EP20K400EFC672-1X

The EP20K400EFC672-1X is an Intel APEX-20KE series field programmable gate array supplied in a 672-ball BGA package. It implements a MultiCore architecture combining look-up table (LUT) logic and embedded system blocks (ESBs) to integrate logic and memory functions on a single device.

With 16,640 logic elements, approximately 0.213 Mbits of embedded RAM, and 488 user I/O pins, this device targets system-level designs that require high logic density, flexible I/O and integrated memory for embedded buffering and interface tasks. It is offered in a commercial-grade temperature range with RoHS compliance.

Key Features

• Core architecture (MultiCore): Combines LUT-based logic and ESB blocks for register‑intensive and memory functions, enabling system-on-a-programmable-chip (SOPC) style integration.
• Logic capacity: 16,640 logic elements and approximately 1,052,000 system gates provide substantial logic resource for complex designs.
• Embedded memory: Total on-chip RAM of 212,992 bits (approximately 0.213 Mbits) for FIFOs, dual-port RAM and other memory-intensive functions.
• I/O and interface flexibility: 488 user I/O pins with MultiVolt I/O interface support, enabling direct interfacing with multiple I/O voltage domains as described in the APEX 20K family documentation.
• Clock management: Flexible clock circuitry including up to four PLLs, a built-in low-skew clock tree and multiple global clocks to support synchronous system designs.
• Package and mounting: 672-BBGA (supplier package 672-FBGA, 27×27) surface-mount package suited for compact board layouts.
• Power and operating range: Core voltage supply range 1.71 V to 1.89 V and commercial operating temperature range 0 °C to 85 °C; device is RoHS compliant.

Typical Applications

• PCI and peripheral controllers: Use in PCI-compliant 3.3-V peripheral logic and bus interfacing where flexible I/O and high logic density are required.
• High-speed memory interfaces: Implementation of controllers and buffers for DDR SDRAM and other high-speed external memories leveraging ESB-based RAM and FIFOs.
• Embedded system integration: SOPC-style integration of custom logic, embedded memory and clock management for compact system designs.
• High-performance I/O aggregation: LVDS and other high-speed I/O standards support for multi-channel data capture and aggregation tasks.

Unique Advantages

• High integration density: 16,640 logic elements and over one million system gates enable large, complex designs without fragmenting logic across multiple devices.
• On-chip memory resources: Approximately 0.213 Mbits of embedded RAM and ESB resources reduce external memory dependence for buffering and temporary storage.
• Flexible I/O signaling: Extensive MultiVolt I/O support and 488 user I/Os simplify interfacing with different peripheral voltage domains and high-speed buses.
• Robust clock features: Multiple PLLs and a low-skew clock tree provide the timing control needed for synchronous, high-speed logic and memory interfaces.
• Compact package option: 672-BBGA (27×27) offers a high-pin-count, surface-mount solution for space-constrained boards.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose EP20K400EFC672-1X?

The EP20K400EFC672-1X combines substantial logic capacity, integrated RAM resources and flexible I/O to address system designs that require on-chip memory, multiple voltage-domain interfacing and sophisticated clock management. Its MultiCore architecture and ESB support enable consolidated implementations of register‑heavy logic and memory functions within a single FPGA device.

This device is well suited for engineering teams building commercial-grade embedded systems, interface controllers and high-speed I/O aggregation solutions that benefit from high logic density, programmable memory blocks and comprehensive clock control while maintaining a compact BGA footprint.

Request a quote or contact sales to discuss availability, pricing and how the EP20K400EFC672-1X can fit into your next design.