EP20K400EBC652-3

IC FPGA 488 I/O 652BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 652-BGA

Quantity 1,126 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1052000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits212992

Overview of EP20K400EBC652-3 – APEX-20KE® Field Programmable Gate Array (FPGA)

The EP20K400EBC652-3 from Intel is an APEX-20KE family FPGA that combines LUT-based logic, product-term logic and embedded memory in a MultiCore architecture for system-on-a-programmable-chip (SOPC) applications. It targets high-density, configurable logic tasks where integrated memory, flexible I/O and advanced clock management enable consolidated system designs.

Typical use cases include high-speed interface controllers, embedded systems that require on-chip RAM and complex logic, and designs that need large I/O counts and a compact BGA package for surface-mount assembly.

Key Features

  • Core Architecture  MultiCore architecture integrating look‑up table (LUT) logic, product‑term logic and embedded system blocks (ESBs) for a mix of register‑intensive and combinatorial functions.
  • Logic Capacity  16,640 logic elements delivering a programmable capacity equivalent to 1,052,000 gates for complex logic implementation.
  • Embedded Memory  Approximately 0.213 Mbits of on‑chip RAM (212,992 total RAM bits) to implement FIFOs, dual‑port RAM and content‑addressable memory structures without reducing available logic.
  • I/O and Interface  488 user I/O pins with MultiVolt I/O support and built‑in features for high‑speed memory interfaces and peripheral connectivity.
  • Clock and Timing  Flexible clock management including up to four PLLs, a low‑skew clock tree and support for multiple global clock signals for deterministic timing control.
  • Power and Voltage  Internal supply operation in the specified range of 1.71 V to 1.89 V with features for low‑power operation and programmable ESB power modes.
  • Package & Mounting  652‑BGA (45 × 45 mm) surface‑mount package, suitable for dense board layouts where high I/O count and compact footprint are required.
  • Operating Range & Compliance  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for lead‑free assembly.

Typical Applications

  • High‑speed Memory Interfaces  Implement DDR and other external memory controllers using the embedded RAM and I/O features for low‑latency data paths.
  • PCI and Peripheral Controllers  Integrate PCI‑compatible peripherals and bus interfaces leveraging the device’s MultiVolt I/O support and high I/O count.
  • Embedded SOPC Systems  Build system‑level functions on a single FPGA platform using LUT logic plus ESBs for memory and custom logic blocks.
  • High‑density Logic Consolidation  Replace multiple discrete components by consolidating logic into 16,640 logic elements and abundant on‑chip memory.

Unique Advantages

  • Highly integrated MultiCore architecture: Reduces design complexity by combining LUT logic, product‑term logic and embedded memory in a single device.
  • Large programmable capacity: 16,640 logic elements and over one million gates worth of capacity support complex, densely packed logic designs.
  • On‑chip embedded memory: Approximately 0.213 Mbits of RAM available for FIFOs, dual‑port RAM and CAM implementations without sacrificing logic resources.
  • Flexible, high‑count I/O: 488 user I/O pins and MultiVolt I/O options enable diverse peripheral and memory interface support.
  • Advanced clock management: Multiple PLLs and a low‑skew clock tree provide deterministic timing control for multi‑domain and high‑speed designs.
  • Compact BGA package: 652‑BGA (45×45) surface‑mount package supports dense board integration while preserving high I/O availability.

Why Choose EP20K400EBC652-3?

The EP20K400EBC652-3 is positioned for designers who need a high‑density, commercially graded FPGA with substantial on‑chip memory and extensive I/O in a compact surface‑mount package. Its MultiCore architecture and embedded system blocks enable integration of memory‑centric and combinatorial logic functions on a single device.

This device delivers scalable logic and memory resources, flexible clocking and a high I/O count for applications that consolidate multiple functions into one programmable component while meeting commercial temperature and RoHS requirements.

Request a quote or submit a quote for EP20K400EBC652-3 to check pricing and availability.

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