EP20K400EBC652-2X

IC FPGA 488 I/O 652BGA
Part Description

APEX-20KE® Field Programmable Gate Array (FPGA) IC 488 212992 16640 652-BGA

Quantity 873 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package652-BGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case652-BGANumber of I/O488Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1664Number of Logic Elements/Cells16640
Number of Gates1052000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits212992

Overview of EP20K400EBC652-2X – APEX-20KE Field Programmable Gate Array, 652-BGA

The EP20K400EBC652-2X is an APEX-20KE series field programmable gate array (FPGA) manufactured by Intel. It implements a MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory for system-on-a-programmable-chip (SOPC) designs.

With 16,640 logic elements, 212,992 bits of on-chip RAM, and 488 user I/O pins in a 652‑BGA package, this commercial-grade FPGA targets high-density, memory‑enabled programmable logic applications requiring flexible I/O, multi-voltage interfacing, and advanced clock management.

Key Features

  • Core & Architecture  MultiCore architecture integrating LUT logic, product-term logic, and embedded system blocks (ESBs) to implement combinatorial and memory functions.
  • Logic Capacity  16,640 logic elements (approx. 1,052,000 system gates) for high-density logic implementations.
  • Embedded Memory  212,992 total RAM bits available for FIFOs, dual-port RAM and content-addressable memory (CAM) implementations using ESBs.
  • I/O & Interface Support  488 user I/O pins with MultiVolt I/O interface capability and programmable clamp and slew-rate control for interfacing with multiple voltage domains.
  • Clock & Timing  Flexible clock management with up to four PLLs, a built-in low‑skew clock tree, support for up to eight global clock signals, and programmable clock features (ClockLock, ClockBoost, ClockShift).
  • Memory & External Interfaces  Designed to support high-speed external memories including DDR SDRAM and ZBT SRAM, and compliant with PCI Local Bus for 3.3‑V operation.
  • Power & Voltage  Internal supply range listed at 1.71 V to 1.89 V; device supports MultiVolt I/O for 1.8 V, 2.5 V, 3.3 V and 5.0 V interfaces as described in the APEX-20K family features.
  • Package & Temperature  652‑BGA package (supplier device package 652‑BGA (45×45)); commercial operating temperature range 0 °C to 85 °C.
  • Standards & Performance  Advanced I/O standard support (including LVDS and other high‑speed signaling), bidirectional I/O performance and features to optimize signal timing and noise.
  • Environmental  RoHS compliant.

Typical Applications

  • Embedded Systems / SOPC Implementations  Use the device’s MultiCore architecture and embedded system blocks to integrate logic and on‑chip memory for compact system designs.
  • High‑Speed Memory Interfaces  Implement DDR SDRAM and ZBT SRAM controllers leveraging the device’s embedded memory and I/O feature set for external memory support.
  • Bus and Peripheral Interfaces  Deploy PCI‑compatible interfaces and high‑speed I/O to bridge peripheral buses or implement custom interface logic.
  • Signal Processing & Data Path Logic  Benefit from dedicated arithmetic carry chains and hierarchical interconnect for predictable timing in combinatorial and register‑intensive functions.

Unique Advantages

  • Highly integrated MultiCore architecture: Combines LUTs, product‑term logic and ESBs to reduce external components and simplify memory‑centric designs.
  • Substantial logic and memory capacity: 16,640 logic elements and 212,992 RAM bits provide the density needed for complex, memory‑enabled logic functions.
  • Extensive I/O flexibility: 488 user I/O pins and MultiVolt support allow interfacing across multiple voltage domains without redesigning the core logic.
  • Advanced clocking features: Up to four PLLs, multiple global clocks and programmable clock controls support complex timing and clock domain management.
  • Commercial temperature and package options: 652‑BGA packaging and 0 °C to 85 °C operating range suit a broad set of commercial electronic applications.
  • RoHS compliant: Meets environmental restrictions for lead‑free manufacturing flows.

Why Choose EP20K400EBC652-2X?

The EP20K400EBC652-2X positions itself as a high‑density, memory‑enabled FPGA option within the APEX‑20KE family, offering a balance of logic capacity, embedded RAM, and flexible I/O in a compact 652‑BGA package. Its MultiCore architecture and comprehensive clocking features make it suitable for designs that combine significant logic resources with memory and high‑speed interface requirements.

This device is well suited to development teams and procurement focused on commercial‑grade programmable logic solutions that require on‑chip memory, multi‑voltage I/O capability, and advanced timing controls, with RoHS compliance for manufacturing compatibility.

Request a quote or submit a pricing inquiry to get lead time and availability for EP20K400EBC652-2X.

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