EP20K400EFC672-2

IC FPGA 488 I/O 672FBGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 672-BBGA

Quantity 258 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1052000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits212992

Overview of EP20K400EFC672-2 – APEX-20KE® Field Programmable Gate Array (FPGA) IC, 672-BBGA

The EP20K400EFC672-2 is an Intel APEX-20KE® FPGA offered in a 672-ball BGA package. It integrates a MultiCore architecture combining lookup-table (LUT) logic, product-term logic and embedded memory to support complex system functions on a single device.

With 16,640 logic elements, 212,992 bits of on-chip RAM, and 488 I/O pins, this commercial-grade FPGA targets communications, networking, embedded systems, and high-density prototyping where high integration, flexible I/O, and programmable memory are required.

Key Features

  • Logic Capacity — 16,640 logic elements (LEs) for implementing register-intensive and combinatorial logic functions.
  • Embedded Memory — 212,992 total RAM bits (approximately 0.213 Mbits) for FIFOs, dual-port RAM and CAM-style implementations using Embedded System Blocks (ESBs).
  • I/O Resources — 488 user I/O pins to support wide parallel data paths and multiple interface standards.
  • Package and Mounting — 672-ball BGA (supplier package: 672-FBGA, 27 × 27 mm) designed for surface-mount assembly.
  • Voltage and Power — Internal supply operating range 1.71 V to 1.89 V, enabling low-voltage operation consistent with APEX 20K family design choices.
  • Clock and Timing — Family-level features include up to four PLLs, built-in low-skew clock tree and multiple global clock signals for complex timing domains (as described in APEX 20K family documentation).
  • Advanced I/O — Family-level support for MultiVolt I/O interfaces and high-speed I/O standards, facilitating connections to a range of external memories and peripherals.
  • Operating Range — Commercial temperature grade with specified operating range of 0 °C to 85 °C.
  • Density and Gate Count — Device listing indicates approximately 1,052,000 system gates, providing large-scale integration for complex designs.
  • RoHS Compliant — Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

  • Communications & Networking — High pin-count I/O and abundant logic elements enable packet processing, interface bridging and protocol offload functions.
  • Embedded Systems & Prototyping — Programmable logic and on-chip RAM support rapid hardware development, algorithm implementation and system validation.
  • High-Speed Memory Interfaces — Embedded memory and family-level support for external DDR and ZBT memories make the device suitable for buffering and memory controller prototyping.
  • Test & Measurement — Flexible I/O and clock management features enable custom data acquisition front ends and deterministic timing for measurement systems.

Unique Advantages

  • Balanced Logic and Memory Ratio: 16,640 logic elements combined with approximately 212,992 RAM bits offers designers a balanced fabric for control logic plus embedded buffering.
  • High I/O Count: 488 I/O pins provide the parallel connectivity needed for wide buses and multi-device interfaces, reducing external glue logic.
  • Compact, Surface-Mount Package: 672-BBGA (27 × 27 mm supplier package) delivers high density in a board-friendly, surface-mount form factor.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for applications targeting standard commercial environments.
  • Family-Proven Architecture: Built on the APEX 20K MultiCore architecture with LUTs, product-term logic and ESBs to implement a variety of system functions on-chip.
  • Standards-Oriented I/O Flexibility: Family-level MultiVolt I/O and advanced I/O standard support simplify interfacing with diverse peripheral and memory technologies.

Why Choose EP20K400EFC672-2?

The EP20K400EFC672-2 brings Intel’s APEX-20KE architecture into a high-density, commercial-grade FPGA optimized for applications that require a mix of logic, embedded memory and extensive I/O. Its combination of 16,640 logic elements, substantial on-chip RAM and 488 I/Os makes it suitable for complex protocol handling, buffering and system integration tasks.

Choose this device when you need a programmable, high-density solution from a recognized FPGA family, backed by the APEX 20K feature set for clock management, embedded system blocks and flexible I/O options.

Request a quote or submit an inquiry to get pricing and availability information for the EP20K400EFC672-2.

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