EP20K400EFI672-2N

The EP20K400EFI672-2N is an APEX-20K field programmable gate array (FPGA) in a 672-ball BGA FCBGA package designed for industrial applications. It combines a high count of logic elements and I/O with onboard embedded memory to support complex custom logic, signal interfacing, and data buffering within a single surface-mount device.

Key Features

• Core Logic 16,640 logic elements enabling implementation of substantial custom digital functions and combinational/sequential logic.
• Embedded Memory Approximately 0.213 Mbits of on-chip RAM (212,992 bits) for local buffering, state storage, and small lookup tables.
• I/O Density 488 available I/O pins to support extensive peripheral interfacing and high-pin-count system connectivity.
• Gate Count Approximately 1,052,000 gates for mapping medium-complexity designs with multiple functional blocks.
• Package and Mounting 672-ball BGA (672-FBGA, 27×27) in an FCBGA form factor, designed for surface-mount assembly to optimize board real estate.
• Power Operates from a supply voltage range of 1.71 V to 1.89 V to match system power rails within that window.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
• Environmental Compliance RoHS-compliant construction for use in compliant manufacturing processes.

Typical Applications

• High-density I/O systems Use the 488 I/O pins for complex peripheral and sensor interfacing where multiple signals must be managed concurrently.
• Custom logic and protocol bridging Deploy the 16,640 logic elements and ~1,052,000 gates to implement protocol converters, glue logic, or bespoke digital state machines.
• Local buffering and small data caches Leverage approximately 0.213 Mbits of embedded memory for packet buffering, FIFO storage, or lookup tables within control and communication paths.

Unique Advantages

• High logic and gate capacity: 16,640 logic elements and ~1,052,000 gates provide the resources to consolidate multiple functions into a single FPGA, reducing external component count.
• Substantial I/O capability: 488 I/O pins simplify system routing and enable direct connections to a wide range of peripherals without additional multiplexing hardware.
• Industrial-grade thermal tolerance: Rated from −40 °C to 100 °C, supporting deployment in temperature-challenging industrial environments.
• Compact, assembly-ready package: 672-ball FCBGA (27×27) provides a high-density surface-mount solution that saves PCB area for compact system designs.
• Narrow core voltage window: 1.71 V to 1.89 V supply range enables straightforward power rail planning for systems designed around low-voltage logic.
• Regulatory-friendly manufacturing: RoHS compliance supports environmentally conscious production requirements.

Why Choose EP20K400EFI672-2N?

The EP20K400EFI672-2N positions itself as a mid-to-high density FPGA option that brings together significant logic resources, ample I/O, and embedded RAM in a compact 672-ball BGA package. Its industrial-grade temperature rating and RoHS compliance make it suitable for applications that require robust operation across a wide thermal range and adherence to environmental manufacturing standards.

This device is well suited for engineers and system designers who need to consolidate custom digital functions, manage numerous external interfaces, and implement on-chip buffering without increasing board footprint. The combination of logic capacity, I/O density, and package integration offers a scalable platform for a range of industrial and embedded designs.

Request a quote or submit an inquiry to receive pricing and availability information for the EP20K400EFI672-2N. Our team can provide prompt assistance to support your design and procurement needs.