EP20K400EBC652-3N

IC FPGA 488 I/O 652BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 652-BGA

Quantity 473 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1052000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits212992

Overview of EP20K400EBC652-3N – APEX-20KE FPGA, 652-BGA, 16,640 logic elements

The EP20K400EBC652-3N is a commercial-grade APEX-20KE Field Programmable Gate Array (FPGA) in a 652-ball BGA (45×45) surface-mount package. It implements the APEX 20K MultiCore architecture combining LUT logic, product-term logic, and embedded memory blocks to support integrated system design.

Designed for applications needing high logic density and flexible I/O, the device offers 16,640 logic elements, approximately 0.213 Mbits of on-chip RAM, and 488 user I/O pins, making it suitable for high-speed memory interfaces, protocol bridging, and embedded system functions that benefit from on-chip FIFOs and dual-port RAM.

Key Features

  • Core architecture  MultiCore architecture integrating look-up table (LUT) logic, product-term logic, and embedded system blocks (ESBs) for register-intensive and memory functions.
  • Logic capacity  16,640 logic elements delivering a system gate equivalence of approximately 1,052,000 gates.
  • Embedded memory  Approximately 212,992 bits (≈0.213 Mbits) of on-chip RAM and ESBs for implementing FIFOs, dual-port RAM, and CAM functions.
  • I/O and interface support  488 user I/O pins with MultiVolt I/O support and programmability; documented support for high-speed memory interfaces and PCI 3.3-V operation (datasheet series-level detail).
  • Clock management  Flexible clocking features in the APEX 20K family including up to four PLLs, a low-skew clock tree, up to eight global clocks, and programmable clock phase/delay features.
  • Power and supply  Internal supply voltage specified at 1.71 V to 1.89 V for this part number.
  • Package and temperature  652-BGA (45×45) surface-mount package; commercial operating temperature range 0 °C to 85 °C.
  • Standards and performance  Series-level features include support for LVDS, high-speed memory interfaces (DDR SDRAM, ZBT SRAM), and high-speed bidirectional I/O timing characteristics.
  • Compliance  RoHS compliant.

Typical Applications

  • Memory interface controllers  Implement DDR or ZBT memory controllers and on-chip FIFOs using ESBs and embedded RAM.
  • High-speed I/O bridging  Bridge between standards and voltage domains using MultiVolt I/O and differential signaling support.
  • Protocol and bus implementations  Implement PCI 3.3-V bus interfaces and custom protocol handlers leveraging the device’s I/O performance and clock resources.
  • Embedded system blocks  Use ESBs to create CAMs, dual-port RAM, and other subsystem functions directly on chip to reduce external components.

Unique Advantages

  • Highly integrated MultiCore architecture: Combines LUTs, product-term logic, and ESBs to consolidate register, combinatorial, and memory functions on a single device.
  • High logic and memory density: 16,640 logic elements and roughly 212,992 bits of embedded memory enable complex designs with reduced external devices.
  • Flexible, high-performance I/O: 488 user I/Os with MultiVolt support and documented high-speed interface capabilities simplify mixed-voltage system designs.
  • Advanced clocking features: Multiple PLLs, global clocks, and phase/delay control support precise timing and complex clock domain management.
  • Compact surface-mount package: 652-BGA (45×45) package provides a high-pin-count solution for dense board layouts while maintaining surface-mount assembly.
  • Commercial-grade and RoHS compliant: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance align with mainstream electronics manufacturing requirements.

Why Choose EP20K400EBC652-3N?

The EP20K400EBC652-3N places APEX-20KE family capabilities—high logic density, embedded memory, and flexible I/O—into a compact 652-BGA package for commercial designs. Its combination of 16,640 logic elements, approximately 212,992 bits of on-chip RAM, and extensive clock and I/O resources makes it a practical choice for developers implementing memory controllers, protocol bridges, and integrated system functions that benefit from on-chip FIFOs and fast local interconnect.

As part of the APEX 20K series, this device offers a clear path for scalable logic integration in board-level designs where consolidation of functions and flexible interface support reduce BOM and simplify system architecture.

Request a quote today to get pricing and availability for EP20K400EBC652-3N and to discuss how this APEX-20KE FPGA can fit your next design.

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