EP20K400FI672-2V

The EP20K400FI672-2V is an APEX-20K family FPGA from Intel, provided in a 672-ball BGA package. It implements the family’s MultiCore architecture—combining lookup-table (LUT) logic, product-term logic, and embedded memory blocks—making it suitable for high-density logic and memory‑intensive designs that require extensive I/O and industrial temperature operation.

With 16,640 logic elements, approximately 213 Kbits of embedded RAM, and 502 user I/O pins, this device targets applications needing system integration, deterministic clocking, and robust interfacing in industrial environments.

Key Features

• Core architecture  MultiCore architecture integrating LUT logic, product-term logic, and embedded system blocks (ESBs) for flexible implementation of register‑intensive and memory functions.
• Logic capacity  16,640 logic elements and approximately 1,052,000 system gates to support complex combinatorial and sequential logic.
• Embedded memory  Total on‑chip RAM of 212,992 bits (approximately 0.213 Mbits) for FIFOs, dual‑port RAM and CAM-style implementations using ESBs.
• I/O and interface capability  502 user I/O pins with MultiVolt I/O interface support and family-level features for high-speed standards including LVDS and PCI 3.3‑V operation (family datasheet references).
• Clock management  Family-level support for advanced clock features including up to four PLLs, a low‑skew clock tree, ClockLock, ClockBoost and ClockShift for flexible phase and frequency control.
• Package and mounting  672-ball BGA (supplier package referenced as 672-FBGA, 27×27) in a surface‑mount form factor for compact, high‑density board designs.
• Supply and operating range  Device supply specified at 2.375 V to 2.625 V; operating temperature range −40 °C to 100 °C for industrial deployments.
• Compliance and reliability  RoHS‑compliant construction and features from the APEX‑20K family aimed at low‑power operation and predictable interconnect timing.

Typical Applications

• High-density embedded systems  Integrate large amounts of logic and on‑chip RAM to implement control engines, protocol processing, and custom datapaths within a single device.
• Memory interface and bridging  Implement controllers and buffers for external memories such as DDR SDRAM and ZBT SRAM using the device’s embedded memory and high‑speed I/O capability.
• Connectivity and telecom  Leverage the high I/O count and LVDS support for multi‑channel data transfer, SERDES‑style interfaces, and board‑level protocol endpoints.
• Industrial control and automation  Use industrial temperature rating, abundant I/O and deterministic clocking for motor control, sensor aggregation, and real‑time control logic.

Unique Advantages

• High logic and memory density: 16,640 logic elements coupled with ~213 Kbits of embedded RAM enable consolidated implementation of complex functions and data buffering.
• Extensive I/O reach: 502 user I/Os provide broad connectivity for peripherals, memory interfaces, and multi‑lane communication links.
• Advanced clocking features: Multiple PLLs and family clock management features allow precise, low‑skew distribution and on‑chip clock synthesis for timing‑sensitive designs.
• Industrial temperature and RoHS compliance: Specified operation from −40 °C to 100 °C with RoHS‑compliant construction supports deployment in demanding environments.
• Compact BGA package: 672‑ball FBGA footprint offers a dense, surface‑mount solution for space‑constrained PCBs while maintaining high I/O and routing capability.

Why Choose EP20K400FI672-2V?

The EP20K400FI672-2V combines APEX‑20K family architecture with a high logic element count, substantial on‑chip RAM, and a large user I/O complement—delivering a balanced platform for designs that require integrated logic, memory, and high‑speed interfacing. Its industrial operating range and compact BGA packaging make it suited to embedded systems, communications, and industrial control applications.

Choose this device when you need a field‑programmable solution that aligns family‑level APEX‑20K features (advanced clocking, MultiVolt I/O support, and embedded system blocks) with a device-level specification that includes 16,640 logic elements, 212,992 bits of RAM, 502 I/O pins, and RoHS compliance.

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