EP20K400ERI240-3
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 212992 16640 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 808 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 180 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1664 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | 1052000 | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 212992 |
Overview of EP20K400ERI240-3 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 212992 16640 240-BFQFP Exposed Pad
The EP20K400ERI240-3 is an APEX-20KE® family FPGA from Intel, delivering 16,640 logic elements and approximately 212,992 bits of embedded RAM for high-density programmable logic designs. Built around the APEX MultiCore™ architecture with embedded system blocks (ESBs) and LUT-based logic, this device targets system integration, memory interface, and high‑speed I/O applications where integration, configurability, and industrial-grade operation matter.
Packaged in a 240-BFQFP exposed-pad surface-mount package with industrial temperature rating, the device supports a low-voltage internal supply and a broad set of clocking and I/O capabilities to support complex embedded and system-level designs.
Key Features
- Logic Capacity — 16,640 logic elements providing approximately 1,052,000 gates of programmable logic for complex combinatorial and register‑intensive functions.
- Embedded Memory — Approximately 0.213 Mbits (212,992 bits) of on-chip RAM implemented via ESBs for FIFOs, dual-port RAM and CAM-style functions.
- I/O Resources — 180 user I/O pins with MultiVolt I/O architecture support and programmable I/O features for flexible interfacing.
- Clock Management — Flexible clock architecture including multiple PLLs, a built-in low-skew clock tree, and programmable clock phase and delay features for precision timing control.
- Power and Voltage — Low-voltage internal supply specified at 1.71 V to 1.89 V and device-level power-saving modes provided by the ESB architecture.
- Package and Mounting — 240-BFQFP exposed-pad package (supplier package 240-RQFP, 32×32), surface-mount mounting type suitable for compact, board-level integration.
- Operating Range & Compliance — Industrial temperature range from −40 °C to 100 °C and RoHS-compliant construction.
Typical Applications
- Embedded systems and SOPC integration — Use ESBs and MultiCore™ architecture to implement system-on-programmable-chip designs combining logic, memory, and control functions.
- High-speed memory controllers — Support for external memory interfaces makes the device suitable for DDR SDRAM and other high-bandwidth memory controller implementations.
- High-performance I/O and bridging — MultiVolt I/O support and high-speed signaling capability enable PCI/PCI-like bus interfacing and high-speed serial/parallel I/O bridging.
- Networking and data handling — On-chip RAM and programmable logic are well suited for packet buffering, FIFOs, and custom data-path implementations.
Unique Advantages
- Highly integrated architecture: MultiCore™ architecture with LUT logic and ESBs consolidates logic and embedded memory functions to reduce external components and simplify system design.
- Substantial on-chip memory and logic: Approximately 212,992 bits of embedded RAM paired with 16,640 logic elements supports complex buffering, CAM, and control functions on-chip.
- Flexible clocking: Multiple PLLs, a low‑skew clock tree, and programmable phase/delay features enable robust timing strategies for synchronous and high-speed designs.
- Industrial robustness: Rated for −40 °C to 100 °C operation and supplied in a rugged exposed-pad BFQFP package for reliable deployment in industrial environments.
- Low-voltage operation: Internal supply specified between 1.71 V and 1.89 V supports low-power board designs and aligns with modern power rails.
- RoHS compliant: Environmentally compliant manufacturing helps meet regulatory requirements for lead‑free assembly.
Why Choose EP20K400ERI240-3?
The EP20K400ERI240-3 combines a high logic element count with substantial embedded RAM and advanced clocking features to deliver a compact, integrated FPGA solution for system-level designs. Its industrial temperature rating, exposed-pad surface-mount package, and RoHS compliance make it appropriate for demanding production environments where reliability and long-term availability are required.
This device is well suited to engineers building high-density logic, memory-intensive controllers, or flexible I/O subsystems who need on-chip resources to reduce BOM and simplify board-level integration while maintaining robust timing and power characteristics.
Request a quote or submit an inquiry for pricing and availability of EP20K400ERI240-3 to start integrating this APEX-20KE® FPGA into your next design.

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