements, approximately 0.31 Mbits of embedded memory and 488 user I/O pins, this commercial-grade, surface-mount device targets mid-to-high‑density custom logic, memory-interface, and high-speed I/O applications.
Built on a copper-metal fabrication process and designed for low-power operation, the device provides flexible voltage and clock management options to support complex system designs requiring embedded RAM, abundant logic resources, and versatile I/O signaling.
Key Features
- Core Logic — 24,320 logic elements (LEs) delivering approximately 1,537,000 maximum system gates for medium-to-high density logic integration.
- Embedded Memory — Approximately 311,296 total on-chip RAM bits for FIFOs, dual-port RAM and other memory functions without reducing available logic.
- I/O Capacity and Flexibility — 488 user I/O pins with MultiVolt I/O support for 1.8 V, 2.5 V and 3.3 V interfaces; programmable output slew-rate and individual tri-state control.
- Clock Management — Up to four phase-locked loops (PLLs) and up to eight global clock signals with ClockLock, ClockBoost and ClockShift features for phase, multiplication/division and skew reduction.
- Advanced Interconnect — Copper interconnect with hierarchical FastTrack interconnect, dedicated carry and cascade chains, and interleaved local routing for predictable, low-delay signal paths.
- Performance & Process — 0.15‑µm all-layer copper-metal fabrication process delivering improved performance and reduced power relative to prior-generation devices.
- Package & Mounting — 652-ball BGA package (45 × 45 mm) in a surface-mount form factor suitable for compact board designs.
- Power & Temperature — Internal supply around 1.8 V (product supply range 1.71 V to 1.89 V); commercial operating range 0 °C to 85 °C.
- Standards & Compliance — RoHS compliant.
- Development Ecosystem — Supported by the APEX 20KC software toolchain and Altera megafunctions for place-and-route and function IP.
Typical Applications
- High-speed memory interfaces — Implement DDR SDRAM or ZBT SRAM controllers and buffering logic using abundant embedded RAM and dedicated memory blocks.
- Bus and protocol bridging — Support PCI/PCI‑compatible system interfacing and custom bus bridges using flexible I/O voltage support and high I/O count.
- LVDS and high-throughput I/O links — Implement multi-channel LVDS receive/transmit paths and other high-speed serial interfaces using available I/O resources.
- Custom control and state machines — Realize register‑intensive functions and complex control logic leveraging LUT-based registers and plentiful logic elements.
Unique Advantages
- High integration density: 24,320 logic elements and roughly 1.54 million gates enable complex designs without external glue logic.
- Significant on-chip memory: Approximately 0.31 Mbits of embedded RAM supports FIFOs, buffers and memory-mapped functions while preserving logic resources.
- Flexible I/O and voltage support: 488 I/Os with MultiVolt capability simplify interfacing to a variety of system-level components and memory devices.
- Robust clocking features: Four PLLs and multiple clock-management features provide low-skew, phase control and frequency scaling for timing-critical designs.
- Compact BGA packaging: 652-BGA (45 × 45 mm) provides a small-footprint solution for board-level space optimization.
- Commercial readiness: Surface-mount, RoHS-compliant device rated for 0 °C to 85 °C operation for mainstream commercial applications.
Why Choose EP20K600CB652C8?
The EP20K600CB652C8 delivers a balanced combination of density, embedded memory and flexible I/O in a proven APEX‑20KC architecture. Its MultiCore LUT and embedded system block approach, along with copper interconnect and advanced clocking resources, make it well suited for designs that require substantial on-chip logic and memory with adaptable interface voltages.
This device is appropriate for design teams building medium-to-high complexity FPGA-based systems—where scalability, integration of memory and logic, and access to established development tools and megafunctions reduce time-to-market and simplify implementation.
Request a quote or submit an inquiry to get pricing and availability for EP20K600CB652C8 and to discuss how this FPGA can meet your project requirements.

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