EP20K400ERI240-3

IC FPGA 240RQFP
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 212992 16640 240-BFQFP Exposed Pad

Quantity 808 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFP Exposed PadNumber of I/O180Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1052000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits212992

Overview of EP20K400ERI240-3 – APEX-20KE® Field Programmable Gate Array (FPGA) IC 212992 16640 240-BFQFP Exposed Pad

The EP20K400ERI240-3 is an APEX-20KE® family FPGA from Intel, delivering 16,640 logic elements and approximately 212,992 bits of embedded RAM for high-density programmable logic designs. Built around the APEX MultiCore™ architecture with embedded system blocks (ESBs) and LUT-based logic, this device targets system integration, memory interface, and high‑speed I/O applications where integration, configurability, and industrial-grade operation matter.

Packaged in a 240-BFQFP exposed-pad surface-mount package with industrial temperature rating, the device supports a low-voltage internal supply and a broad set of clocking and I/O capabilities to support complex embedded and system-level designs.

Key Features

  • Logic Capacity — 16,640 logic elements providing approximately 1,052,000 gates of programmable logic for complex combinatorial and register‑intensive functions.
  • Embedded Memory — Approximately 0.213 Mbits (212,992 bits) of on-chip RAM implemented via ESBs for FIFOs, dual-port RAM and CAM-style functions.
  • I/O Resources — 180 user I/O pins with MultiVolt I/O architecture support and programmable I/O features for flexible interfacing.
  • Clock Management — Flexible clock architecture including multiple PLLs, a built-in low-skew clock tree, and programmable clock phase and delay features for precision timing control.
  • Power and Voltage — Low-voltage internal supply specified at 1.71 V to 1.89 V and device-level power-saving modes provided by the ESB architecture.
  • Package and Mounting — 240-BFQFP exposed-pad package (supplier package 240-RQFP, 32×32), surface-mount mounting type suitable for compact, board-level integration.
  • Operating Range & Compliance — Industrial temperature range from −40 °C to 100 °C and RoHS-compliant construction.

Typical Applications

  • Embedded systems and SOPC integration — Use ESBs and MultiCore™ architecture to implement system-on-programmable-chip designs combining logic, memory, and control functions.
  • High-speed memory controllers — Support for external memory interfaces makes the device suitable for DDR SDRAM and other high-bandwidth memory controller implementations.
  • High-performance I/O and bridging — MultiVolt I/O support and high-speed signaling capability enable PCI/PCI-like bus interfacing and high-speed serial/parallel I/O bridging.
  • Networking and data handling — On-chip RAM and programmable logic are well suited for packet buffering, FIFOs, and custom data-path implementations.

Unique Advantages

  • Highly integrated architecture: MultiCore™ architecture with LUT logic and ESBs consolidates logic and embedded memory functions to reduce external components and simplify system design.
  • Substantial on-chip memory and logic: Approximately 212,992 bits of embedded RAM paired with 16,640 logic elements supports complex buffering, CAM, and control functions on-chip.
  • Flexible clocking: Multiple PLLs, a low‑skew clock tree, and programmable phase/delay features enable robust timing strategies for synchronous and high-speed designs.
  • Industrial robustness: Rated for −40 °C to 100 °C operation and supplied in a rugged exposed-pad BFQFP package for reliable deployment in industrial environments.
  • Low-voltage operation: Internal supply specified between 1.71 V and 1.89 V supports low-power board designs and aligns with modern power rails.
  • RoHS compliant: Environmentally compliant manufacturing helps meet regulatory requirements for lead‑free assembly.

Why Choose EP20K400ERI240-3?

The EP20K400ERI240-3 combines a high logic element count with substantial embedded RAM and advanced clocking features to deliver a compact, integrated FPGA solution for system-level designs. Its industrial temperature rating, exposed-pad surface-mount package, and RoHS compliance make it appropriate for demanding production environments where reliability and long-term availability are required.

This device is well suited to engineers building high-density logic, memory-intensive controllers, or flexible I/O subsystems who need on-chip resources to reduce BOM and simplify board-level integration while maintaining robust timing and power characteristics.

Request a quote or submit an inquiry for pricing and availability of EP20K400ERI240-3 to start integrating this APEX-20KE® FPGA into your next design.

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