EP20K400EBC652-3
| Part Description |
APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 652-BGA |
|---|---|
| Quantity | 1,126 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 652-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 652-BGA | Number of I/O | 488 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1664 | Number of Logic Elements/Cells | 16640 | ||
| Number of Gates | 1052000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 212992 |
Overview of EP20K400EBC652-3 – APEX-20KE® Field Programmable Gate Array (FPGA)
The EP20K400EBC652-3 from Intel is an APEX-20KE family FPGA that combines LUT-based logic, product-term logic and embedded memory in a MultiCore architecture for system-on-a-programmable-chip (SOPC) applications. It targets high-density, configurable logic tasks where integrated memory, flexible I/O and advanced clock management enable consolidated system designs.
Typical use cases include high-speed interface controllers, embedded systems that require on-chip RAM and complex logic, and designs that need large I/O counts and a compact BGA package for surface-mount assembly.
Key Features
- Core Architecture MultiCore architecture integrating look‑up table (LUT) logic, product‑term logic and embedded system blocks (ESBs) for a mix of register‑intensive and combinatorial functions.
- Logic Capacity 16,640 logic elements delivering a programmable capacity equivalent to 1,052,000 gates for complex logic implementation.
- Embedded Memory Approximately 0.213 Mbits of on‑chip RAM (212,992 total RAM bits) to implement FIFOs, dual‑port RAM and content‑addressable memory structures without reducing available logic.
- I/O and Interface 488 user I/O pins with MultiVolt I/O support and built‑in features for high‑speed memory interfaces and peripheral connectivity.
- Clock and Timing Flexible clock management including up to four PLLs, a low‑skew clock tree and support for multiple global clock signals for deterministic timing control.
- Power and Voltage Internal supply operation in the specified range of 1.71 V to 1.89 V with features for low‑power operation and programmable ESB power modes.
- Package & Mounting 652‑BGA (45 × 45 mm) surface‑mount package, suitable for dense board layouts where high I/O count and compact footprint are required.
- Operating Range & Compliance Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for lead‑free assembly.
Typical Applications
- High‑speed Memory Interfaces Implement DDR and other external memory controllers using the embedded RAM and I/O features for low‑latency data paths.
- PCI and Peripheral Controllers Integrate PCI‑compatible peripherals and bus interfaces leveraging the device’s MultiVolt I/O support and high I/O count.
- Embedded SOPC Systems Build system‑level functions on a single FPGA platform using LUT logic plus ESBs for memory and custom logic blocks.
- High‑density Logic Consolidation Replace multiple discrete components by consolidating logic into 16,640 logic elements and abundant on‑chip memory.
Unique Advantages
- Highly integrated MultiCore architecture: Reduces design complexity by combining LUT logic, product‑term logic and embedded memory in a single device.
- Large programmable capacity: 16,640 logic elements and over one million gates worth of capacity support complex, densely packed logic designs.
- On‑chip embedded memory: Approximately 0.213 Mbits of RAM available for FIFOs, dual‑port RAM and CAM implementations without sacrificing logic resources.
- Flexible, high‑count I/O: 488 user I/O pins and MultiVolt I/O options enable diverse peripheral and memory interface support.
- Advanced clock management: Multiple PLLs and a low‑skew clock tree provide deterministic timing control for multi‑domain and high‑speed designs.
- Compact BGA package: 652‑BGA (45×45) surface‑mount package supports dense board integration while preserving high I/O availability.
Why Choose EP20K400EBC652-3?
The EP20K400EBC652-3 is positioned for designers who need a high‑density, commercially graded FPGA with substantial on‑chip memory and extensive I/O in a compact surface‑mount package. Its MultiCore architecture and embedded system blocks enable integration of memory‑centric and combinatorial logic functions on a single device.
This device delivers scalable logic and memory resources, flexible clocking and a high I/O count for applications that consolidate multiple functions into one programmable component while meeting commercial temperature and RoHS requirements.
Request a quote or submit a quote for EP20K400EBC652-3 to check pricing and availability.

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